# TRF37C73IDSGT

**Texas Instruments** · RF Amplifiers · WSON-8-EP(2x2)

TRF37C73IDSGT from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | DC bias supply pin; the recommended supply is 3 V to 3.45 V with 3.3 V nominal. |
| 2 | RFIN | input | RF input, connected to the RF source through a DC-blocking capacitor and internally matched to 50 Ω. |
| 3 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 4 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 5 | PWDN | input | Power-down control: high puts the device in power-down state, while low or NC keeps it active, with an internal pulldown resistor to GND. |
| 6 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 7 | RFOUT | output | RF output and DC bias (VCC), fed from the supply through an RF choke inductor and connected to the load through a DC-blocking capacitor, internally matched to 50 Ω. |
| 8 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 9 | GND | power_in | RF and DC ground PowerPAD; connect to the PCB ground plane and solder the pad to the board for thermal and mechanical performance. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | RF And Wireless |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Total supply current | ICC |  | 55 | 65 | mA |  | 5 |
| Power down current | ICC |  |  | 125 | µA | PWDN = High | 5 |
| Frequency range |  | 1 |  | 6000 | MHz |  | 5 |
| High level input level | VIH | 2 |  |  | V | PWDN pin | 5 |
| Low level input level | VIL |  |  | 0.8 | V | PWDN pin | 5 |
| High level input current | IIH |  |  | 30 | µA | PWDN pin | 5 |
| Low level input current | IIL |  |  | 1 | µA | PWDN pin | 5 |
| Turn-on time | tON |  |  | 0.6 | µs | 50% TTL to 90% POUT | 5 |
| Turn-off time | tOFF |  |  | 1.4 | µs | 50% TTL to 10% POUT | 5 |
| Supply Voltage | VCC | 3 | 3.3 | 3.45 | V |  | 4 |
| Operating junction temperature | TJ | -40 |  | 125 | °C |  | 4 |
| Supply Input voltage |  | -0.3 |  | 3.6 | V |  | 4 |
| Input Power |  |  |  | 10 | dBm |  | 4 |
| Operating virtual junction temperature range |  | -40 |  | 150 | °C |  | 4 |
| Storage temperature range | TSTG | -65 |  | 150 | °C |  | 4 |
| Electrostatic discharge, human body model | VESD | -1 |  | 1 | kV | HBM, all pins | 4 |
| Electrostatic discharge, charged device model | VESD | -1 |  | 1 | kV | CDM, all pins | 4 |
| Junction-to-ambient thermal resistance | RθJA |  | 79.3 |  | °C/W | DSG 8 pins | 4 |
| Junction-to-case (top) thermal resistance | RθJCtop |  | 110 |  | °C/W | DSG 8 pins | 4 |
| Junction-to-board thermal resistance | RθJB |  | 49 |  | °C/W | DSG 8 pins | 4 |
| Junction-to-top characterization parameter | ψJT |  | 6 |  | °C/W | DSG 8 pins | 4 |
| Junction-to-board characterization parameter | ψJB |  | 49.4 |  | °C/W | DSG 8 pins | 4 |
| Junction-to-case (bottom) thermal resistance | RθJCbot |  | 19.2 |  | °C/W | DSG 8 pins | 4 |
| Power dissipation | Pdiss |  | 0.182 |  | W |  | 5 |
| Small signal gain | G |  | 18.5 |  | dB | fRF = 400 MHz | 5 |
| Small signal gain | G |  | 17.5 |  | dB | fRF = 2000 MHz | 5 |
| Small signal gain | G |  | 16.5 |  | dB | fRF = 3000 MHz | 5 |
| Small signal gain | G |  | 15 |  | dB | fRF = 4000 MHz | 5 |
| Small signal gain | G |  | 13 |  | dB | fRF = 5000 MHz | 5 |
| Small signal gain | G |  | 11 |  | dB | fRF = 6000 MHz | 5 |
| Output 1dB compression point | OP1dB |  | 16.5 |  | dBm | At 2000 MHz | 5 |
| Output 3rd order intercept point | OIP3 |  | 28.5 |  | dBm | At 2000 MHz, 2-tone 10 MHz apart | 5 |
| Noise figure | NF |  | 3.5 |  | dB | At 2000 MHz | 5 |
| Input return loss | R(LI) |  | 19 |  | dB | At 2000 MHz | 5 |
| Output return loss | R(LO) |  | 13 |  | dB | At 2000 MHz | 5 |

## CAD (KiCad official)

- Symbol: `TRF37C73IDSGT`
- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`
- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `trf37c73idsgt-etched.step` / `trf37c73idsgt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `trf37c73idsgt.step` / `trf37c73idsgt.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/trf37c73.pdf) (21 pp, sha256 `0242ad23f3230d8c`, retrieved 2026-11-05, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/trf37c73idsgt-datasheet.pdf)