component
TPS5432DDAR
Public Made by Adomby adom
Texas Instruments DC-DC Converters, HSOP-8-EP. Datasheet-verified pinout, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS5432DDAR
Texas Instruments · DC-DC Converters · HSOP-8-EP
TPS5432DDAR from Texas Instruments, in a HSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BOOT | output | Bootstrap supply pin for high-side MOSFET gate drive; requires 0.1µF ceramic capacitor (X7R/X5R, ≥10V rating) connected between BOOT and PH. |
| 2 | VIN | power_in | Power supply input for control circuitry and power converter switches; operating range 2.95V to 6V. |
| 3 | PH | output | Phase switching node; source of high-side MOSFET and drain of low-side synchronous rectifier MOSFET. |
| 4 | GND | power_in | Ground reference; must be electrically connected directly to exposed thermal pad for proper operation. |
| 5 | VSENSE | input | Inverting input node to transconductance error amplifier; connected to output voltage feedback network via external resistor divider. |
| 6 | COMP | output | Error amplifier output and input to output switch current comparator; frequency compensation network connected to this pin. |
| 7 | EN | input | Enable control input with internal pull-up current source; pull to ground to disable switching and reduce quiescent current to ≤5µA. |
| 8 | SS | input | Slow start control input; external capacitor to ground sets the output voltage rise time during power-up. |
| 9 | THERMAL PAD | power_in | Exposed ground pad for thermal management; must be connected to internal PCB ground plane using multiple vias for proper thermal performance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HSOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
TPS5432DDAR - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm - 3D model: HSOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
tps5432ddar-etched.step/tps5432ddar-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps5432ddar.step/tps5432ddar.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (33 pp, sha256
e71b7195621bdd29, retrieved 2026-09-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).