component
TPS62175DQCR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, WSON-10-EP(2x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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TPS62175DQCR
Texas Instruments · DC-DC Converters · WSON-10-EP(2x3)
TPS62175DQCR from Texas Instruments, in a WSON-10-EP(2x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | Power ground connection. |
| 2 | VIN | power_in | Supply voltage for the converter, with a recommended operating range of 4.75 V to 28 V. |
| 3 | EN | input | Enable input (High = enabled, Low = disabled). |
| 4 | NC | unconnected | This pin is recommended to be connected to AGND but can be left floating. |
| 5 | FB | input | Voltage feedback of the adjustable version; connect a resistive divider to this pin, and TI recommends connecting FB to AGND for fixed-voltage versions for improved thermal performance. |
| 6 | AGND | power_in | Analog ground connection. |
| 7 | PG | output | Output power good (open drain, requires pullup resistor). |
| 8 | SLEEP | input | Sleep mode input (High = normal operation, Low = sleep mode operation), which can be operated dynamically during operation and should be connected to VOUT if sleep mode is not used. |
| 9 | SW | output | Switch node connected to the internal MOSFET switches; connect the inductor between SW and the output capacitor. |
| 10 | VOS | input | Output voltage sense pin and connection for the control loop circuitry. |
| 11 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-10-EP(2x3) |
| Category | Power Management (PMIC) |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage range (absolute max) | VIN | -0.3 | 30 | V | Pin voltage VIN, all voltages with respect to network ground | 4 | |
| Pin voltage EN, SW | -0.3 | V | EN, SW; max printed as VIN + 0.3 V | 4 | |||
| Pin voltage FB, PG, VOS, SLEEP, NC | -0.3 | 7 | V | FB, PG, VOS, SLEEP, NC | 4 | ||
| Power good sink current | 10 | mA | PG | 4 | |||
| Operating junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| ESD Human body model | V(ESD) | -2000 | 2000 | V | HBM, per ANSI/ESDA/JEDEC JS-001, all pins | 4 | |
| ESD Charged device model | V(ESD) | -500 | 500 | V | CDM, per JEDEC JESD22-C101, all pins | 4 | |
| Supply voltage | VIN | 4.75 | 28 | V | 4 | ||
| Operating free air temperature | TA | -40 | 85 | °C | 4 | ||
| Operating junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Input voltage range | VIN | 4.75 | 28 | V | 5 | ||
| Operating quiescent current | IQ | 22 | 36 | µA | EN = High, SLEEP = High, IOUT = 0 mA, device not switching | 5 | |
| Sleep mode quiescent current | IQ_SLEEP | 4.8 | 10 | µA | EN = High, SLEEP = Low, IOUT = 0 mA, device not switching | 5 | |
| Shutdown current | ISD | 1.5 | 5 | µA | EN = Low, current into VIN pin | 5 | |
| Undervoltage lockout threshold, rising | VUVLO | 4.5 | 4.6 | 4.7 | V | Rising input voltage | 5 |
| High level input threshold voltage (EN, SLEEP) | VH | 0.9 | V | 5 | |||
| Low level input threshold voltage (EN, SLEEP) | VL | 0.3 | V | 5 | |||
| Input leakage current (EN) | ILKG_EN | 5 | 300 | nA | EN = VIN | 5 | |
| Power good threshold voltage, rising | VTH_PG | 93 | 96 | 99 | % | Rising (%VOUT) | 5 |
| Power good threshold voltage, falling | VTH_PG | 87 | 90 | 93 | % | Falling (%VOUT) | 5 |
| Power good output low voltage | VOL_PG | 0.3 | V | IPG = -2 mA | 5 | ||
| Input leakage current (PG) | ILKG_PG | 5 | 300 | nA | VPG = 5 V | 5 | |
| High-side MOSFET ON-resistance | RDS(ON) | 850 | 1430 | mΩ | VIN ≥ 6 V | 5 | |
| Low-side MOSFET ON-resistance | RDS(ON) | 320 | 530 | mΩ | VIN ≥ 6 V | 5 | |
| High-side MOSFET current limit, normal operation | ILIMF | 800 | 1000 | 1200 | mA | Normal operation | 5 |
| High-side MOSFET current limit, start-up mode | ILIMF | 450 | 525 | 600 | mA | Start-up mode | 5 |
| Output voltage range (TPS62175) | VOUT | 1 | 6 | V | VIN ≥ VOUT | 5 | |
| Input leakage current (FB) | ILKG_FB | 1 | 100 | nA | VFB = 0.8 V | 5 | |
| Output voltage accuracy, adjustable PWM mode | -1.8 | 1.8 | % | TPS62175 adjustable PWM mode, VIN ≥ VOUT +1 V | 6 | ||
| Output voltage accuracy, power save mode, VOUT ≥ 2.5 V | -1.8 | 3 | % | Power save mode, L = 10 µH, COUT = 22 µF, VOUT ≥ 2.5 V | 6 | ||
| Output voltage accuracy, power save mode, VOUT < 2.5 V | -1.8 | 3.7 | % | Power save mode, L = 10 µH, COUT = 44 µF, VOUT < 2.5 V | 6 | ||
| Output voltage accuracy, sleep mode | -1.6 | 2.9 | % | Sleep mode, IOUT ≤ 15 mA, COUT = 22 µF, L = 10 µH | 6 | ||
| Junction-to-ambient thermal resistance | RθJA | 61.6 | °C/W | DQC [WSON] 10 pins | 4 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 65.5 | °C/W | DQC [WSON] 10 pins | 4 | ||
| Junction-to-board thermal resistance | RθJB | 22.5 | °C/W | DQC [WSON] 10 pins | 4 | ||
| Junction-to-top characterization parameter | ψJT | 1.4 | °C/W | DQC [WSON] 10 pins | 4 | ||
| Junction-to-board characterization parameter | ψJB | 22.4 | °C/W | DQC [WSON] 10 pins | 4 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 5.3 | °C/W | DQC [WSON] 10 pins | 4 |
CAD (KiCad official)
- Symbol:
TPS62175DQCR - Footprint:
Package_SON:WSON-10-1EP_2x3mm_P0.5mm_EP0.84x2.4mm - 3D model: WSON-10-EP(2x3) (KiCad packages3D, STEP)
- 3D model files:
tps62175dqcr-etched.step/tps62175dqcr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps62175dqcr.step/tps62175dqcr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (38 pp, sha256
fe8b555aee6d480b, retrieved 2026-11-05, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).