component
TVS3300DRVR
Public Made by Adomby adom
Texas Instruments Surge Protection Devices (SPDs), WSON-6(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 21d ago |
| viewers | 21d ago |
| package.json | 21d ago |
| page.json | 21d ago |
| README.md | 21d ago |
| tvs3300drvr-etched.glb | 21d ago |
| tvs3300drvr-etched.step | 21d ago |
| tvs3300drvr-hero.glb | 21d ago |
| tvs3300drvr-hero.overlay.json | 21d ago |
| tvs3300drvr.glb | 21d ago |
| tvs3300drvr.kicad_mod | 21d ago |
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| tvs3300drvr.step | 21d ago |
TVS3300DRVR
Texas Instruments · Surge Protection Devices (SPDs) · WSON-6(2x2)
TVS3300DRVR from Texas Instruments, in a WSON-6(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground pin of the bidirectional-free unidirectional clamp; the datasheet assigns pins 1, 2 and 3 to GND on the 6-pin SON. |
| 2 | GND | power_in | Ground pin of the clamp; the datasheet assigns pins 1, 2 and 3 to GND on the 6-pin SON. |
| 3 | GND | power_in | Ground pin of the clamp; the datasheet assigns pins 1, 2 and 3 to GND on the 6-pin SON. |
| 4 | IN | input | ESD and surge protected channel; keep VIN within the recommended 0 V to 33 V range (VRWM 33 V). |
| 5 | IN | input | ESD and surge protected channel; keep VIN within the recommended 0 V to 33 V range (VRWM 33 V). |
| 6 | IN | input | ESD and surge protected channel; keep VIN within the recommended 0 V to 33 V range (VRWM 33 V). |
| 7 | GND | power_in | Exposed thermal pad, ground; it must be soldered to the printed circuit board for thermal and mechanical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-6(2x2) |
| Category | Circuit Protection |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum surge current, IEC 61000-4-5 (8/20 µs) | 35 | A | 5 | ||||
| Maximum surge power, IEC 61000-4-5 (8/20 µs) | 1330 | W | 5 | ||||
| Maximum surge current, IEC 61643-321 (10/1000 µs) - DRV | 3.5 | A | 5 | ||||
| Maximum surge power, IEC 61643-321 (10/1000 µs) - DRV | 125 | W | 5 | ||||
| Maximum forward surge current, IEC 61000-4-5 (8/20 µs) | 50 | A | 5 | ||||
| Maximum forward surge power, IEC 61000-4-5 (8/20 µs) | 80 | W | 5 | ||||
| Maximum forward surge current, IEC 61643-321 (10/1000 µs) | 23 | A | 5 | ||||
| Maximum forward surge power, IEC 61643-321 (10/1000 µs) | 60 | W | 5 | ||||
| EFT protection, IEC 61000-4-4 | 80 | A | 5 | ||||
| DC breakdown current - DRV | IBR | 10 | mA | 5 | |||
| DC forward current | IF | 500 | mA | 5 | |||
| Ambient operating temperature | TA | -40 | 125 | °C | 5 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| Leakage current at 27°C | ILEAK | 19 | 150 | nA | Measured at VIN = VRWM, TA = 27°C | 6 | |
| Leakage current at 85°C | ILEAK | 28 | 600 | nA | Measured at VIN = VRWM, TA = 85°C | 6 | |
| Forward voltage | VF | 0.25 | 0.5 | 0.65 | V | IIN = 1 mA from GND to IO | 6 |
| Break-down voltage | VBR | 34 | 35.8 | 39 | V | IIN = 1 mA from IO to GND | 6 |
| Forward clamp voltage | VFCLAMP | 1 | 2 | 5 | V | 35 A IEC 61000-4-5 Surge (8/20 µs) from GND to IO, 27°C | 6 |
| Clamp voltage at 15 A | VCLAMP | 34 | 37 | 40 | V | 15 A IEC 61000-4-5 Surge (8/20 µs) from IO to GND, VIN = 0 V before surge, 27°C | 6 |
| Clamp voltage at 35 A | VCLAMP | 34 | 38 | 40 | V | 35 A IEC 61000-4-5 Surge (8/20 µs) from IO to GND, VIN = 0 V before surge, 27°C | 6 |
| 8/20 µs surge dynamic resistance | RDYN | 40 | 60 | mΩ | Calculated from VCLAMP at 15 A and 30 A surge current levels, 27°C | 6 | |
| Input pin capacitance | CIN | 110 | 130 | 150 | pF | VIN = 12 V, f = 1 MHz, 30 mVpp, IO to GND | 6 |
| Maximum slew rate at 27°C | SR | 2.5 | V/µs | 0-VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, 27°C | 6 | ||
| Maximum slew rate at 105°C | SR | 0.7 | V/µs | 0-VRWM rising edge, sweep rise time and measure slew rate when IPEAK = 1 mA, 105°C | 6 | ||
| Reverse stand-off voltage | VRWM | 33 | V | 5 | |||
| Junction-to-ambient thermal resistance - DRV | RθJA | 70.4 | °C/W | 5 | |||
| Junction-to-case (top) thermal resistance - DRV | RθJC(top) | 73.7 | °C/W | 5 | |||
| Junction-to-board thermal resistance - DRV | RθJB | 40 | °C/W | 6 | |||
| Junction-to-top characterization parameter - DRV | YJT | 2.2 | °C/W | 6 | |||
| Junction-to-board characterization parameter - DRV | YJB | 40.3 | °C/W | 6 | |||
| Junction-to-case (bottom) thermal resistance - DRV | RθJC(bot) | 11 | °C/W | 6 |
CAD (KiCad official)
- Symbol:
TVS3300DRVR - Footprint:
Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm - 3D model: WSON-6(2x2) (KiCad packages3D, STEP)
- 3D model files:
tvs3300drvr-etched.step/tvs3300drvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tvs3300drvr.step/tvs3300drvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (27 pp, sha256
7aba01b6941d10c1, retrieved 2026-10-17, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).