# TPS62263DRVR

**Texas Instruments** · DC-DC Converters · WSON-6-EP(2x2)

TPS62263DRVR from Texas Instruments, in a WSON-6-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SW | output | Switch pin connected to the internal MOSFET switches; the external inductor connects between this terminal and the output capacitor, with absolute maximum voltage on SW of -0.3 V to 7 V. |
| 2 | MODE | input | Available only on the WSON package; MODE high forces fixed-frequency PWM operation, MODE low enables power save mode with automatic transition from PFM to fixed-frequency PWM, and the voltage at MODE is limited to -0.3 V to VIN + 0.3 V (7 V maximum). |
| 3 | FB | input | Feedback pin for the internal regulation loop; for the fixed-output TPS62263 (2.5 V), connect this pin directly to the output capacitor. |
| 4 | EN | input | Enable pin: pulling it low forces the device into shutdown mode and pulling it high enables the device; this pin must be terminated, with voltage limited to -0.3 V to VIN + 0.3 V (7 V maximum). |
| 5 | VIN | power_in | VIN power supply pin; recommended supply voltage is 2 V to 6 V, with absolute maximum input voltage of 7 V. |
| 6 | GND | power_in | GND supply pin (network ground reference for all voltages). |
| 7 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-6-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 7 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN Input voltage range | VIN | 2.3 |  | 6 | V |  | 5 |
| Output current | IOUT |  |  | 600 | mA | VIN 2.5 V to 6 V | 5 |
| Output current | IOUT |  |  | 300 | mA | VIN 2.3 V to 2.5 V | 5 |
| Output current | IOUT |  |  | 150 | mA | VIN 2 V to 2.3 V | 5 |
| Shutdown current | ISD |  | 0.1 | 1 | µA | EN = GND | 5 |
| High level input voltage, EN, MODE | VIH | 1 |  |  | V | 2 V ≤ VIN ≤ 6 V; printed max is VIN (not numeric) | 5 |
| Low level input voltage, EN, MODE | VIL | 0 |  | 0.4 | V | 2 V ≤ VIN ≤ 6 V | 5 |
| Input bias current, EN, MODE | IIN |  | 0.01 | 1 | µA | EN, MODE = GND or VIN | 5 |
| High side MOSFET on-resistance | RDS(on) |  | 240 | 480 | mΩ | VIN = VGS = 3.6 V, TA = 25°C | 5 |
| Low side MOSFET on-resistance | RDS(on) |  | 185 | 380 | mΩ | VIN = VGS = 3.6 V, TA = 25°C | 5 |
| Forward current limit MOSFET high side and low side | ILIMF | 0.8 | 1 | 1.2 | A | VIN = VGS = 3.6 V | 5 |
| Oscillator frequency | fSW | 2 | 2.25 | 2.5 | MHz | 2 V ≤ VIN ≤ 6 V | 5 |
| Feedback voltage PWM mode, fixed output voltage versions | VFB | -1.5 | 0 | 1.5 | % | MODE = VIN, PWM operation, VFB = VOUT, 2.5 V ≤ VIN ≤ 6 V, 0 mA ≤ IOUT ≤ 600 mA | 5 |
| Leakage current into SW pin | Ilkg |  | 0.1 | 1 | µA | VIN = 3.6 V, VIN = VOUT = VSW, EN = GND | 5 |
| Operating ambient temperature | TA | -40 |  | 85 | °C |  | 4 |
| Operating junction temperature | TJ | -40 |  | 125 | °C |  | 4 |
| VIN input voltage | VIN | -0.3 |  | 7 | V | Absolute maximum, with respect to network ground | 4 |
| Voltage on SW | VSW | -0.3 |  | 7 | V |  | 4 |
| Voltage at EN, MODE | VEN, VMODE | -0.3 |  |  | V | Printed as VIN + 0.3, ≤ 7 V (max not numeric in table) | 4 |
| Maximum operating junction temperature | TJ | -40 |  | 125 | °C |  | 4 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 4 |
| Electrostatic discharge, human body model (HBM) | V(ESD) | -2000 |  | 2000 | V | Per ANSI/ESDA/JEDEC JS-001, all pins | 4 |
| Electrostatic discharge, charged device model (CDM) | V(ESD) | -1000 |  | 1000 | V | Per JEDEC JESD22-C101, all pins | 4 |
| Thermal shutdown | TSD |  | 140 |  | °C | Increasing junction temperature | 5 |
| Thermal shutdown hysteresis |  |  | 20 |  | °C | Decreasing junction temperature | 5 |
| Undervoltage lockout threshold, falling | UVLO |  | 1.85 |  | V | Falling | 5 |
| Undervoltage lockout threshold, rising | UVLO |  | 1.95 |  | V | Rising | 5 |
| Operating quiescent current, PFM not switching | IQ |  | 15 |  | µA | IOUT = 0 mA, PFM mode enabled (MODE = GND), device not switching | 5 |
| Operating quiescent current, PFM switching | IQ |  | 18.5 |  | µA | IOUT = 0 mA, PFM mode enabled (MODE = GND), device switching, VOUT = 1.8 V, see (1) | 5 |
| Operating quiescent current, PWM no load | IQ |  | 3.8 |  | mA | IOUT = 0 mA, switching with no load (MODE = VIN), PWM operation, VOUT = 1.8 V, VIN = 3 V | 5 |
| Feedback voltage PFM mode, voltage positioning active | VFB |  | 1 |  | % | MODE = GND, device in PFM mode, voltage positioning active (1) | 5 |
| Internal reference voltage | VREF |  | 600 |  | mV |  | 5 |
| Load regulation PWM mode |  |  | -0.5 |  | %/A | PWM mode | 5 |
| Start-up time | tStart Up |  | 500 |  | µs | Time from active EN to reach 95% of nominal VOUT | 5 |
| VOUT ramp-up time | tRamp |  | 250 |  | µs | Time to ramp from 5% to 95% of VOUT | 5 |
| Junction-to-ambient thermal resistance (WSON) | RθJA |  | 67.8 |  | °C/W | DRV [WSON] 6-pin package | 4 |
| Junction-to-case (top) thermal resistance (WSON) | RθJC(top) |  | 88.5 |  | °C/W | DRV [WSON] 6-pin package | 4 |
| Junction-to-board thermal resistance (WSON) | RθJB |  | 37.2 |  | °C/W | DRV [WSON] 6-pin package | 4 |
| Junction-to-top characterization parameter (WSON) | ψJT |  | 2 |  | °C/W | DRV [WSON] 6-pin package | 4 |
| Junction-to-board characterization parameter (WSON) | ψJB |  | 37.6 |  | °C/W | DRV [WSON] 6-pin package | 4 |
| Junction-to-case (bottom) thermal resistance (WSON) | RθJC(bot) |  | 7.9 |  | °C/W | DRV [WSON] 6-pin package | 4 |

## CAD (KiCad official)

- Symbol: `TPS62263DRVR`
- Footprint: `Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm`
- 3D model: WSON-6-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `tps62263drvr-etched.step` / `tps62263drvr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps62263drvr.step` / `tps62263drvr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tps62263) (39 pp, sha256 `d038c06261cfd705`, retrieved 2026-10-11, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tps62263drvr-datasheet.pdf)