component
TSP40N30M
Public Made by Adomby adom
Truesemi MOSFETs, TO-220. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TSP40N30M
Truesemi · MOSFETs · TO-220
TSP40N30M from Truesemi, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±30 V, with threshold of 2.0 to 4.0 V at ID = 250 uA. |
| 2 | D | passive | Drain; rated 300 V drain-source with 40 A continuous drain current at TC = 25 C (the tab is not described in the datasheet text). |
| 3 | S | passive | Source; body diode continuous forward current is 40 A and pulsed 120 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Truesemi |
| Package | TO-220 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 300 | V | TC=25℃ | 1 | ||
| Gate-Source Voltage | VGS | -30 | 30 | V | TC=25℃ | 1 | |
| Drain Current | ID | 40 | A | TC = 25℃ | 1 | ||
| Drain Current | ID | 25 | A | TC = 100℃ | 1 | ||
| Pulsed Drain Current | IDM | 120 | A | TC=25℃ | 1 | ||
| Single Pulsed Avalanche Energy | EAS | 820 | mJ | L=1mH, IAS=37A, VDD=50V, RG=25Ω, Starting TJ=25°C | 1 | ||
| Repetitive Avalanche Energy | EAR | 15 | mJ | Pulse width limited by safe operating area | 1 | ||
| Repetitive Avalanche current | IAR | 37 | A | Pulse width limited by safe operating area | 1 | ||
| Power Dissipation | PD | 150 | W | TC = 25℃ | 1 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance, Junction-to-Case | RθJC | 0.83 | ℃/W | 1 | |||
| Thermal Resistance, Junction-to-Ambient | RθJA | 62.5 | ℃/W | 1 | |||
| Gate Threshold Voltage | VGS(th) | 2 | 4 | V | VDS = VGS, ID = 250 uA | 2 | |
| Static Drain-Source On-Resistance | RDS(ON) | 0.12 | 0.145 | Ω | VGS = 10 V, ID = 20A | 2 | |
| Drain-Source Breakdown Voltage | BVDSS | 300 | V | VGS = 0 V, ID = 250 uA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | uA | VDS = 300 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 100 | uA | VDS =300 V, TC = 125℃ | 2 | ||
| Gate-Body Leakage Current, Forward | IGSSF | 100 | nA | VGS = 30 V, VDS = 0 V | 2 | ||
| Gate-Body Leakage Current, Reverse | IGSSR | -100 | nA | VGS =- 30 V, VDS = 0 V | 2 | ||
| Continuous Source-Drain Diode Forward Current | IS | 40 | A | 2 | |||
| Pulsed Source-Drain Diode Forward Current | ISM | 120 | A | 2 | |||
| Source-Drain Diode Forward Voltage | VSD | 1.4 | V | ISD =40A, VGS = 0 V | 2 | ||
| Forward transfer conductance | gfs | 25 | S | VDS = 10V, ID = 20A | 2 | ||
| Input Capacitance | Ciss | 2958 | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 2 | ||
| Output Capacitance | Coss | 282 | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 31 | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 2 | ||
| Turn-On Time | td(on) | 45 | ns | VDS = 200 V, ID = 20 A, RG = 25 Ω | 2 | ||
| Turn-On Rise Time | tr | 30 | ns | VDS = 200 V, ID = 20 A, RG = 25 Ω | 2 | ||
| Turn-Off Delay Time | td(off) | 162 | ns | VDS = 200 V, ID = 20 A, RG = 25 Ω | 2 | ||
| Turn-Off Fall Time | tf | 38 | ns | VDS = 200 V, ID = 20 A, RG = 25 Ω | 2 | ||
| Total Gate Charge | Qg | 60 | nC | VDS = 240 V, ID =40A, VGS = 10 V | 2 | ||
| Gate-Source Charge | Qgs | 15 | nC | VDS = 240 V, ID =40A, VGS = 10 V | 2 | ||
| Gate-Drain Charge | Qgd | 22 | nC | VDS = 240 V, ID =40A, VGS = 10 V | 2 | ||
| Reverse Recovery Time | trr | 321 | ns | ISD = 40A, VGS = 0 V, diF/dt = 100 A/μs | 2 | ||
| Reverse Recovery Charge | Qrr | 2.6 | uC | ISD = 40A, VGS = 0 V, diF/dt = 100 A/μs | 2 |
CAD (KiCad official)
- Symbol:
TSP40N30M - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220 (KiCad packages3D, STEP)
- 3D model files:
tsp40n30m-etched.step/tsp40n30m-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tsp40n30m.step/tsp40n30m.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Truesemi datasheet (6 pp, sha256
098f2fa3e4438500, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TSP40N30M
**Truesemi** · MOSFETs · TO-220
TSP40N30M from Truesemi, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±30 V, with threshold of 2.0 to 4.0 V at ID = 250 uA. |
| 2 | D | passive | Drain; rated 300 V drain-source with 40 A continuous drain current at TC = 25 C (the tab is not described in the datasheet text). |
| 3 | S | passive | Source; body diode continuous forward current is 40 A and pulsed 120 A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Truesemi |
| Package | TO-220 |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | 300 | V | TC=25℃ | 1 |
| Gate-Source Voltage | VGS | -30 | | 30 | V | TC=25℃ | 1 |
| Drain Current | ID | | | 40 | A | TC = 25℃ | 1 |
| Drain Current | ID | | | 25 | A | TC = 100℃ | 1 |
| Pulsed Drain Current | IDM | | | 120 | A | TC=25℃ | 1 |
| Single Pulsed Avalanche Energy | EAS | | | 820 | mJ | L=1mH, IAS=37A, VDD=50V, RG=25Ω, Starting TJ=25°C | 1 |
| Repetitive Avalanche Energy | EAR | | | 15 | mJ | Pulse width limited by safe operating area | 1 |
| Repetitive Avalanche current | IAR | | | 37 | A | Pulse width limited by safe operating area | 1 |
| Power Dissipation | PD | | | 150 | W | TC = 25℃ | 1 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 | | 150 | ℃ | | 1 |
| Thermal Resistance, Junction-to-Case | RθJC | | | 0.83 | ℃/W | | 1 |
| Thermal Resistance, Junction-to-Ambient | RθJA | | | 62.5 | ℃/W | | 1 |
| Gate Threshold Voltage | VGS(th) | 2 | | 4 | V | VDS = VGS, ID = 250 uA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) | | 0.12 | 0.145 | Ω | VGS = 10 V, ID = 20A | 2 |
| Drain-Source Breakdown Voltage | BVDSS | 300 | | | V | VGS = 0 V, ID = 250 uA | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | uA | VDS = 300 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 100 | uA | VDS =300 V, TC = 125℃ | 2 |
| Gate-Body Leakage Current, Forward | IGSSF | | | 100 | nA | VGS = 30 V, VDS = 0 V | 2 |
| Gate-Body Leakage Current, Reverse | IGSSR | | | -100 | nA | VGS =- 30 V, VDS = 0 V | 2 |
| Continuous Source-Drain Diode Forward Current | IS | | | 40 | A | | 2 |
| Pulsed Source-Drain Diode Forward Current | ISM | | | 120 | A | | 2 |
| Source-Drain Diode Forward Voltage | VSD | | | 1.4 | V | ISD =40A, VGS = 0 V | 2 |
| Forward transfer conductance | gfs | | 25 | | S | VDS = 10V, ID = 20A | 2 |
| Input Capacitance | Ciss | | 2958 | | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 2 |
| Output Capacitance | Coss | | 282 | | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 31 | | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 2 |
| Turn-On Time | td(on) | | 45 | | ns | VDS = 200 V, ID = 20 A, RG = 25 Ω | 2 |
| Turn-On Rise Time | tr | | 30 | | ns | VDS = 200 V, ID = 20 A, RG = 25 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 162 | | ns | VDS = 200 V, ID = 20 A, RG = 25 Ω | 2 |
| Turn-Off Fall Time | tf | | 38 | | ns | VDS = 200 V, ID = 20 A, RG = 25 Ω | 2 |
| Total Gate Charge | Qg | | 60 | | nC | VDS = 240 V, ID =40A, VGS = 10 V | 2 |
| Gate-Source Charge | Qgs | | 15 | | nC | VDS = 240 V, ID =40A, VGS = 10 V | 2 |
| Gate-Drain Charge | Qgd | | 22 | | nC | VDS = 240 V, ID =40A, VGS = 10 V | 2 |
| Reverse Recovery Time | trr | | 321 | | ns | ISD = 40A, VGS = 0 V, diF/dt = 100 A/μs | 2 |
| Reverse Recovery Charge | Qrr | | 2.6 | | uC | ISD = 40A, VGS = 0 V, diF/dt = 100 A/μs | 2 |
## CAD (KiCad official)
- Symbol: `TSP40N30M`
- Footprint: `Package_TO_SOT_THT:TO-220-3_Vertical`
- 3D model: TO-220 (KiCad packages3D, STEP)
- 3D model files: `tsp40n30m-etched.step` / `tsp40n30m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tsp40n30m.step` / `tsp40n30m.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Truesemi datasheet](docs/tsp40n30m-datasheet.pdf) (6 pp, sha256 `098f2fa3e4438500`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tsp40n30m-datasheet.pdf)