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TSD05CDYFR

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TEXAS INSTRUMENTS ESD And Surge Protection (TVS/ESD), SOD-323. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TSD05CDYFR

TEXAS INSTRUMENTS · ESD And Surge Protection (TVS/ESD) · SOD-323

TSD05CDYFR from TEXAS INSTRUMENTS, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IO bidirectional Protected I/O channel; when used as an IO, pin 2 must be grounded.
2 IO bidirectional Protected I/O channel; when used as an IO, pin 1 must be grounded.

Key specifications

Parameter Value
Manufacturer TEXAS INSTRUMENTS
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse standoff voltage VRWM -5.5 5.5 V IIO < 50nA, over operating temperature range 5
Breakdown voltage VBR 7 8 9 V IIO = 1mA, IO to GND and GND to IO 5
Reverse leakage current ILEAK 5 10 nA VIO = 5.5V, IO to GND or GND to IO 5
Surge clamping voltage, tp = 8/20µs, IPP = 24 A VCLAMP 10.7 13.8 V IPP = 24A, IO to GND or GND to IO 5
Surge clamping voltage, tp = 8/20µs, IPP = 30 A VCLAMP 11.5 15 V IPP = 30 A, IO to GND or GND to IO 5
TLP clamping voltage, tp = 100ns VCLAMP 9.3 V IPP = 16A, IO to GND or GND to IO 5
Dynamic resistance RDYN 0.15 Ω Least-squares fit of TLP characteristic between I = 10A and I = 20A (value printed once for IO to GND / GND to IO) 5
Line capacitance CL 4 7 pF VIO = 0V; f = 1MHz, IO to GND 5
Peak pulse power PPP 400 W 25°C, IEC 61000-4-5 tp 8/20µs 3
Peak pulse current IPP 30 A 25°C, IEC 61000-4-5 tp 8/20µs 3
Operating ambient temperature TA -55 150 °C 3
Storage temperature Tstg -65 155 °C 3
Operating ambient temperature range TA -55 150 °C Natural ventilation 4
Junction-to-ambient thermal resistance RθJA 672 °C/W DYF (SOD-323) 2-pin, TSD05C column 4
Junction-to-case (top) thermal resistance RθJC(top) 230.5 °C/W DYF (SOD-323) 2-pin, TSD05C column 4
Junction-to-board thermal resistance RθJB 541.4 °C/W DYF (SOD-323) 2-pin, TSD05C column 4
Junction-to-top characterization parameter ΨJT 64.4 °C/W DYF (SOD-323) 2-pin, TSD05C column 4
Junction-to-board characterization parameter ΨJB 527.5 °C/W DYF (SOD-323) 2-pin, TSD05C column 4

CAD (KiCad official)

  • Symbol: TSD05CDYFR
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: tsd05cdyfr-etched.step / tsd05cdyfr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tsd05cdyfr.step / tsd05cdyfr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TEXAS INSTRUMENTS datasheet (22 pp, sha256 f72246e1e640079a, retrieved 2026-10-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF