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TPS26750SRSMR

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TEXAS INSTRUMENTS Global Sourcing Parts, VQFN-32-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TPS26750SRSMR

TEXAS INSTRUMENTS · Global Sourcing Parts · VQFN-32-EP(4x4)

TPS26750SRSMR from TEXAS INSTRUMENTS, in a VQFN-32-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 LDO_3V3 power_out 3.3 V LDO output switched from VIN_3V3 or the VBUS LDO, range 3.0-3.6 V; bypass to GND with CLDO_3V3 (5-25 µF, 10 µF nominal).
2 ADCIN1 input Configuration ADC input; connect to LDO_3V3 through a resistor divider, input range 0-3.6 V.
3 ADCIN2 input Configuration ADC input; connect to LDO_3V3 through a resistor divider, input range 0-3.6 V.
4 LDO_1V5 power_out Core LDO output for the internal 1.5 V logic; bypass to GND with CLDO_1V5 (4.5-12 µF) and it cannot supply external circuits.
5 GPIO0 bidirectional General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused.
6 GPIO1 bidirectional General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused.
7 GPIO2 bidirectional General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused.
8 I2Ct_SDA bidirectional I2C target serial data, open-drain, 0-3.6 V; pull up through a resistor, or tie to GND if unused.
9 I2Ct_SCL input I2C target serial clock input, 0-3.6 V; pull up through a resistor, or tie to GND if unused.
10 I2Ct_IRQ output I2C target interrupt, active low, pulled up to an external voltage; can be reconfigured as GPIO10 and tied to GND if unused.
11 GND power_in Ground; connect to the board ground plane.
12 GND power_in Ground; connect to the board ground plane.
13 GPIO11 output General-purpose digital output; tie to GND if unused.
14 GND power_in Ground; connect to the board ground plane.
15 I2Cc_SDA bidirectional I2C controller serial data, open-drain, pulled up to LDO_3V3 whether used or not.
16 I2Cc_SCL output I2C controller serial clock, open-drain, pulled up to LDO_3V3 through a resistor whether used or not.
17 I2Cc_IRQ input I2C controller interrupt, active low, pulled up to an external voltage; do not connect to GND when unused and it can be reconfigured as GPIO12.
18 GPIO3 bidirectional General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused.
19 VSYS input Connect to GND; serves as the reference for POWER_PATH_EN (VSYS range 0-22 V recommended).
20 POWER_PATH_EN output External load-switch power-path enable; not a logic-level output (absolute maximum 12 V with VSYS = GND), leave floating if unused.
21 NC unconnected No connection.
22 GPIO4/USB_P/LD1 bidirectional General-purpose I/O that can connect to USB D+ for BC1.2 support or to the liquid-detection LD1 function; tie to GND if unused.
23 GPIO5/USB_N/LD2 bidirectional General-purpose I/O that can connect to USB D- for BC1.2 support or to the liquid-detection LD2 function; tie to GND if unused.
24 CC1 bidirectional USB Type-C CC1 I/O; filter noise with the recommended capacitor CCC1 to GND (200-480 pF); 26 V tolerant absolute maximum, 0-5.5 V recommended.
25 CC2 bidirectional USB Type-C CC2 I/O; filter noise with the recommended capacitor CCC2 to GND (200-480 pF); 26 V tolerant absolute maximum, 0-5.5 V recommended.
26 VBUS power_in USB VBUS input, 4-22 V recommended (28 V absolute maximum); bypass to GND with CVBUS (1-10 µF).
27 VBUS power_in USB VBUS input, 4-22 V recommended (28 V absolute maximum); bypass to GND with CVBUS (1-10 µF).
28 PP5V power_in 5 V system supply for VBUS through the PP_5V path and VCONN supply for the CCy pins; 4.9-5.5 V recommended, with at least 10 µF.
29 PP5V power_in 5 V system supply for VBUS through the PP_5V path and VCONN supply for the CCy pins; 4.9-5.5 V recommended, with at least 10 µF.
30 GPIO7 bidirectional General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused.
31 GPIO6 bidirectional General-purpose digital I/O, 0-5.5 V recommended; tie to GND if unused.
32 VIN_3V3 power_in Primary 3.3 V supply for core circuits and I/O, 3.0-3.6 V recommended; bypass to GND with CVIN_3V3 (5-10 µF).
33 GND power_in Exposed thermal pad, connected to GND for heat dissipation; solder to the ground plane with multiple vias.

Key specifications

Parameter Value
Manufacturer TEXAS INSTRUMENTS
Package VQFN-32-EP(4x4)
Category Global Sourcing Parts
Pins 33

CAD (KiCad official)

  • Symbol: TPS26750SRSMR
  • Footprint: Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm
  • 3D model: VQFN-32-EP(4x4) (KiCad packages3D, STEP)
  • 3D model files: tps26750srsmr-etched.step / tps26750srsmr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps26750srsmr.step / tps26750srsmr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TEXAS INSTRUMENTS datasheet (66 pp, sha256 422acc8309129bb1, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF