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TPS26750SRSMR
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TEXAS INSTRUMENTS Global Sourcing Parts, VQFN-32-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TPS26750SRSMR
TEXAS INSTRUMENTS · Global Sourcing Parts · VQFN-32-EP(4x4)
TPS26750SRSMR from TEXAS INSTRUMENTS, in a VQFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | LDO_3V3 | power_out | 3.3 V LDO output switched from VIN_3V3 or the VBUS LDO, range 3.0-3.6 V; bypass to GND with CLDO_3V3 (5-25 µF, 10 µF nominal). |
| 2 | ADCIN1 | input | Configuration ADC input; connect to LDO_3V3 through a resistor divider, input range 0-3.6 V. |
| 3 | ADCIN2 | input | Configuration ADC input; connect to LDO_3V3 through a resistor divider, input range 0-3.6 V. |
| 4 | LDO_1V5 | power_out | Core LDO output for the internal 1.5 V logic; bypass to GND with CLDO_1V5 (4.5-12 µF) and it cannot supply external circuits. |
| 5 | GPIO0 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 6 | GPIO1 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 7 | GPIO2 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 8 | I2Ct_SDA | bidirectional | I2C target serial data, open-drain, 0-3.6 V; pull up through a resistor, or tie to GND if unused. |
| 9 | I2Ct_SCL | input | I2C target serial clock input, 0-3.6 V; pull up through a resistor, or tie to GND if unused. |
| 10 | I2Ct_IRQ | output | I2C target interrupt, active low, pulled up to an external voltage; can be reconfigured as GPIO10 and tied to GND if unused. |
| 11 | GND | power_in | Ground; connect to the board ground plane. |
| 12 | GND | power_in | Ground; connect to the board ground plane. |
| 13 | GPIO11 | output | General-purpose digital output; tie to GND if unused. |
| 14 | GND | power_in | Ground; connect to the board ground plane. |
| 15 | I2Cc_SDA | bidirectional | I2C controller serial data, open-drain, pulled up to LDO_3V3 whether used or not. |
| 16 | I2Cc_SCL | output | I2C controller serial clock, open-drain, pulled up to LDO_3V3 through a resistor whether used or not. |
| 17 | I2Cc_IRQ | input | I2C controller interrupt, active low, pulled up to an external voltage; do not connect to GND when unused and it can be reconfigured as GPIO12. |
| 18 | GPIO3 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 19 | VSYS | input | Connect to GND; serves as the reference for POWER_PATH_EN (VSYS range 0-22 V recommended). |
| 20 | POWER_PATH_EN | output | External load-switch power-path enable; not a logic-level output (absolute maximum 12 V with VSYS = GND), leave floating if unused. |
| 21 | NC | unconnected | No connection. |
| 22 | GPIO4/USB_P/LD1 | bidirectional | General-purpose I/O that can connect to USB D+ for BC1.2 support or to the liquid-detection LD1 function; tie to GND if unused. |
| 23 | GPIO5/USB_N/LD2 | bidirectional | General-purpose I/O that can connect to USB D- for BC1.2 support or to the liquid-detection LD2 function; tie to GND if unused. |
| 24 | CC1 | bidirectional | USB Type-C CC1 I/O; filter noise with the recommended capacitor CCC1 to GND (200-480 pF); 26 V tolerant absolute maximum, 0-5.5 V recommended. |
| 25 | CC2 | bidirectional | USB Type-C CC2 I/O; filter noise with the recommended capacitor CCC2 to GND (200-480 pF); 26 V tolerant absolute maximum, 0-5.5 V recommended. |
| 26 | VBUS | power_in | USB VBUS input, 4-22 V recommended (28 V absolute maximum); bypass to GND with CVBUS (1-10 µF). |
| 27 | VBUS | power_in | USB VBUS input, 4-22 V recommended (28 V absolute maximum); bypass to GND with CVBUS (1-10 µF). |
| 28 | PP5V | power_in | 5 V system supply for VBUS through the PP_5V path and VCONN supply for the CCy pins; 4.9-5.5 V recommended, with at least 10 µF. |
| 29 | PP5V | power_in | 5 V system supply for VBUS through the PP_5V path and VCONN supply for the CCy pins; 4.9-5.5 V recommended, with at least 10 µF. |
| 30 | GPIO7 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 31 | GPIO6 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 32 | VIN_3V3 | power_in | Primary 3.3 V supply for core circuits and I/O, 3.0-3.6 V recommended; bypass to GND with CVIN_3V3 (5-10 µF). |
| 33 | GND | power_in | Exposed thermal pad, connected to GND for heat dissipation; solder to the ground plane with multiple vias. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TEXAS INSTRUMENTS |
| Package | VQFN-32-EP(4x4) |
| Category | Global Sourcing Parts |
| Pins | 33 |
CAD (KiCad official)
- Symbol:
TPS26750SRSMR - Footprint:
Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm - 3D model: VQFN-32-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
tps26750srsmr-etched.step/tps26750srsmr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps26750srsmr.step/tps26750srsmr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: TEXAS INSTRUMENTS datasheet (66 pp, sha256
422acc8309129bb1, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPS26750SRSMR
**TEXAS INSTRUMENTS** · Global Sourcing Parts · VQFN-32-EP(4x4)
TPS26750SRSMR from TEXAS INSTRUMENTS, in a VQFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | LDO_3V3 | power_out | 3.3 V LDO output switched from VIN_3V3 or the VBUS LDO, range 3.0-3.6 V; bypass to GND with CLDO_3V3 (5-25 µF, 10 µF nominal). |
| 2 | ADCIN1 | input | Configuration ADC input; connect to LDO_3V3 through a resistor divider, input range 0-3.6 V. |
| 3 | ADCIN2 | input | Configuration ADC input; connect to LDO_3V3 through a resistor divider, input range 0-3.6 V. |
| 4 | LDO_1V5 | power_out | Core LDO output for the internal 1.5 V logic; bypass to GND with CLDO_1V5 (4.5-12 µF) and it cannot supply external circuits. |
| 5 | GPIO0 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 6 | GPIO1 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 7 | GPIO2 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 8 | I2Ct_SDA | bidirectional | I2C target serial data, open-drain, 0-3.6 V; pull up through a resistor, or tie to GND if unused. |
| 9 | I2Ct_SCL | input | I2C target serial clock input, 0-3.6 V; pull up through a resistor, or tie to GND if unused. |
| 10 | I2Ct_IRQ | output | I2C target interrupt, active low, pulled up to an external voltage; can be reconfigured as GPIO10 and tied to GND if unused. |
| 11 | GND | power_in | Ground; connect to the board ground plane. |
| 12 | GND | power_in | Ground; connect to the board ground plane. |
| 13 | GPIO11 | output | General-purpose digital output; tie to GND if unused. |
| 14 | GND | power_in | Ground; connect to the board ground plane. |
| 15 | I2Cc_SDA | bidirectional | I2C controller serial data, open-drain, pulled up to LDO_3V3 whether used or not. |
| 16 | I2Cc_SCL | output | I2C controller serial clock, open-drain, pulled up to LDO_3V3 through a resistor whether used or not. |
| 17 | I2Cc_IRQ | input | I2C controller interrupt, active low, pulled up to an external voltage; do not connect to GND when unused and it can be reconfigured as GPIO12. |
| 18 | GPIO3 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 19 | VSYS | input | Connect to GND; serves as the reference for POWER_PATH_EN (VSYS range 0-22 V recommended). |
| 20 | POWER_PATH_EN | output | External load-switch power-path enable; not a logic-level output (absolute maximum 12 V with VSYS = GND), leave floating if unused. |
| 21 | NC | unconnected | No connection. |
| 22 | GPIO4/USB_P/LD1 | bidirectional | General-purpose I/O that can connect to USB D+ for BC1.2 support or to the liquid-detection LD1 function; tie to GND if unused. |
| 23 | GPIO5/USB_N/LD2 | bidirectional | General-purpose I/O that can connect to USB D- for BC1.2 support or to the liquid-detection LD2 function; tie to GND if unused. |
| 24 | CC1 | bidirectional | USB Type-C CC1 I/O; filter noise with the recommended capacitor CCC1 to GND (200-480 pF); 26 V tolerant absolute maximum, 0-5.5 V recommended. |
| 25 | CC2 | bidirectional | USB Type-C CC2 I/O; filter noise with the recommended capacitor CCC2 to GND (200-480 pF); 26 V tolerant absolute maximum, 0-5.5 V recommended. |
| 26 | VBUS | power_in | USB VBUS input, 4-22 V recommended (28 V absolute maximum); bypass to GND with CVBUS (1-10 µF). |
| 27 | VBUS | power_in | USB VBUS input, 4-22 V recommended (28 V absolute maximum); bypass to GND with CVBUS (1-10 µF). |
| 28 | PP5V | power_in | 5 V system supply for VBUS through the PP_5V path and VCONN supply for the CCy pins; 4.9-5.5 V recommended, with at least 10 µF. |
| 29 | PP5V | power_in | 5 V system supply for VBUS through the PP_5V path and VCONN supply for the CCy pins; 4.9-5.5 V recommended, with at least 10 µF. |
| 30 | GPIO7 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 31 | GPIO6 | bidirectional | General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused. |
| 32 | VIN_3V3 | power_in | Primary 3.3 V supply for core circuits and I/O, 3.0-3.6 V recommended; bypass to GND with CVIN_3V3 (5-10 µF). |
| 33 | GND | power_in | Exposed thermal pad, connected to GND for heat dissipation; solder to the ground plane with multiple vias. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | TEXAS INSTRUMENTS |
| Package | VQFN-32-EP(4x4) |
| Category | Global Sourcing Parts |
| Pins | 33 |
## CAD (KiCad official)
- Symbol: `TPS26750SRSMR`
- Footprint: `Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm`
- 3D model: VQFN-32-EP(4x4) (KiCad packages3D, STEP)
- 3D model files: `tps26750srsmr-etched.step` / `tps26750srsmr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps26750srsmr.step` / `tps26750srsmr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [TEXAS INSTRUMENTS datasheet](https://www.ti.com.cn/cn/lit/ds/symlink/tps26750.pdf) (66 pp, sha256 `422acc8309129bb1`, retrieved 2026-10-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tps26750srsmr-datasheet.pdf)