component
TRF37C73IDSGT
Public Made by Adomby adom
Texas Instruments RF Amplifiers, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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TRF37C73IDSGT
Texas Instruments · RF Amplifiers · WSON-8-EP(2x2)
TRF37C73IDSGT from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | DC bias supply pin; the recommended supply is 3 V to 3.45 V with 3.3 V nominal. |
| 2 | RFIN | input | RF input, connected to the RF source through a DC-blocking capacitor and internally matched to 50 Ω. |
| 3 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 4 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 5 | PWDN | input | Power-down control: high puts the device in power-down state, while low or NC keeps it active, with an internal pulldown resistor to GND. |
| 6 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 7 | RFOUT | output | RF output and DC bias (VCC), fed from the supply through an RF choke inductor and connected to the load through a DC-blocking capacitor, internally matched to 50 Ω. |
| 8 | NC | unconnected | No electrical connection; connect the pad to GND for board-level reliability. |
| 9 | GND | power_in | RF and DC ground PowerPAD; connect to the PCB ground plane and solder the pad to the board for thermal and mechanical performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | RF And Wireless |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Total supply current | ICC | 55 | 65 | mA | 5 | ||
| Power down current | ICC | 125 | µA | PWDN = High | 5 | ||
| Frequency range | 1 | 6000 | MHz | 5 | |||
| High level input level | VIH | 2 | V | PWDN pin | 5 | ||
| Low level input level | VIL | 0.8 | V | PWDN pin | 5 | ||
| High level input current | IIH | 30 | µA | PWDN pin | 5 | ||
| Low level input current | IIL | 1 | µA | PWDN pin | 5 | ||
| Turn-on time | tON | 0.6 | µs | 50% TTL to 90% POUT | 5 | ||
| Turn-off time | tOFF | 1.4 | µs | 50% TTL to 10% POUT | 5 | ||
| Supply Voltage | VCC | 3 | 3.3 | 3.45 | V | 4 | |
| Operating junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Supply Input voltage | -0.3 | 3.6 | V | 4 | |||
| Input Power | 10 | dBm | 4 | ||||
| Operating virtual junction temperature range | -40 | 150 | °C | 4 | |||
| Storage temperature range | TSTG | -65 | 150 | °C | 4 | ||
| Electrostatic discharge, human body model | VESD | -1 | 1 | kV | HBM, all pins | 4 | |
| Electrostatic discharge, charged device model | VESD | -1 | 1 | kV | CDM, all pins | 4 | |
| Junction-to-ambient thermal resistance | RθJA | 79.3 | °C/W | DSG 8 pins | 4 | ||
| Junction-to-case (top) thermal resistance | RθJCtop | 110 | °C/W | DSG 8 pins | 4 | ||
| Junction-to-board thermal resistance | RθJB | 49 | °C/W | DSG 8 pins | 4 | ||
| Junction-to-top characterization parameter | ψJT | 6 | °C/W | DSG 8 pins | 4 | ||
| Junction-to-board characterization parameter | ψJB | 49.4 | °C/W | DSG 8 pins | 4 | ||
| Junction-to-case (bottom) thermal resistance | RθJCbot | 19.2 | °C/W | DSG 8 pins | 4 | ||
| Power dissipation | Pdiss | 0.182 | W | 5 | |||
| Small signal gain | G | 18.5 | dB | fRF = 400 MHz | 5 | ||
| Small signal gain | G | 17.5 | dB | fRF = 2000 MHz | 5 | ||
| Small signal gain | G | 16.5 | dB | fRF = 3000 MHz | 5 | ||
| Small signal gain | G | 15 | dB | fRF = 4000 MHz | 5 | ||
| Small signal gain | G | 13 | dB | fRF = 5000 MHz | 5 | ||
| Small signal gain | G | 11 | dB | fRF = 6000 MHz | 5 | ||
| Output 1dB compression point | OP1dB | 16.5 | dBm | At 2000 MHz | 5 | ||
| Output 3rd order intercept point | OIP3 | 28.5 | dBm | At 2000 MHz, 2-tone 10 MHz apart | 5 | ||
| Noise figure | NF | 3.5 | dB | At 2000 MHz | 5 | ||
| Input return loss | R(LI) | 19 | dB | At 2000 MHz | 5 | ||
| Output return loss | R(LO) | 13 | dB | At 2000 MHz | 5 |
CAD (KiCad official)
- Symbol:
TRF37C73IDSGT - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
trf37c73idsgt-etched.step/trf37c73idsgt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);trf37c73idsgt.step/trf37c73idsgt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (21 pp, sha256
0242ad23f3230d8c, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).