component
TPS259573DSGT
Public Made by Adomby adom
Texas Instruments Surge Suppressors, WSON-8-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TPS259573DSGT
Texas Instruments · Surge Suppressors · WSON-8-EP(2x2)
TPS259573DSGT from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | dVdt | bidirectional | A capacitor from this pin to GND sets the output turn-on slew rate; leave floating for the fastest turn-on slew rate. |
| 2 | EN/OVLO | input | Active-low enable for the TPS2595x3 variants; a resistor divider can adjust the overvoltage lockout threshold, and the pin must not be left floating (absolute max 7 V, recommended 0 to 6 V). |
| 3 | IN | power_in | Power input (2.7 V to 18 V recommended operating range for TPS2595x3, 20 V absolute maximum), shorted to pin 4. |
| 4 | IN | power_in | Power input (2.7 V to 18 V recommended operating range for TPS2595x3, 20 V absolute maximum), shorted to pin 3. |
| 5 | OUT | power_out | Power output of the eFuse switch, with a maximum voltage of VIN + 0.3 V. |
| 6 | FLT | output | Open-drain fault indicator pulled low when a fault is detected, requiring an external pull-up resistor (max 7 V, 10 mA sink). |
| 7 | ILM | bidirectional | Dual-function pin where an external resistor to GND (487 Ω to 5000 Ω) sets the output current limit and the pin voltage monitors load current; do not leave floating. |
| 8 | GND | power_in | Ground. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IN quiescent current (TPS2595x3) | IQ | 175 | 250 | µA | VEN ≤ VOVLO | 7 | |
| IN shutdown current (TPS2595x3) | ISD | 45 | 65 | µA | VEN > 2 V | 7 | |
| IN undervoltage protection threshold rising | VUVP | 2.44 | 2.54 | 2.64 | V | TPS2595x0/1/3, VIN Rising | 7 |
| IN undervoltage protection threshold falling | VUVP | 2.33 | 2.43 | 2.53 | V | TPS2595x0/1/3, VIN Falling | 7 |
| Current monitor gain | GIMON | 254 | 276 | 299 | µA/A | IOUT = 4 A | 7 |
| Current monitor gain | GIMON | 249 | 276 | 304 | µA/A | IOUT = 1 A | 7 |
| Current limit | ILIMIT | 3.87 | 4.17 | 4.42 | A | RILM = 487 Ω | 7 |
| Current limit | ILIMIT | 1.09 | 1.17 | 1.24 | A | RILM = 1780 Ω | 7 |
| Current limit | ILIMIT | 0.46 | 0.49 | 0.52 | A | RILM = 4420 Ω | 7 |
| Current limit, RILM open | ILIMIT | 0 | A | RILM = Open (Single Point Failure Test IEC 62368-1) | 7 | ||
| Circuit breaker threshold during RILM short | ICB | 3 | A | RILM = Short to GND (Single Point Failure Test IEC 62368-1) | 7 | ||
| Current limit response time | tLIM | 250 | µs | IOUT > ILIMIT + 20% to IOUT ≤ ILIMIT | 7 | ||
| Short circuit response time | tSC | 5 | µs | IOUT > ISC to IOUT ≤ ILIMIT | 7 | ||
| ON state resistance | RON | 34 | 37 | mΩ | VIN = 4 V to 18 V, TJ = 25°C | 7 | |
| ON state resistance | RON | 47 | mΩ | VIN = 4 V to 18 V, TJ = -40°C to 85°C | 7 | ||
| ON state resistance | RON | 53 | mΩ | VIN = 4 V to 18 V, TJ = -40°C to 125°C | 7 | ||
| ON state resistance | RON | 36 | 40 | mΩ | VIN = 2.7 V to 4 V, TJ = 25°C | 7 | |
| ON state resistance | RON | 51 | mΩ | VIN = 2.7 V to 4 V, TJ = -40°C to 85°C | 7 | ||
| ON state resistance | RON | 58 | mΩ | VIN = 2.7 V to 4 V, TJ = -40°C to 125°C | 7 | ||
| EN/OVLO pin leakage current | IEN | -0.1 | 0.1 | µA | 8 | ||
| Overvoltage lockout threshold rising | VOVLO(R) | 1.13 | 1.2 | 1.27 | V | VEN rising | 8 |
| Overvoltage lockout threshold falling | VOVLO(F) | 1.03 | 1.1 | 1.17 | V | VEN falling | 8 |
| Overvoltage lockout response time | tOVLO | 3 | µs | VEN > VOVLO to FLT ↓ | 8 | ||
| FLT pin resistance | RFLTB | 12 | Ω | FLT ↓ | 8 | ||
| FLT pin leakage current | IFLTB | -0.1 | 0.1 | µA | VEN = 2 V, VFLTB = 0 V to 6 V | 8 | |
| Thermal shutdown | TSD | 157 | °C | TJ Rising | 8 | ||
| Thermal shutdown hysteresis | TSDHYS | 5 | °C | TJ Falling | 8 | ||
| Thermal shutdown auto-retry interval | tTSD,RST | 93 | ms | TPS2595x1/3/5, Device Enabled and TJ < TSD - TSDHYS | 8 | ||
| Maximum input voltage | VIN | -0.3 | 20 | V | IN | 5 | |
| Maximum output voltage (min value; max is VIN + 0.3) | VOUT | -0.3 | V | OUT | 5 | ||
| Minimum output voltage pulse (< 1 µs) | VOUT,PLS | -1.2 | V | OUT | 5 | ||
| Maximum enable pin voltage | VEN | -0.3 | 7 | V | EN/UVLO or EN/OVLO | 5 | |
| Maximum fault pin voltage | VFLTB | -0.3 | 7 | V | FLT (TPS2595x0/1/3) | 5 | |
| Maximum dVdt pin voltage | VdVdt | 2.5 | V | dVdt | 5 | ||
| Maximum fault pin sink current | IFLTB | 10 | mA | FLT | 5 | ||
| Maximum lead temperature | TLEAD | 300 | °C | 5 | |||
| Storage temperature | TSTG | -65 | 150 | °C | 5 | ||
| ESD human-body model | V(ESD) | -2500 | 2500 | V | HBM, per ANSI/ESDA/JEDEC JS-001 | 5 | |
| ESD charged-device model | V(ESD) | -500 | 500 | V | CDM, per JEDEC specification JESD22-C101 | 5 | |
| Input voltage range | VIN | 2.7 | 18 | V | IN (TPS2595x0/1/3) | 5 | |
| Output voltage (min; max is VIN + 0.3) | VOUT | 0 | V | OUT | 5 | ||
| Enable pin voltage | VEN | 0 | 6 | V | EN/UVLO or EN/OVLO | 5 | |
| Fault pin voltage | VFLTB | 0 | 6 | V | FLT (TPS2595x0/1/3) | 5 | |
| Continuous output current | IMAX | 4 | A | TJ = -40 to 125°C, IN to OUT | 5 | ||
| Continuous output current | IMAX | 5 | A | TJ = -40 to 105°C, IN to OUT (guaranteed by design) | 5 | ||
| ILM pin resistance | RILM | 487 | 5000 | Ω | Active Current Limiting Operation | 5 | |
| dVdt capacitor value | CdVdt | 3300 | pF | dVdt | 5 | ||
| dVdt pin capacitor voltage rating | VdVdt | 4 | V | dVdt | 5 | ||
| Operating junction temperature | TJ | -40 | 125 | °C | 5 | ||
| Junction-to-ambient thermal resistance | RθJA | 65.6 | °C/W | DSG (WSON) 8 pins | 6 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 73.3 | °C/W | DSG (WSON) 8 pins | 6 | ||
| Junction-to-board thermal resistance | RθJB | 28.3 | °C/W | DSG (WSON) 8 pins | 6 | ||
| Junction-to-top characterization parameter | ψJT | 2 | °C/W | DSG (WSON) 8 pins | 6 | ||
| Junction-to-board characterization parameter | ψJB | 28.4 | °C/W | DSG (WSON) 8 pins | 6 | ||
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | 9.8 | °C/W | DSG (WSON) 8 pins | 6 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | • The GND terminal must be tied to the PCB ground plane at the terminal of the IC. The PCB ground must be a copper plane or island on the board. | 34 |
CAD (KiCad official)
- Symbol:
TPS259573DSGT - Footprint:
Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm - 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
tps259573dsgt-etched.step/tps259573dsgt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps259573dsgt.step/tps259573dsgt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (49 pp, sha256
b698e7a77d527882, retrieved 2026-10-27, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPS259573DSGT
**Texas Instruments** · Surge Suppressors · WSON-8-EP(2x2)
TPS259573DSGT from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | dVdt | bidirectional | A capacitor from this pin to GND sets the output turn-on slew rate; leave floating for the fastest turn-on slew rate. |
| 2 | EN/OVLO | input | Active-low enable for the TPS2595x3 variants; a resistor divider can adjust the overvoltage lockout threshold, and the pin must not be left floating (absolute max 7 V, recommended 0 to 6 V). |
| 3 | IN | power_in | Power input (2.7 V to 18 V recommended operating range for TPS2595x3, 20 V absolute maximum), shorted to pin 4. |
| 4 | IN | power_in | Power input (2.7 V to 18 V recommended operating range for TPS2595x3, 20 V absolute maximum), shorted to pin 3. |
| 5 | OUT | power_out | Power output of the eFuse switch, with a maximum voltage of VIN + 0.3 V. |
| 6 | FLT | output | Open-drain fault indicator pulled low when a fault is detected, requiring an external pull-up resistor (max 7 V, 10 mA sink). |
| 7 | ILM | bidirectional | Dual-function pin where an external resistor to GND (487 Ω to 5000 Ω) sets the output current limit and the pin voltage monitors load current; do not leave floating. |
| 8 | GND | power_in | Ground. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-8-EP(2x2) |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 9 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| IN quiescent current (TPS2595x3) | IQ | | 175 | 250 | µA | VEN ≤ VOVLO | 7 |
| IN shutdown current (TPS2595x3) | ISD | | 45 | 65 | µA | VEN > 2 V | 7 |
| IN undervoltage protection threshold rising | VUVP | 2.44 | 2.54 | 2.64 | V | TPS2595x0/1/3, VIN Rising | 7 |
| IN undervoltage protection threshold falling | VUVP | 2.33 | 2.43 | 2.53 | V | TPS2595x0/1/3, VIN Falling | 7 |
| Current monitor gain | GIMON | 254 | 276 | 299 | µA/A | IOUT = 4 A | 7 |
| Current monitor gain | GIMON | 249 | 276 | 304 | µA/A | IOUT = 1 A | 7 |
| Current limit | ILIMIT | 3.87 | 4.17 | 4.42 | A | RILM = 487 Ω | 7 |
| Current limit | ILIMIT | 1.09 | 1.17 | 1.24 | A | RILM = 1780 Ω | 7 |
| Current limit | ILIMIT | 0.46 | 0.49 | 0.52 | A | RILM = 4420 Ω | 7 |
| Current limit, RILM open | ILIMIT | | 0 | | A | RILM = Open (Single Point Failure Test IEC 62368-1) | 7 |
| Circuit breaker threshold during RILM short | ICB | | 3 | | A | RILM = Short to GND (Single Point Failure Test IEC 62368-1) | 7 |
| Current limit response time | tLIM | | 250 | | µs | IOUT > ILIMIT + 20% to IOUT ≤ ILIMIT | 7 |
| Short circuit response time | tSC | | 5 | | µs | IOUT > ISC to IOUT ≤ ILIMIT | 7 |
| ON state resistance | RON | | 34 | 37 | mΩ | VIN = 4 V to 18 V, TJ = 25°C | 7 |
| ON state resistance | RON | | | 47 | mΩ | VIN = 4 V to 18 V, TJ = -40°C to 85°C | 7 |
| ON state resistance | RON | | | 53 | mΩ | VIN = 4 V to 18 V, TJ = -40°C to 125°C | 7 |
| ON state resistance | RON | | 36 | 40 | mΩ | VIN = 2.7 V to 4 V, TJ = 25°C | 7 |
| ON state resistance | RON | | | 51 | mΩ | VIN = 2.7 V to 4 V, TJ = -40°C to 85°C | 7 |
| ON state resistance | RON | | | 58 | mΩ | VIN = 2.7 V to 4 V, TJ = -40°C to 125°C | 7 |
| EN/OVLO pin leakage current | IEN | -0.1 | | 0.1 | µA | | 8 |
| Overvoltage lockout threshold rising | VOVLO(R) | 1.13 | 1.2 | 1.27 | V | VEN rising | 8 |
| Overvoltage lockout threshold falling | VOVLO(F) | 1.03 | 1.1 | 1.17 | V | VEN falling | 8 |
| Overvoltage lockout response time | tOVLO | | 3 | | µs | VEN > VOVLO to FLT ↓ | 8 |
| FLT pin resistance | RFLTB | | 12 | | Ω | FLT ↓ | 8 |
| FLT pin leakage current | IFLTB | -0.1 | | 0.1 | µA | VEN = 2 V, VFLTB = 0 V to 6 V | 8 |
| Thermal shutdown | TSD | | 157 | | °C | TJ Rising | 8 |
| Thermal shutdown hysteresis | TSDHYS | | 5 | | °C | TJ Falling | 8 |
| Thermal shutdown auto-retry interval | tTSD,RST | | 93 | | ms | TPS2595x1/3/5, Device Enabled and TJ < TSD - TSDHYS | 8 |
| Maximum input voltage | VIN | -0.3 | | 20 | V | IN | 5 |
| Maximum output voltage (min value; max is VIN + 0.3) | VOUT | -0.3 | | | V | OUT | 5 |
| Minimum output voltage pulse (< 1 µs) | VOUT,PLS | -1.2 | | | V | OUT | 5 |
| Maximum enable pin voltage | VEN | -0.3 | | 7 | V | EN/UVLO or EN/OVLO | 5 |
| Maximum fault pin voltage | VFLTB | -0.3 | | 7 | V | FLT (TPS2595x0/1/3) | 5 |
| Maximum dVdt pin voltage | VdVdt | | | 2.5 | V | dVdt | 5 |
| Maximum fault pin sink current | IFLTB | | | 10 | mA | FLT | 5 |
| Maximum lead temperature | TLEAD | | | 300 | °C | | 5 |
| Storage temperature | TSTG | -65 | | 150 | °C | | 5 |
| ESD human-body model | V(ESD) | -2500 | | 2500 | V | HBM, per ANSI/ESDA/JEDEC JS-001 | 5 |
| ESD charged-device model | V(ESD) | -500 | | 500 | V | CDM, per JEDEC specification JESD22-C101 | 5 |
| Input voltage range | VIN | 2.7 | | 18 | V | IN (TPS2595x0/1/3) | 5 |
| Output voltage (min; max is VIN + 0.3) | VOUT | 0 | | | V | OUT | 5 |
| Enable pin voltage | VEN | 0 | | 6 | V | EN/UVLO or EN/OVLO | 5 |
| Fault pin voltage | VFLTB | 0 | | 6 | V | FLT (TPS2595x0/1/3) | 5 |
| Continuous output current | IMAX | | | 4 | A | TJ = -40 to 125°C, IN to OUT | 5 |
| Continuous output current | IMAX | | | 5 | A | TJ = -40 to 105°C, IN to OUT (guaranteed by design) | 5 |
| ILM pin resistance | RILM | 487 | | 5000 | Ω | Active Current Limiting Operation | 5 |
| dVdt capacitor value | CdVdt | | | 3300 | pF | dVdt | 5 |
| dVdt pin capacitor voltage rating | VdVdt | | | 4 | V | dVdt | 5 |
| Operating junction temperature | TJ | -40 | | 125 | °C | | 5 |
| Junction-to-ambient thermal resistance | RθJA | | 65.6 | | °C/W | DSG (WSON) 8 pins | 6 |
| Junction-to-case (top) thermal resistance | RθJC(top) | | 73.3 | | °C/W | DSG (WSON) 8 pins | 6 |
| Junction-to-board thermal resistance | RθJB | | 28.3 | | °C/W | DSG (WSON) 8 pins | 6 |
| Junction-to-top characterization parameter | ψJT | | 2 | | °C/W | DSG (WSON) 8 pins | 6 |
| Junction-to-board characterization parameter | ψJB | | 28.4 | | °C/W | DSG (WSON) 8 pins | 6 |
| Junction-to-case (bottom) thermal resistance | RθJC(bot) | | 9.8 | | °C/W | DSG (WSON) 8 pins | 6 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | | • The GND terminal must be tied to the PCB ground plane at the terminal of the IC. The PCB ground must be a copper plane or island on the board. | 34 |
## CAD (KiCad official)
- Symbol: `TPS259573DSGT`
- Footprint: `Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm`
- 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `tps259573dsgt-etched.step` / `tps259573dsgt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps259573dsgt.step` / `tps259573dsgt.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/tps259573dsgt.pdf) (49 pp, sha256 `b698e7a77d527882`, retrieved 2026-10-27, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tps259573dsgt-datasheet.pdf)