component
TSC2011HYDT
Public Made by Adomby adom
STMicroelectronics Current Sense Amplifiers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTSC2011HYDT
STMicroelectronics · Current Sense Amplifiers · SOIC-8
TSC2011HYDT from STMicroelectronics, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN - | input | Negative input of the bidirectional current sense amplifier, rated for a common-mode voltage of -20 to +70 V in operation (absolute maximum VICM of -25 to 76 V, with input current limited to 5 mA). |
| 2 | GND | power_in | Ground, the network ground terminal to which all voltages except the differential input voltage are referenced. |
| 3 | VREF2 | input | Reference voltage 2 for output offset adjustment, with an adjustment range of 0 to VCC V and pin voltage limited to GND - 0.3 V to VCC + 0.3 V. |
| 4 | SHDN | input | Shutdown control pin that puts the device into shutdown mode, where quiescent current drops to 20 µA. |
| 5 | OUT | output | Amplifier output, with pin voltage limited to GND - 0.3 V to VCC + 0.3 V. |
| 6 | VCC | power_in | Supply voltage, specified for operation from 2.7 to 5.5 V (absolute maximum -0.3 to 7 V). |
| 7 | VREF1 | input | Reference voltage 1 for output offset adjustment, with an adjustment range of 0 to VCC V and pin voltage limited to GND - 0.3 V to VCC + 0.3 V. |
| 8 | IN + | input | Positive input of the bidirectional current sense amplifier, rated for a common-mode voltage of -20 to +70 V in operation (absolute maximum VICM of -25 to 76 V, with input current limited to 5 mA). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | STMicroelectronics |
| Package | SOIC-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
CAD (KiCad official)
- Symbol:
TSC2011HYDT - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
tsc2011hydt-etched.step/tsc2011hydt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tsc2011hydt.step/tsc2011hydt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: STMicroelectronics datasheet (50 pp, sha256
855b0563a260e9fd, retrieved 2026-10-10, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).