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Ray Publish 0.1.0 23c72ef 13d ago

TSP50N20M

Truesemi · MOSFETs · TO-220

TSP50N20M from Truesemi, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with VGS rated ±20 V maximum and threshold VGS(th) of 2 V to 4 V at ID = 250 µA.
2 D passive Drain; drain-source voltage rated 200 V with 50 A continuous drain current and 200 A pulsed.
3 S passive Source; connects to the body diode anode, with continuous source current of 50 A.

Key specifications

Parameter Value
Manufacturer Truesemi
Package TO-220
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 200 V VGS = 0V, ID = 250µA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS = 200V, VGS = 0V, TJ = 25ºC 2
Gate-Source Leakage IGSS -100 100 nA VGS = ±20V, VDS = 0V 2
Gate-Source Threshold Voltage VGS(th) 2 4 V VDS = VGS, ID = 250µA 2
Drain-Source On-Resistance RDS(on) 0.041 0.046 Ω VGS = 10V, ID = 25A 2
Continuous Source Current ISD 50 A Integral PN-diode in MOSFET 2
Pulsed Source Current ISM 200 A 2
Body Forward Voltage VSD 1.5 V IS = 20A, VGS = 0V 2
Drain-Source Voltage VDSS 200 V TC = 25ºC 1
Continuous Drain Current ID 50 A TC = 25ºC 1
Pulsed Drain Current IDM 200 A 1
Gate-Source Voltage VGSS -20 20 V 1
Power Dissipation PD 250 W TC = 25ºC 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 ºC 1
Derating Factor above 25°C 2.4 W/ºC above 25°C 1
Thermal Resistance, Junction-to-Case RthJC 0.5 ºC/W 1
Thermal Resistance, Junction-to-Ambient RthJA 62.5 ºC/W 1

CAD (KiCad official)

  • Symbol: TSP50N20M
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: tsp50n20m-etched.step / tsp50n20m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tsp50n20m.step / tsp50n20m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Truesemi datasheet (9 pp, sha256 ace6ad9bc9f7858e, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF