# UCC5310MCDR

**Texas Instruments** · Isolators - Gate Drivers · SOIC-8

UCC5310MCDR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC1 | power_in | Input-side bias supply, recommended 3 V to 15 V (VCC1 to GND1), with a low-ESR/ESL decoupling capacitor placed as close to the device as possible. |
| 2 | IN+ | input | Non-inverting gate-drive control input with CMOS thresholds (typical high threshold 0.55 × VCC1, low threshold 0.45 × VCC1); it is internally pulled low when left open and must never exceed VCC1. |
| 3 | IN- | input | Inverting gate-drive control input with CMOS thresholds; it is internally pulled high (128 kΩ) when left open, and TI recommends tying it to GND1 or VCC1 if not used. |
| 4 | GND1 | power_in | Input-side ground; all input-side signals are referenced to this pin. |
| 5 | VCC2 | power_in | Positive output-side supply rail, recommended 13.2 V to 33 V (VCC2 to VEE2) for UCC53x0 with a decoupling capacitor connected to VEE2 placed close to the pin. |
| 6 | OUT | output | Gate-drive output of the UCC5310M (single-ended, rail-to-rail between VEE2 and VCC2) that drives the IGBT or MOSFET gate. |
| 7 | CLAMP | input | Active Miller clamp input on the UCC53x0M that sinks Miller current to hold the gate below its turn-on threshold (clamped below 2 V in the off state) and is connected to the power device gate with a low-impedance path to VEE2. |
| 8 | VEE2 | power_in | Negative output supply rail, which is the ground reference for the output stage on S and M versions; decoupling capacitor should be placed close to the pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## CAD (KiCad official)

- Symbol: `UCC5310MCDR`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `ucc5310mcdr-etched.step` / `ucc5310mcdr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ucc5310mcdr.step` / `ucc5310mcdr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/ucc5350) (57 pp, sha256 `84c7492975118783`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ucc5310mcdr-datasheet.pdf)