# TVS3300DRVR

**Texas Instruments** · Surge Protection Devices (SPDs) · WSON-6(2x2)

TVS3300DRVR from Texas Instruments, in a WSON-6(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the bidirectional-free unidirectional clamp; the datasheet assigns pins 1, 2 and 3 to GND on the 6-pin SON. |
| 2 | GND | power_in | Ground pin of the clamp; the datasheet assigns pins 1, 2 and 3 to GND on the 6-pin SON. |
| 3 | GND | power_in | Ground pin of the clamp; the datasheet assigns pins 1, 2 and 3 to GND on the 6-pin SON. |
| 4 | IN | input | ESD and surge protected channel; keep VIN within the recommended 0 V to 33 V range (VRWM 33 V). |
| 5 | IN | input | ESD and surge protected channel; keep VIN within the recommended 0 V to 33 V range (VRWM 33 V). |
| 6 | IN | input | ESD and surge protected channel; keep VIN within the recommended 0 V to 33 V range (VRWM 33 V). |
| 7 | GND | power_in | Exposed thermal pad, ground; it must be soldered to the printed circuit board for thermal and mechanical performance. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-6(2x2) |
| Category | Circuit Protection |
| Pins | 7 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum surge current, IEC 61000-4-5 (8/20 µs) |  |  |  | 35 | A |  | 5 |
| Maximum surge power, IEC 61000-4-5 (8/20 µs) |  |  |  | 1330 | W |  | 5 |
| Maximum surge current, IEC 61643-321 (10/1000 µs) - DRV |  |  |  | 3.5 | A |  | 5 |
| Maximum surge power, IEC 61643-321 (10/1000 µs) - DRV |  |  |  | 125 | W |  | 5 |
| Maximum forward surge current, IEC 61000-4-5 (8/20 µs) |  |  |  | 50 | A |  | 5 |
| Maximum forward surge power, IEC 61000-4-5 (8/20 µs) |  |  |  | 80 | W |  | 5 |
| Maximum forward surge current, IEC 61643-321 (10/1000 µs) |  |  |  | 23 | A |  | 5 |
| Maximum forward surge power, IEC 61643-321 (10/1000 µs) |  |  |  | 60 | W |  | 5 |
| EFT protection, IEC 61000-4-4 |  |  |  | 80 | A |  | 5 |
| DC breakdown current - DRV | IBR |  |  | 10 | mA |  | 5 |
| DC forward current | IF |  |  | 500 | mA |  | 5 |
| Ambient operating temperature | TA | -40 |  | 125 | °C |  | 5 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 5 |
| Leakage current at 27°C | ILEAK |  | 19 | 150 | nA | Measured at VIN = VRWM, TA = 27°C | 6 |
| Leakage current at 85°C | ILEAK |  | 28 | 600 | nA | Measured at VIN = VRWM, TA = 85°C | 6 |
| Forward voltage | VF | 0.25 | 0.5 | 0.65 | V | IIN = 1 mA from GND to IO | 6 |
| Break-down voltage | VBR | 34 | 35.8 | 39 | V | IIN = 1 mA from IO to GND | 6 |
| Forward clamp voltage | VFCLAMP | 1 | 2 | 5 | V | 35 A IEC 61000-4-5 Surge (8/20 µs) from GND to IO, 27°C | 6 |
| Clamp voltage at 15 A | VCLAMP | 34 | 37 | 40 | V | 15 A IEC 61000-4-5 Surge (8/20 µs) from IO to GND, VIN = 0 V before surge, 27°C | 6 |
| Clamp voltage at 35 A | VCLAMP | 34 | 38 | 40 | V | 35 A IEC 61000-4-5 Surge (8/20 µs) from IO to GND, VIN = 0 V before surge, 27°C | 6 |
| 8/20 µs surge dynamic resistance | RDYN |  | 40 | 60 | mΩ | Calculated from VCLAMP at 15 A and 30 A surge current levels, 27°C | 6 |
| Input pin capacitance | CIN | 110 | 130 | 150 | pF | VIN = 12 V, f = 1 MHz, 30 mVpp, IO to GND | 6 |
| Maximum slew rate at 27°C | SR |  |  | 2.5 | V/µs | 0-VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, 27°C | 6 |
| Maximum slew rate at 105°C | SR |  |  | 0.7 | V/µs | 0-VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, 105°C | 6 |
| Reverse stand-off voltage | VRWM |  | 33 |  | V |  | 5 |
| Junction-to-ambient thermal resistance - DRV | RθJA |  | 70.4 |  | °C/W |  | 5 |
| Junction-to-case (top) thermal resistance - DRV | RθJC(top) |  | 73.7 |  | °C/W |  | 5 |
| Junction-to-board thermal resistance - DRV | RθJB |  | 40 |  | °C/W |  | 6 |
| Junction-to-top characterization parameter - DRV | YJT |  | 2.2 |  | °C/W |  | 6 |
| Junction-to-board characterization parameter - DRV | YJB |  | 40.3 |  | °C/W |  | 6 |
| Junction-to-case (bottom) thermal resistance - DRV | RθJC(bot) |  | 11 |  | °C/W |  | 6 |

## CAD (KiCad official)

- Symbol: `TVS3300DRVR`
- Footprint: `Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm`
- 3D model: WSON-6(2x2) (KiCad packages3D, STEP)
- 3D model files: `tvs3300drvr-etched.step` / `tvs3300drvr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tvs3300drvr.step` / `tvs3300drvr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/ds/symlink/tvs3300.pdf) (27 pp, sha256 `7aba01b6941d10c1`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tvs3300drvr-datasheet.pdf)