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TPS62841DGRR

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Texas Instruments DC-DC Converters, HVSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TPS62841DGRR

Texas Instruments · DC-DC Converters · HVSSOP-8

TPS62841DGRR from Texas Instruments, in a HVSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOS input Output voltage sense pin for the internal feedback divider and regulation loop; it discharges VOUT through an internal MOSFET when the converter is disabled and must be connected directly to the output capacitor with a short trace.
2 SW power_out Switch pin connected to the internal MOSFET switches, where the inductor must be connected.
3 MODE input A low level enables Power-Save Mode with automatic PFM/PWM transition and a high level forces PWM mode; the pin can be toggled during operation and must be terminated.
4 VSET input A resistor to GND sets the output voltage when the converter is enabled, and the external parasitic capacitance at this pin must stay at or below 100 pF.
5 EN input Enable pin: a high level enables the device and a low level turns it off, with an internal pulldown resistor that is active whenever the device is not regulating.
6 VIN power_in Power supply pin with a 1.8 V to 6.5 V input range that requires a 4.7-µF ceramic input capacitor placed close to the pin.
7 NC unconnected Not connected internally; do not connect this pin.
8 GND power_in Ground supply pin that must be connected close to the GND terminals of the input and output capacitors.
9 EP power_in Exposed thermal pad (PowerPAD) that must be connected to GND.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-8
Category Power Management (PMIC)
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Quiescent current into VIN (device not switching, TJ = -40°C to 85°C) IQ_VIN 36 360 nA EN = VIN, IOUT = 0µA, VOUT = 1.55V or 1.8V, device not switching, TJ = -40°C to 85°C 7
Quiescent current into VOS (device not switching, TJ = -40°C to 85°C) IQ_VOS 56 170 nA EN = VIN, IOUT = 0µA, VOUT = 1.55V or 1.8V, device not switching, TJ = -40°C to 85°C 7
Quiescent current into VOS (EN, STOP = VIN, 3V < VOUT < 3.3V) IQ_VOS 5 100 nA EN, STOP = VIN, 3V < VOUT < 3.3V, TJ = -40°C to 85°C 7
STOP mode quiescent current into VIN IQ_VIN_STOP 70 175 µA STOP = High, VOUT = 1.8V, TJ = -40°C to 85°C 7
Shutdown current into VIN ISD 25 300 nA EN = GND, VSET = GND, TJ = -40°C to 85°C 7
Undervoltage lockout threshold, rising VIN VTH_UVLO+ 1.72 1.8 V Rising VIN 7
Undervoltage lockout threshold, falling VIN VTH_UVLO- 1.45 1.75 V Falling VIN 7
High level input voltage (EN, MODE, STOP) VIH_TH 1.1 V 7
Low level input voltage (EN, MODE, STOP) VIL_TH 0.4 V 7
Input bias current, MODE input IIN 1 25 nA MODE input, TJ = -40°C to 85°C 7
Internal pull-down resistance (EN, STOP inputs) RPD 200 450 kΩ EN, STOP inputs 7
High-side MOSFET on-resistance (DGR package) RDS(ON) 460 630 mΩ VIN = 3.6V, I = 200mA, TJ = -40°C to 85°C 8
High-side MOSFET on-resistance (DGR package) RDS(ON) 370 495 mΩ VIN = 5V, I = 200mA, TJ = -40°C to 85°C 8
Low-side MOSFET on-resistance (DGR package) RDS(ON) 200 270 mΩ VIN = 3.6V, I = 200mA, TJ = -40°C to 85°C 8
Low-side MOSFET on-resistance (DGR package) RDS(ON) 165 210 mΩ VIN = 5V, I = 200mA, TJ = -40°C to 85°C 8
Soft-start switch current limit ILIMF_SS 0.15 0.225 0.3 A 8
High-side MOSFET switch current limit ILIMF 1 1.2 1.4 A 8
Output discharge current into VOS pin IDISCHARGE_VOS 16 35 44 mA EN = GND, VOUT = 1.8V, TJ = -40°C to 85°C, over VIN range 8
Output voltage accuracy (VOUT >= 1.8 V) VOUT -1.5 0 1.5 % PWM Mode, IOUT = 0 mA, VOUT >= 1.8 V 8
Output voltage accuracy (VOUT <= 1.55 V) VOUT -2 0 2 % PWM Mode, IOUT = 0 mA, VOUT <= 1.55 V 8
Reduced current limit soft-start timeout tSS_ILIMF 700 1200 µs 8
Supply voltage VIN 1.8 6.5 V 6
Effective inductance L 1.51 2.2 2.9 µH 6
Effective output capacitance COUT 3 10 40 µF 6
Effective input capacitance CIN 1 4.7 µF 6
External parasitic capacitance at VSET pin CVSET 100 pF 6
Nominal resistance range for external voltage selection resistor (E96 series) RSET 0.909 267 kΩ E96 resistor series 6
External voltage selection resistor tolerance RSET -1 0 1 % 6
External voltage selection resistor temperature coefficient RSET -200 0 200 ppm/°C 6
Operating junction temperature range TJ -40 125 °C 6
Pin voltage VIN VIN -0.3 7 V 6
Pin voltage SW (DC) SW -0.3 V DC; max printed as VIN + 0.3 V 6
Pin voltage SW (AC) SW -2 8.5 V less than 10ns, while switching 6
Pin voltage EN, MODE, STOP EN, MODE, STOP -0.3 6.5 V 6
Pin voltage VSET VSET -0.3 V Max printed as VIN + 0.3 V with <3.6 V 6
Pin voltage VOS VOS -0.3 3.7 V 6
Operating junction temperature TJ -40 150 °C 6
Storage temperature Tstg -65 150 °C 6
Junction-to-ambient thermal resistance (DGR, JEDEC PCB 51-7) RθJA 54.4 °C/W 8-pin DGR package 6
Junction-to-case (top) thermal resistance (DGR) RθJC(top) 58.1 °C/W 8-pin DGR package 6
Junction-to-board thermal resistance (DGR) RθJB 25.9 °C/W 8-pin DGR package 6
Junction-to-top characterization parameter (DGR) ψJT 1.2 °C/W 8-pin DGR package 6
Junction-to-board characterization parameter (DGR) ψJB 25.9 °C/W 8-pin DGR package 6
Junction-to-case (bottom) thermal resistance (DGR) RθJC(bot) 11.7 °C/W 8-pin DGR package 6

CAD (KiCad official)

  • Symbol: TPS62841DGRR
  • Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • 3D model: HVSSOP-8, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tps62841dgrr-etched.step / tps62841dgrr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps62841dgrr.step / tps62841dgrr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (45 pp, sha256 da218f3f1c6e6463, retrieved 2026-10-09, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF