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TSC2011HYDT

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STMicroelectronics Current Sense Amplifiers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Generated by kicad-footprint-generator · KiCad file format 20260206
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tsc2011hydt-etched.glb tsc2011hydt: factory component page (tier=lcsc) · Ray 18d ago
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TSC2011HYDT

STMicroelectronics · Current Sense Amplifiers · SOIC-8

TSC2011HYDT from STMicroelectronics, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN - input Negative input of the bidirectional current sense amplifier, rated for a common-mode voltage of -20 to +70 V in operation (absolute maximum VICM of -25 to 76 V, with input current limited to 5 mA).
2 GND power_in Ground, the network ground terminal to which all voltages except the differential input voltage are referenced.
3 VREF2 input Reference voltage 2 for output offset adjustment, with an adjustment range of 0 to VCC V and pin voltage limited to GND - 0.3 V to VCC + 0.3 V.
4 SHDN input Shutdown control pin that puts the device into shutdown mode, where quiescent current drops to 20 µA.
5 OUT output Amplifier output, with pin voltage limited to GND - 0.3 V to VCC + 0.3 V.
6 VCC power_in Supply voltage, specified for operation from 2.7 to 5.5 V (absolute maximum -0.3 to 7 V).
7 VREF1 input Reference voltage 1 for output offset adjustment, with an adjustment range of 0 to VCC V and pin voltage limited to GND - 0.3 V to VCC + 0.3 V.
8 IN + input Positive input of the bidirectional current sense amplifier, rated for a common-mode voltage of -20 to +70 V in operation (absolute maximum VICM of -25 to 76 V, with input current limited to 5 mA).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOIC-8
Category Amplifiers/Comparators
Pins 8

CAD (KiCad official)

  • Symbol: TSC2011HYDT
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: tsc2011hydt-etched.step / tsc2011hydt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tsc2011hydt.step / tsc2011hydt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (50 pp, sha256 855b0563a260e9fd, retrieved 2026-10-10, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF