# TPS53316RGTR

**Texas Instruments** · DC-DC Converters · QFN-16(3x3)

TPS53316RGTR from Texas Instruments, in a QFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | EN | input | Enable pin, internally pulled up to VIN through a 2-MΩ resistor; the EN voltage must be less than (VIN + 0.5 V). |
| 2 | RF/OC | input | Switching frequency and OC level configuration pin: GND = 1.1 MHz/6.5-A OCP, floating or pulled high = 1.1 MHz/4.5-A OCP, 24.3 kΩ = 750 kHz/4.5 A, 57.6 kΩ = 750 kHz/6.5 A, 105 kΩ = 2 MHz/4.5 A, 174 kΩ = 2 MHz/6.5 A. |
| 3 | PGD | output | Open-drain power good output flag, pulled up to an external rail through a resistor. |
| 4 | VBST | power_in | Bootstrap supply input for the high-side MOSFET; connect a capacitor from this pin to the SW terminal. |
| 5 | SW | bidirectional | Output inductor connection to the integrated power devices. |
| 6 | SW | bidirectional | Output inductor connection to the integrated power devices. |
| 7 | SW | bidirectional | Output inductor connection to the integrated power devices. |
| 8 | PS | input | Mode configuration pin (10-µA current): GND = forced CCM with 4x soft-start, floating or pulled high = forced CCM with 1x soft-start, 24.3 kΩ = HEF with 4x, 57.6 kΩ = HEF, 105 kΩ = DE, 174 kΩ = DE with 4x soft-start. |
| 9 | COMP | output | Error amplifier compensation terminal; Type III compensation is generally recommended for stability. |
| 10 | FB | input | Voltage feedback pin used for OVP, UVP, and PGD determination. |
| 11 | AGND | power_in | Device analog ground terminal. |
| 12 | VREG3 | power_out | 3.3-V LDO output that supplies internal analog circuitry; the EN pin controls the LDO turn-on. |
| 13 | VIN | power_in | Gate driver supply and power conversion input voltage, range 2.9 V to 6 V. |
| 14 | VIN | power_in | Gate driver supply and power conversion input voltage, range 2.9 V to 6 V. |
| 15 | PGND | power_in | Device power ground terminal. |
| 16 | PGND | power_in | Device power ground terminal. |
| 17 | PowerPad | passive | Thermal pad of the device; use 4 or 5 vias to connect to the GND plane for heat dissipation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFN-16(3x3) |
| Category | Power Management (PMIC) |
| Pins | 17 |

## CAD (KiCad official)

- Symbol: `TPS53316RGTR`
- Footprint: `Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm`
- 3D model: QFN-16(3x3) (KiCad packages3D, STEP)
- 3D model files: `tps53316rgtr-etched.step` / `tps53316rgtr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps53316rgtr.step` / `tps53316rgtr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/tps53316.pdf) (35 pp, sha256 `217940c314fbda04`, retrieved 2026-10-01, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tps53316rgtr-datasheet.pdf)