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Contents

README

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TPS61378QWRTERQ1

Texas Instruments · DC-DC Converters · WQFN-16-EP(3x3)

TPS61378QWRTERQ1 from Texas Instruments, in a WQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Power supply input ranging from 2.3 V to 14 V with 25 to 35 μA quiescent current
2 BST input Bootstrap supply for high-side FET gate driver; ceramic capacitor must connect between this pin and SW pin
3 SW output Switching node connected to low-side FET drain and high-side FET source, actively driven at 200 kHz to 2.2 MHz
4 SW output Switching node connected to low-side FET drain and high-side FET source, actively driven at 200 kHz to 2.2 MHz
5 MODE/SYNC input Mode selection for forced PWM mode (logic high) or auto PFM mode (logic low or floating); supports external clock synchronization
6 VCC power_out Regulated 4.8 V output; 1 μF minimum ceramic capacitor required to GND
7 GND power_in Power ground of IC connected to low-side FET source; must connect to ground plane and thermal pad
8 GND power_in Power ground of IC connected to low-side FET source; must connect to ground plane and thermal pad
9 VO power_out Output of isolation FET for load connection to achieve input/output galvanic isolation
10 OUT power_out Output of high-side FET drain; connect this pin or short with VO pin to enable load disconnect and short protection features
11 PG output Open-drain power good indicator output; pulled high 2.5 to 4.3 ms after VOUT reaches 90% of target voltage
12 ILIM input Current limit setting pin; connect resistor to GND to program peak current limit from 1 A to 4.8 A
13 FB input Feedback input pin; use resistor divider to set desired output voltage between 4.0 V and 18.5 V
14 COMP input Compensation network connection for external RC network to optimize loop stability and transient response
15 EN input Enable logic input; device active when pulled above 1.2 V threshold
16 FREQ input Frequency setting pin; connect resistor to GND to program switching frequency from 200 kHz to 2.2 MHz
17 Thermal Pad passive Exposed thermal pad; must solder to power ground plane for efficient junction heat dissipation

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-16-EP(3x3)
Category Power Management (PMIC)
Pins 17

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage range (recommended) VIN 2.3 14 V 5
Output voltage (recommended) VOUT 4 18.5 V 5
Operating junction temperature (recommended) TJ -40 150 °C 5
Voltage range at VIN VIN -0.3 16 V 5
Voltage range at VO, SW, OUT VO, SW, OUT -0.3 23 V 5
Voltage range at BST BST -0.3 V 5
Voltage range at MODE/SYNC, FB, FREQ, ILIM, VCC, COMP, EN -0.3 6 V 5
Voltage range at PG PG -0.3 20 V 5
Operating junction temperature (absolute maximum) TJ -40 150 °C 5
Storage temperature Tstg -65 150 °C 5
Input voltage range VIN 2.3 14 V 6
Quiescent current into VIN pin IQ 25 35 µA IC enabled, no load, VIN = 3.3 V, VOUT = 18.5 V, VFB = VREF + 0.1 V 6
Quiescent current into OUT pin IQ 10 20 µA IC enabled, no load, VIN = 3.3 V, VOUT = 18.5 V, VFB = VREF + 0.1 V 6
Shutdown current into VIN pin ISD 0.6 5 µA IC disabled, VIN =14 V, EN = GND 6
Output over-voltage protection threshold VOVP 19.3 20 20.5 V VIN = 3.3 V, VOUT rising 6
Reference voltage at FB pin (adjustable option) VREF 0.788 0.8 0.812 V TJ = -40 to 125°C, RFB = 16.0kΩ 6
Peak switching current limit (FPWM) ILIM_SW 4 4.8 5.55 A RLIM = 20 kΩ , Duty cycle = 65% 7
Peak switching current limit (Auto PFM) ILIM_SW 4 4.8 5.55 A RLIM = 20 kΩ , Duty cycle = 65% 7
Peak switching current limit at soft start ILIM_SS_1 0.9 1.15 1.4 A VIN = 3.3 V, VOUT = 0 V, RLIM = 20 kΩ 7
Switching frequency Fsw 2050 2200 2400 kHz RFREQ = 18 kΩ 7
Switching frequency Fsw 180 200 230 kHz RFREQ = 218 kΩ 7
PG delay time tPG_DELAY 2.5 3.4 4.3 ms 7
Sync frequency minimum fSYNC_MIN 200 kHz 7
Sync frequency maximum fSYNC_MAX 2200 kHz 7
Junction-to-ambient thermal resistance RθJA 46.2 °C/W 5
Junction-to-case (top) thermal resistance RθJC(top) 43.5 °C/W 5
Junction-to-board thermal resistance RθJB 18.5 °C/W 5
Junction-to-case (bottom) thermal resistance RθJC(bot) 8.8 °C/W 6

CAD (KiCad official)

  • Symbol: TPS61378QWRTERQ1
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: tps61378qwrterq1-etched.step / tps61378qwrterq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps61378qwrterq1.step / tps61378qwrterq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (42 pp, sha256 3799e162e33f3792, retrieved 2026-09-23, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF