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Ray tps54225pwpr: specified limits as data (metadata.characteristics, 59 rows from the datasheet) 41ed7a9 25d ago

TPS54225PWPR

Texas Instruments · DC-DC Converters · HTSSOP-14

TPS54225PWPR from Texas Instruments, in a HTSSOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VO input Connect to output of converter; this pin is used for On-Time Adjustment.
2 VFB input Converter feedback input; connect with feedback resistor divider.
3 VREG5 power_out 5.5 V internal power supply output; a capacitor (typical 1 uF) should be connected to GND.
4 SS passive Soft-start control pin; an external capacitor should be connected to GND to set the slow-start time.
5 GND power_in Signal ground pin.
6 PG output Open drain power good output.
7 EN input Enable control input.
8 PGND1 power_in Ground return for low-side MOSFET; also serves as input of a current comparator, and should be connected strongly together with PGND near the IC.
9 PGND2 power_in Ground return for low-side MOSFET; also serves as input of a current comparator, and should be connected strongly together with PGND near the IC.
10 SW1 output Switch node connection between high-side NFET and low-side NFET; also serves as an input to a current comparator.
11 SW2 output Switch node connection between high-side NFET and low-side NFET; also serves as an input to a current comparator.
12 VBST power_in Supply input for the high-side NFET gate driver (boost terminal); a capacitor should be connected from this pin to the respective SW1, SW2 terminals, and an internal PN diode connects VREG5 to this pin.
13 VIN power_in Power input, connected to the high-side NFET drain.
14 VCC power_in Supply input for the 5 V internal linear regulator that powers the control circuitry.
15 PowerPAD power_in Thermal pad of the package (back side); must be soldered to achieve appropriate dissipation and should be connected to PGND.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HTSSOP-14
Category Power Management (PMIC)
Pins 15

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VCC supply input voltage range VCC 4.5 18 V 3
Power input voltage range VIN 2 18 V 3
Input voltage range (boost terminal) VBST -0.1 24 V 3
Input voltage range (boost vs SW1, SW2) VBST (vs SW1, SW2) -0.1 5.7 V 3
Input voltage range (soft start, power good) SS, PG -0.1 5.7 V 3
Input voltage range (enable) EN -0.1 18 V 3
Input voltage range (output, feedback) VO, VFB -0.1 5.5 V 3
Switch node voltage range SW1, SW2 -1.8 18 V 3
Switch node voltage range (10 ns transient) SW1, SW2 -3 18 V 10 ns transient 3
Ground voltage range (power ground) PGND1, PGND2 -0.1 0.1 V 3
Output voltage range (VREG5) VREG5 -0.1 5.7 V 3
Output current range IO 0 10 mA IVREG5 3
Operating free-air temperature TA -40 85 °C 3
Operating junction temperature TJ -40 125 °C 3
Input voltage range (VIN, VCC, EN) VIN, VCC, EN -0.3 20 V 2
Input voltage range (VBST) VBST -0.3 26 V 2
Input voltage range (VBST vs SW1, SW2) VBST (vs SW1, SW2) -0.3 6.5 V 2
Input voltage range (VFB, VO, SS, PG) VFB, VO, SS, PG -0.3 6.5 V 2
Switch node voltage range (SW1, SW2) SW1, SW2 -2 20 V 2
Switch node voltage range (10 ns transient) SW1, SW2 -3 20 V 10 ns transient 2
Output voltage range (VREG5) VREG5 -0.3 6.5 V 2
Ground voltage range (PGND1, PGND2) PGND1, PGND2 -0.3 0.3 V 2
Voltage from GND to POWERPAD Vdiff -0.2 0.2 V 2
Operating junction temperature TJ -40 150 °C 2
Storage temperature Tstg -55 150 °C 2
Operating non-switching supply current IVCC 800 1200 μA VCC, VIN = 12 V; TA = 25°C, EN = 5 V, VFB = 0.8 V 3
Shutdown supply current IVCCSDN 1.8 10 μA VCC, VIN = 12 V; TA = 25°C, EN = 0 V 3
EN high-level input voltage VENH 2 V VCC, VIN = 12 V 3
EN low-level input voltage VENL 0.4 V VCC, VIN = 12 V 3
VFB threshold voltage VFB 757 765 773 mV VCC, VIN = 12 V; TA = 25°C, VO = 1.05 V 3
VFB threshold voltage VFB 753 777 mV VCC, VIN = 12 V; TA = 0°C to 85°C, VO = 1.05 V 3
VFB threshold voltage VFB 751 779 mV VCC, VIN = 12 V; TA = -40°C to 85°C, VO = 1.05 V 3
VFB input current IVFB -0.1 0 0.1 μA VCC, VIN = 12 V; VFB = 0.8 V, TA = 25°C 3
VO discharge resistance RDischg 50 100 Ω VCC, VIN = 12 V; EN = 0 V, VO = 0.5 V, TA = 25°C 3
VREG5 output voltage VREG5 5.3 5.5 5.7 V VCC, VIN = 12 V; TA = 25°C, 6 V < VCC < 18 V, 0 < IVREG5 < 5 mA 3
Current limit Iocl 2.5 3.1 4.5 A VCC, VIN = 12 V; LOUT = 2.2µH 3
Minimum off time tOFF(MIN) 260 310 ns VCC, VIN = 12 V; TA = 25°C, VFB = 0.7 V 4
Soft-start charge current ISSC 1.4 2 2.6 μA VCC, VIN = 12 V; VSS = 0 V 4
Soft-start discharge current ISSD 0.1 0.2 mA VCC, VIN = 12 V; VSS = 0.5 V 4
Power good threshold (VFB rising, good) VTHPG 85 90 95 % VCC, VIN = 12 V; VFB rising (good) 4
Power good sink current IPG 2.5 5 mA VCC, VIN = 12 V; PG = 0.5 V 4
Output OVP trip threshold VOVP 115 120 125 % VCC, VIN = 12 V; OVP detect 4
Output UVP trip threshold VUVP 65 70 75 % VCC, VIN = 12 V; UVP detect 4
Wake up VREG5 voltage (UVLO threshold) UVLO 3.55 3.8 4.05 V VCC, VIN = 12 V; Wake up VREG5 voltage 4
Hysteresis VREG5 voltage (UVLO) UVLO 0.23 0.35 0.47 V VCC, VIN = 12 V; Hysteresis VREG5 voltage 4
Output current IVREG5 70 mA VCC, VIN = 12 V; VCC = 6 V, VREG5 = 4 V, TA = 25°C 3
Line regulation VLN5 20 mV VCC, VIN = 12 V; 6 V < VCC < 18 V, IVREG5 = 5 mA 3
Load regulation VLD5 100 mV VCC, VIN = 12 V; 0 mA < IVREG5 < 5 mA 3
High side switch resistance RDS(on)h 160 mΩ VCC, VIN = 12 V; 25°C, VBST - SW1, SW2 = 5.5 V 3
Low side switch resistance RDS(on)l 110 mΩ VCC, VIN = 12 V; 25°C 3
Thermal shutdown threshold TSDN 150 °C VCC, VIN = 12 V 3
Thermal shutdown hysteresis TSDN 25 °C VCC, VIN = 12 V 3
On time tON 145 ns VCC, VIN = 12 V; VIN = 12 V, VO = 1.05 V 4
Junction-to-ambient thermal resistance θJA 55.6 °C/W PWP package, 14 pins 2
Junction-to-case (top) thermal resistance θJCtop 51.3 °C/W PWP package, 14 pins 2
Junction-to-board thermal resistance θJB 26.4 °C/W PWP package, 14 pins 2
Junction-to-top characterization parameter ψJT 1.8 °C/W PWP package, 14 pins 2
Junction-to-board characterization parameter ψJB 20.6 °C/W PWP package, 14 pins 2
Junction-to-case (bottom) thermal resistance θJCbot 4.3 °C/W PWP package, 14 pins 2

CAD (KiCad official)

  • Symbol: TPS54225PWPR
  • Footprint: Package_SO:TSSOP-14-1EP_4.4x5mm_P0.65mm
  • 3D model: HTSSOP-14 (KiCad packages3D, STEP)
  • 3D model files: tps54225pwpr-etched.step / tps54225pwpr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps54225pwpr.step / tps54225pwpr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (29 pp, sha256 3c3ac317d4ab1b65, retrieved 2026-09-24, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF