main
John Lauer Preserve TI supervisor originals and source library with explicit export gates 035a18a 1mo ago
(footprint "TPS389001DSER" (version 20241229) (generator "DepthLab")
(layer "F.Cu") (attr smd)
(descr "TI DSE0006A 4220552/B; mixed SMD/NSMD land pattern; candidate")
(fp_text reference "REF**" (at 0 -1.8) (layer "F.SilkS") (effects (font (size 0.6 0.6) (thickness 0.12))))
(fp_text value "TPS389001DSER" (at 0 1.8) (layer "F.Fab") (effects (font (size 0.5 0.5) (thickness 0.1))))
(fp_rect (start -0.75 -0.75) (end 0.75 0.75) (stroke (width 0.1) (type default)) (fill none) (layer "F.Fab"))
(fp_line (start -0.75 -0.5) (end -0.5 -0.75) (stroke (width 0.1) (type default)) (layer "F.Fab"))
(fp_rect (start -1.25 -1.05) (end 1.25 1.05) (stroke (width 0.05) (type default)) (fill none) (layer "F.CrtYd"))
(fp_line (start -0.65 -0.9) (end 0.75 -0.9) (stroke (width 0.12) (type default)) (layer "F.SilkS"))
(fp_line (start -0.75 0.9) (end 0.75 0.9) (stroke (width 0.12) (type default)) (layer "F.SilkS"))
(fp_circle (center -1.1 -0.95) (end -1.04 -0.95) (stroke (width 0.1) (type default)) (fill solid) (layer "F.SilkS"))
(pad "1" smd roundrect (at -0.55 -0.5) (size 0.900 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.285714286) (solder_mask_margin -0.05) (solder_paste_margin -0.05))
(pad "2" smd roundrect (at -0.6 0) (size 0.800 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.285714286) (solder_mask_margin -0.05) (solder_paste_margin -0.05))
(pad "3" smd roundrect (at -0.6 0.5) (size 0.800 0.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.285714286) (solder_mask_margin -0.05) (solder_paste_margin -0.05))
(pad "4" smd roundrect (at 0.6 0.5) (size 0.700 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.200000000) (solder_mask_margin 0.05) (solder_paste_margin 0))
(pad "5" smd roundrect (at 0.6 0) (size 0.700 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.200000000) (solder_mask_margin 0.05) (solder_paste_margin 0))
(pad "6" smd roundrect (at 0.6 -0.5) (size 0.700 0.25) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.200000000) (solder_mask_margin 0.05) (solder_paste_margin 0))
)