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Ray ucc2895qdwrq1: specified limits as data (metadata.characteristics, 60 rows from the datasheet) 175443a 25d ago

UCC2895QDWRQ1

Texas Instruments · DC-DC Converters · SOIC-20-300mil

UCC2895QDWRQ1 from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 EAN input Inverting input to the error amplifier, which must be kept below 3.6 V for proper operation.
2 EAOUT bidirectional Error amplifier output, internally clamped to the soft-start voltage and feeding the PWM and no-load comparators, which shut the outputs down below 500 mV and re-enable them above 600 mV.
3 RAMP input Inverting input of the PWM comparator, receiving the CT waveform in voltage or average-current mode or the current signal plus slope compensation in peak-current mode.
4 REF output 5-V ±1.2% reference that can supply up to 5 mA to external loads, with no more than 1 µF of total capacitance on this pin.
5 GND power_in Ground for all circuits except the output stages, and must be electrically tied to PGND.
6 SYNC bidirectional Oscillator synchronization pin that outputs the internal clock or accepts an external clock, with a level-sensitive input threshold of 1.9 V low and 2.1 V high.
7 CT input Oscillator timing capacitor charged by a programmed current to a 2.35 V sawtooth peak, with CT ranging from 100 pF to 880 pF.
8 RT input Oscillator timing resistor that sets the switching frequency, with RT ranging from 40 kΩ to 120 kΩ.
9 DELAB input Programs the dead time between OUTA and OUTB, can source approximately 1 mA maximum, is clamped to a minimum of 0.5 V, and tying it to REF defeats the programmed delay.
10 DELCD input Programs the dead time between OUTC and OUTD, can source approximately 1 mA maximum, is clamped to a minimum of 0.5 V, and tying it to REF defeats the programmed delay.
11 ADS input Adaptive delay set input, which must be limited to between 0 V and 2.5 V and must be less than or equal to CS.
12 CS input Current-sense input for cycle-by-cycle current limiting, with an overcurrent threshold of 2.5 V that initiates a soft stop.
13 OUTD output 100-mA CMOS driver output for the second half-bridge, phase shifted with respect to OUTB.
14 OUTC output 100-mA CMOS driver output for the second half-bridge, phase shifted with respect to OUTA.
15 VDD power_in Power-supply input that must be bypassed with a minimum of 1 µF low-ESR, low-ESL capacitor to ground.
16 PGND power_in Output-stage power ground that carries high current, so its board traces must be low impedance and electrically tied to GND.
17 OUTB output 100-mA CMOS driver output for the first half-bridge, fully complementary to OUTA assuming no programmed delay.
18 OUTA output 100-mA CMOS driver output for the first half-bridge, operating near 50% duty cycle at one-half the oscillator frequency.
19 SS/DISB input Combined soft-start and disable pin, where forcing it below 0.5 V disables the chip and it sources current equal to IRT during soft start.
20 EAP input Noninverting input to the error amplifier, which must be kept below 3.6 V for proper operation.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-20-300mil
Category Power Management (PMIC)
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage range (EAP, EAN, EAOUT, RAMP, SYNC, ADS, CS, SS/DISB), lower limit -0.3 V Upper limit printed as REF + 0.3 V 2
Drive output voltage range (OUTA, OUTB, OUTC, OUTD), lower limit -0.3 V Upper limit printed as VDD + 0.3 V 2
Supply voltage VDD 17 V IDD < 10 mA 2
Supply current IDD 30 mA 2
Reference current IREF 15 mA 2
Output current IO 100 mA 2
Power dissipation PD 650 mW TA = 25°C 2
Storage temperature range Tstg -65 150 °C 2
Junction temperature range TJ -55 150 °C 2
Electrostatic discharge protection, human-body model (HBM) 800 V Human-body model (HBM) 2
Supply voltage VDD 10 16.5 V 2
Reference bypass capacitor CREF 0.1 4.7 μF 2
Delay resistor RDEL_AB, RDEL_CD 2.5 40 kΩ 3
Operating junction temperature TJ -55 125 °C 3
Start-up voltage threshold UVLO(on) 10.2 11 11.8 V 3
Minimum operating voltage after start-up UVLO(off) 8.2 9 9.8 V 3
Hysteresis UVLO(hys) 1 2 3 V 3
Start-up current ISTART 150 250 μA VDD = 8 V 3
Operating current IDD 5 6 mA 3
VDD clamp voltage VDD_CLAMP 16.5 17.5 18.5 V IDD = 10 mA 3
Output voltage VREF 4.94 5 5.06 V TJ = 25°C 3
Output voltage VREF 4.85 5 5.15 V 10 V < VDD < VDD_CLAMP, 0 mA < IREF < 5 mA, TJ = –40°C to 125°C 3
Short-circuit current ISC 10 20 mA REF = 0 V, TJ = 25°C 3
Common-mode input voltage -0.1 3.6 V 3
Offset voltage VIO -7 7 mV 3
High-level output voltage VOH_EAOUT 4 4.5 5 V EAP – EAN = 500 mV, IEAOUT = –0.5 mA 3
Low-level output voltage VOL_EAOUT 0 0.2 0.4 V EAP – EAN = –500 mV, IEAOUT = 0.5 mA 3
Error amplifier output source current ISOURCE 1 1.5 mA EAP – EAN = 500 mV, EAOUT = 2.5 V 3
Error amplifier output sink current ISINK 2.5 4.5 mA EAP – EAN = –500 mV, EAOUT = 2.5 V 3
Open-loop dc gain AVOL 75 85 dB 3
Unity gain bandwidth GBW 5 7 MHz 3
Slew rate 1.5 2.2 V/μs 1 V < EAN < 0 V, EAP = 500 mV, 0.5 V < EAOUT < 3 V 3
No-load comparator turn-off threshold 0.45 0.5 0.55 V 3
No-load comparator turn-on threshold 0.55 0.6 0.69 V 3
No-load comparator hysteresis 0.035 0.1 0.165 V 3
Frequency fOSC 473 500 527 kHz TJ = 25°C 3
Frequency total variation 2.5 5 % Over line and temperature 3
High-level input voltage, SYNC VOH_SYNC 4.1 4.5 5 V ISYNC = –400 μA, VCT = 2.6 V 3
SYNC output pulse width 85 135 ns LOADSYNC = 3.9 kΩ and 30 pF in parallel 3
Timing resistor voltage VRT 2.9 3 3.1 V 3
Timing capacitor peak voltage VCT(peak) 2.25 2.35 2.55 V 3
Timing capacitor valley voltage VCT(valley) 0 0.2 0.4 V 3
Peak current threshold 1.9 2 2.1 V 4
Overcurrent threshold 2.4 2.5 2.6 V 4
Current sense to output delay 75 110 ns 0 V ≤ CS ≤ 2.3 V, DELAB = DELCD = REF 4
Soft-start source current ISOURCE -40 -35 -30 μA SS/DISB = 3 V, CS = 1.9 V 5
Soft-start sink current ISINK 325 350 375 μA SS/DISB = 3 V, CS = 2.6 V 5
Soft-start/disable comparator threshold 0.44 0.5 0.56 V 5
DELAB/DELCD output voltage V 0.45 0.5 0.55 V ADS = CS = 0 V 5
DELAB/DELCD output voltage V 1.9 2 2.1 V ADS = 0 V, CS = 2 V 5
Output delay tDELAY 450 560 620 ns ADS = CS = 0 V 5
High-level output voltage (all outputs) VOH 250 420 mV IOUT = –10 mA, VDD to output 5
Low-level output voltage (all outputs) VOL 150 270 mV IOUT = 10 mA 5
Rise time tR 20 35 35 ns CLOAD = 100 pF 5
Fall time tF 20 35 35 ns CLOAD = 100 pF 5
EAOUT to RAMP input offset voltage 0.7 0.85 1.05 V RAMP = 0 V, DELAB = DELCD = REF 6
Minimum phase shift 0 0.85 1.5 % RAMP = 0 V, EAOUT = 650 mV (OUTA to OUTC, OUTB to OUTD) 6
Delay tDELAY 70 120 120 ns 0 V < RAMP < 2.5 V, EAOUT = 1.2 V, DELAB = DELCD = REF 6
RAMP bias current IR(bias) -5 5 μA RAMP < 5 V, CT = 2.2 V 6
RAMP sink current IR(sink) 11 19 19 mA RAMP = 5 V, CT = 2.6 V 6

CAD (KiCad official)

  • Symbol: UCC2895QDWRQ1
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: ucc2895qdwrq1-etched.step / ucc2895qdwrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ucc2895qdwrq1.step / ucc2895qdwrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (25 pp, sha256 5b333e1d4ff20c03, retrieved 2026-10-11, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF