component
TPS5432DDAR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, HSOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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README.mdadded+46@@ -0,0 +1,46 @@+# TPS5432DDAR++**Texas Instruments** · DC-DC Converters · HSOP-8-EP++TPS5432DDAR from Texas Instruments, in a HSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | BOOT | output | Bootstrap supply pin for high-side MOSFET gate drive; requires 0.1µF ceramic capacitor (X7R/X5R, ≥10V rating) connected between BOOT and PH. |+| 2 | VIN | power_in | Power supply input for control circuitry and power converter switches; operating range 2.95V to 6V. |+| 3 | PH | output | Phase switching node; source of high-side MOSFET and drain of low-side synchronous rectifier MOSFET. |+| 4 | GND | power_in | Ground reference; must be electrically connected directly to exposed thermal pad for proper operation. |+| 5 | VSENSE | input | Inverting input node to transconductance error amplifier; connected to output voltage feedback network via external resistor divider. |+| 6 | COMP | output | Error amplifier output and input to output switch current comparator; frequency compensation network connected to this pin. |+| 7 | EN | input | Enable control input with internal pull-up current source; pull to ground to disable switching and reduce quiescent current to ≤5µA. |+| 8 | SS | input | Slow start control input; external capacitor to ground sets the output voltage rise time during power-up. |+| 9 | THERMAL PAD | power_in | Exposed ground pad for thermal management; must be connected to internal PCB ground plane using multiple vias for proper thermal performance. |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | HSOP-8-EP |+| Category | Power Management (PMIC) |+| Pins | 9 |++## CAD (KiCad official)++- Symbol: `TPS5432DDAR`+- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm`+- 3D model: HSOP-8-EP (KiCad packages3D, STEP)+- 3D model files: `tps5432ddar-etched.step` / `tps5432ddar-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps5432ddar.step` / `tps5432ddar.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tps5432) (33 pp, sha256 `e71b7195621bdd29`, retrieved 2026-09-22, tier: lcsc)+- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.2`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/tps5432ddar-datasheet.pdf)
page.jsonadded+147@@ -0,0 +1,147 @@+{+ "slug": "tps5432ddar",+ "version": "0.1.0",+ "type": "component",+ "description": "Texas Instruments DC-DC Converters, HSOP-8-EP. Datasheet-verified pinout, KiCad symbol/footprint/3D.",+ "tags": [+ "component",+ "power management (pmic)",+ "tps5432ddar",+ "factory-2.0.0",+ "extractor-text"+ ],+ "dependencies": {},+ "hero": {+ "type": "image",+ "path": "docs/hero.png"+ },+ "files": [+ "page.json",+ "README.md",+ "tps5432ddar.kicad_sym",+ "tps5432ddar.kicad_mod",+ "tps5432ddar.glb",+ "tps5432ddar.step",+ "tps5432ddar.lbr",+ "docs/hero.png",+ "docs/tps5432ddar-datasheet.pdf",+ "viewers/symbol.html",+ "viewers/footprint.html"+ ],+ "component": {+ "mpn": "TPS5432DDAR",+ "manufacturer": "Texas Instruments",+ "package": "HSOP-8-EP",+ "pin_count": 9,+ "category": "Power Management (PMIC)",+ "subcategory": "DC-DC Converters",+ "datasheet": "https://www.ti.com/cn/lit/gpn/tps5432",+ "parts": {+ "symbol": "tps5432ddar.kicad_sym",+ "footprint": "tps5432ddar.kicad_mod",+ "model_3d": "tps5432ddar-etched.glb",+ "model_3d_plain": "tps5432ddar.glb",+ "model_3d_step": "tps5432ddar-etched.step",+ "model_3d_step_plain": "tps5432ddar.step",+ "lbr": "tps5432ddar.lbr"+ },+ "distributor_links": {+ "lcsc": "C122691"+ },+ "pins": [+ {+ "number": "1",+ "name": "BOOT",+ "type": "output",+ "description": "Bootstrap supply pin for high-side MOSFET gate drive; requires 0.1µF ceramic capacitor (X7R/X5R, ≥10V rating) connected between BOOT and PH."+ },+ {+ "number": "2",+ "name": "VIN",+ "type": "power_in",+ "description": "Power supply input for control circuitry and power converter switches; operating range 2.95V to 6V."+ },+ {+ "number": "3",+ "name": "PH",+ "type": "output",+ "description": "Phase switching node; source of high-side MOSFET and drain of low-side synchronous rectifier MOSFET."+ },+ {+ "number": "4",+ "name": "GND",+ "type": "power_in",+ "description": "Ground reference; must be electrically connected directly to exposed thermal pad for proper operation."+ },+ {+ "number": "5",+ "name": "VSENSE",+ "type": "input",+ "description": "Inverting input node to transconductance error amplifier; connected to output voltage feedback network via external resistor divider."+ },+ {+ "number": "6",+ "name": "COMP",+ "type": "output",+ "description": "Error amplifier output and input to output switch current comparator; frequency compensation network connected to this pin."+ },+ {+ "number": "7",+ "name": "EN",+ "type": "input",+ "description": "Enable control input with internal pull-up current source; pull to ground to disable switching and reduce quiescent current to ≤5µA."+ },+ {+ "number": "8",+ "name": "SS",+ "type": "input",+ "description": "Slow start control input; external capacitor to ground sets the output voltage rise time during power-up."+ },+ {+ "number": "9",+ "name": "THERMAL PAD",+ "type": "power_in",+ "description": "Exposed ground pad for thermal management; must be connected to internal PCB ground plane using multiple vias for proper thermal performance."+ }+ ],+ "provenance": {+ "extractor": "extract_pins 0.2",+ "factory_chain": {+ "factory": "2.0.0",+ "extractor": "extract_pins 0.2",+ "primary_model": "claude-haiku-4-5-20251001",+ "primary_mode": "text",+ "consensus_model": "claude-sonnet-5",+ "consensus": "agreed",+ "guards": "pin_guards 0.1: passed",+ "guard_notes": [],+ "pages_sent": 33,+ "cost_usd": 0.3147,+ "at": "2026-09-22T21:36:02"+ },+ "datasheet": {+ "url": "https://www.ti.com/cn/lit/gpn/tps5432",+ "pages": 33,+ "sha256": "e71b7195621bdd29",+ "source_tier": "lcsc"+ },+ "cad": "KiCad official (CC-BY-SA 4.0)",+ "pins": {+ "total": 9,+ "described": 9,+ "cites_pages": true,+ "refuses_to_fabricate": true+ }+ },+ "viewers": {+ "symbol": "viewers/symbol.html",+ "footprint": "viewers/footprint.html"+ }+ },+ "visibility": "public",+ "org": "adom",+ "author": {+ "name": "Ray",+ "email": "[email protected]"+ }+}