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TSD05CDYFR
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TEXAS INSTRUMENTS ESD And Surge Protection (TVS/ESD), SOD-323. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TSD05CDYFR
TEXAS INSTRUMENTS · ESD And Surge Protection (TVS/ESD) · SOD-323
TSD05CDYFR from TEXAS INSTRUMENTS, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IO | bidirectional | Protected I/O channel; when used as an IO, pin 2 must be grounded. |
| 2 | IO | bidirectional | Protected I/O channel; when used as an IO, pin 1 must be grounded. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TEXAS INSTRUMENTS |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse standoff voltage | VRWM | -5.5 | 5.5 | V | IIO < 50nA, over operating temperature range | 5 | |
| Breakdown voltage | VBR | 7 | 8 | 9 | V | IIO = 1mA, IO to GND and GND to IO | 5 |
| Reverse leakage current | ILEAK | 5 | 10 | nA | VIO = 5.5V, IO to GND or GND to IO | 5 | |
| Surge clamping voltage, tp = 8/20µs, IPP = 24 A | VCLAMP | 10.7 | 13.8 | V | IPP = 24A, IO to GND or GND to IO | 5 | |
| Surge clamping voltage, tp = 8/20µs, IPP = 30 A | VCLAMP | 11.5 | 15 | V | IPP = 30 A, IO to GND or GND to IO | 5 | |
| TLP clamping voltage, tp = 100ns | VCLAMP | 9.3 | V | IPP = 16A, IO to GND or GND to IO | 5 | ||
| Dynamic resistance | RDYN | 0.15 | Ω | Least-squares fit of TLP characteristic between I = 10A and I = 20A (value printed once for IO to GND / GND to IO) | 5 | ||
| Line capacitance | CL | 4 | 7 | pF | VIO = 0V; f = 1MHz, IO to GND | 5 | |
| Peak pulse power | PPP | 400 | W | 25°C, IEC 61000-4-5 tp 8/20µs | 3 | ||
| Peak pulse current | IPP | 30 | A | 25°C, IEC 61000-4-5 tp 8/20µs | 3 | ||
| Operating ambient temperature | TA | -55 | 150 | °C | 3 | ||
| Storage temperature | Tstg | -65 | 155 | °C | 3 | ||
| Operating ambient temperature range | TA | -55 | 150 | °C | Natural ventilation | 4 | |
| Junction-to-ambient thermal resistance | RθJA | 672 | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 230.5 | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 | ||
| Junction-to-board thermal resistance | RθJB | 541.4 | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 | ||
| Junction-to-top characterization parameter | ΨJT | 64.4 | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 | ||
| Junction-to-board characterization parameter | ΨJB | 527.5 | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 |
CAD (KiCad official)
- Symbol:
TSD05CDYFR - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
tsd05cdyfr-etched.step/tsd05cdyfr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tsd05cdyfr.step/tsd05cdyfr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TEXAS INSTRUMENTS datasheet (22 pp, sha256
f72246e1e640079a, retrieved 2026-10-23, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TSD05CDYFR
**TEXAS INSTRUMENTS** · ESD And Surge Protection (TVS/ESD) · SOD-323
TSD05CDYFR from TEXAS INSTRUMENTS, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IO | bidirectional | Protected I/O channel; when used as an IO, pin 2 must be grounded. |
| 2 | IO | bidirectional | Protected I/O channel; when used as an IO, pin 1 must be grounded. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TEXAS INSTRUMENTS |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse standoff voltage | VRWM | -5.5 | | 5.5 | V | IIO < 50nA, over operating temperature range | 5 |
| Breakdown voltage | VBR | 7 | 8 | 9 | V | IIO = 1mA, IO to GND and GND to IO | 5 |
| Reverse leakage current | ILEAK | | 5 | 10 | nA | VIO = 5.5V, IO to GND or GND to IO | 5 |
| Surge clamping voltage, tp = 8/20µs, IPP = 24 A | VCLAMP | | 10.7 | 13.8 | V | IPP = 24A, IO to GND or GND to IO | 5 |
| Surge clamping voltage, tp = 8/20µs, IPP = 30 A | VCLAMP | | 11.5 | 15 | V | IPP = 30 A, IO to GND or GND to IO | 5 |
| TLP clamping voltage, tp = 100ns | VCLAMP | | 9.3 | | V | IPP = 16A, IO to GND or GND to IO | 5 |
| Dynamic resistance | RDYN | | 0.15 | | Ω | Least-squares fit of TLP characteristic between I = 10A and I = 20A (value printed once for IO to GND / GND to IO) | 5 |
| Line capacitance | CL | | 4 | 7 | pF | VIO = 0V; f = 1MHz, IO to GND | 5 |
| Peak pulse power | PPP | | | 400 | W | 25°C, IEC 61000-4-5 tp 8/20µs | 3 |
| Peak pulse current | IPP | | | 30 | A | 25°C, IEC 61000-4-5 tp 8/20µs | 3 |
| Operating ambient temperature | TA | -55 | | 150 | °C | | 3 |
| Storage temperature | Tstg | -65 | | 155 | °C | | 3 |
| Operating ambient temperature range | TA | -55 | | 150 | °C | Natural ventilation | 4 |
| Junction-to-ambient thermal resistance | RθJA | | 672 | | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 230.5 | | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 |
| Junction-to-board thermal resistance | RθJB | | 541.4 | | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 |
| Junction-to-top characterization parameter | ΨJT | | 64.4 | | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 |
| Junction-to-board characterization parameter | ΨJB | | 527.5 | | °C/W | DYF (SOD-323) 2-pin, TSD05C column | 4 |
## CAD (KiCad official)
- Symbol: `TSD05CDYFR`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `tsd05cdyfr-etched.step` / `tsd05cdyfr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tsd05cdyfr.step` / `tsd05cdyfr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TEXAS INSTRUMENTS datasheet](https://www.ti.com.cn/cn/lit/ds/symlink/tsd05c.pdf?ts=1739434284921&ref_url=https%253A%252F%252Fwww.ti.com.cn%252Fsitesearch%252Fzh-cn%252Fdocs%252Funiversalsearch.tsp%253FlangPref%253Dzh-CN%2526searchTerm%253DTSD05CDYFR%2526nr%253D16) (22 pp, sha256 `f72246e1e640079a`, retrieved 2026-10-23, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tsd05cdyfr-datasheet.pdf)