# TX50N06

**XDS** · MOSFETs · TO-252

TX50N06 from XDS, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate terminal of the N-channel MOSFET, with a maximum gate-source voltage of ±20 V and a gate threshold of 1.4 V min to 2.5 V max at ID=250 µA. |
| 2 | Drain | passive | Drain terminal (also the exposed tab), rated 60 V drain-source and 50 A continuous at Tc=25°C, with 90 A pulsed. |
| 3 | Source | passive | Source terminal of the N-channel MOSFET, with an RDS(on) of 20 mΩ max at VGS=10 V, ID=20 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | XDS |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 60 |  |  | V | VGS=0V, ID=250μA | 2 |
| Gate Threshold Voltage | VGS(th) | 1.4 |  | 2.5 | V | VDS=VGS, ID=250μA | 2 |
| Gate-Body Leakage | IGSS | -100 |  | 100 | nA | VDS=0V, VGS=±20V | 2 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | μA | VDS=60V, VGS=0V | 2 |
| Drain-Source On-Resistance | RDS(ON) |  | 14 | 20 | mΩ | VGS=10V, ID=20A | 2 |
| Diode Forward Voltage | VSD |  |  | 1.2 | V | IS=20A, VGS=0V | 2 |
| Drain-Source Voltage | VDSS |  |  | 60 | V | Tc=25℃ unless otherwise noted | 1 |
| Gate-Source Voltage | VGSS | -20 |  | 20 | V |  | 1 |
| Continuous Drain Current | ID |  |  | 50 | A | Tc=25℃ | 1 |
| Continuous Drain Current | ID |  |  | 35.4 | A | Tc=100℃ | 1 |
| Pulsed Drain Current | IDM |  |  | 90 | A |  | 1 |
| Power Dissipation | PD |  |  | 85 | W | Tc=25℃ | 1 |
| Single pulse avalanche energy | EAS |  |  | 245 |  | L=0.5mH, VDD=30V, RG=25Ω, TJ=25℃ | 1 |
| Operating Junction and Storage Temperature Range | TJ,Tstg | -55 |  | 175 | ℃ |  | 1 |
| Thermal resistance, case to sink | RthCS |  | 0.5 |  | ℃/W |  | 1 |
| Thermal resistance junction to case | RthJC |  | 3.3 |  | ℃/W |  | 1 |
| Thermal resistance junction to ambient | RthJA |  | 110 |  | ℃/W |  | 1 |

## CAD (KiCad official)

- Symbol: `TX50N06`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `tx50n06-etched.step` / `tx50n06-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tx50n06.step` / `tx50n06.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [XDS datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588907447917924352) (5 pp, sha256 `a005e05b68a0dabb`, retrieved 2026-10-10, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tx50n06-datasheet.pdf)