Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

TPS259573DSGT

Texas Instruments · Surge Suppressors · WSON-8-EP(2x2)

TPS259573DSGT from Texas Instruments, in a WSON-8-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 dVdt bidirectional A capacitor from this pin to GND sets the output turn-on slew rate; leave floating for the fastest turn-on slew rate.
2 EN/OVLO input Active-low enable for the TPS2595x3 variants; a resistor divider can adjust the overvoltage lockout threshold, and the pin must not be left floating (absolute max 7 V, recommended 0 to 6 V).
3 IN power_in Power input (2.7 V to 18 V recommended operating range for TPS2595x3, 20 V absolute maximum), shorted to pin 4.
4 IN power_in Power input (2.7 V to 18 V recommended operating range for TPS2595x3, 20 V absolute maximum), shorted to pin 3.
5 OUT power_out Power output of the eFuse switch, with a maximum voltage of VIN + 0.3 V.
6 FLT output Open-drain fault indicator pulled low when a fault is detected, requiring an external pull-up resistor (max 7 V, 10 mA sink).
7 ILM bidirectional Dual-function pin where an external resistor to GND (487 Ω to 5000 Ω) sets the output current limit and the pin voltage monitors load current; do not leave floating.
8 GND power_in Ground.
9 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WSON-8-EP(2x2)
Category TVS/Fuse/Board Level Protection
Pins 9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
IN quiescent current (TPS2595x3) IQ 175 250 µA VEN ≤ VOVLO 7
IN shutdown current (TPS2595x3) ISD 45 65 µA VEN > 2 V 7
IN undervoltage protection threshold rising VUVP 2.44 2.54 2.64 V TPS2595x0/1/3, VIN Rising 7
IN undervoltage protection threshold falling VUVP 2.33 2.43 2.53 V TPS2595x0/1/3, VIN Falling 7
Current monitor gain GIMON 254 276 299 µA/A IOUT = 4 A 7
Current monitor gain GIMON 249 276 304 µA/A IOUT = 1 A 7
Current limit ILIMIT 3.87 4.17 4.42 A RILM = 487 Ω 7
Current limit ILIMIT 1.09 1.17 1.24 A RILM = 1780 Ω 7
Current limit ILIMIT 0.46 0.49 0.52 A RILM = 4420 Ω 7
Current limit, RILM open ILIMIT 0 A RILM = Open (Single Point Failure Test IEC 62368-1) 7
Circuit breaker threshold during RILM short ICB 3 A RILM = Short to GND (Single Point Failure Test IEC 62368-1) 7
Current limit response time tLIM 250 µs IOUT > ILIMIT + 20% to IOUT ≤ ILIMIT 7
Short circuit response time tSC 5 µs IOUT > ISC to IOUT ≤ ILIMIT 7
ON state resistance RON 34 37 mΩ VIN = 4 V to 18 V, TJ = 25°C 7
ON state resistance RON 47 mΩ VIN = 4 V to 18 V, TJ = -40°C to 85°C 7
ON state resistance RON 53 mΩ VIN = 4 V to 18 V, TJ = -40°C to 125°C 7
ON state resistance RON 36 40 mΩ VIN = 2.7 V to 4 V, TJ = 25°C 7
ON state resistance RON 51 mΩ VIN = 2.7 V to 4 V, TJ = -40°C to 85°C 7
ON state resistance RON 58 mΩ VIN = 2.7 V to 4 V, TJ = -40°C to 125°C 7
EN/OVLO pin leakage current IEN -0.1 0.1 µA 8
Overvoltage lockout threshold rising VOVLO(R) 1.13 1.2 1.27 V VEN rising 8
Overvoltage lockout threshold falling VOVLO(F) 1.03 1.1 1.17 V VEN falling 8
Overvoltage lockout response time tOVLO 3 µs VEN > VOVLO to FLT ↓ 8
FLT pin resistance RFLTB 12 Ω FLT ↓ 8
FLT pin leakage current IFLTB -0.1 0.1 µA VEN = 2 V, VFLTB = 0 V to 6 V 8
Thermal shutdown TSD 157 °C TJ Rising 8
Thermal shutdown hysteresis TSDHYS 5 °C TJ Falling 8
Thermal shutdown auto-retry interval tTSD,RST 93 ms TPS2595x1/3/5, Device Enabled and TJ < TSD - TSDHYS 8
Maximum input voltage VIN -0.3 20 V IN 5
Maximum output voltage (min value; max is VIN + 0.3) VOUT -0.3 V OUT 5
Minimum output voltage pulse (< 1 µs) VOUT,PLS -1.2 V OUT 5
Maximum enable pin voltage VEN -0.3 7 V EN/UVLO or EN/OVLO 5
Maximum fault pin voltage VFLTB -0.3 7 V FLT (TPS2595x0/1/3) 5
Maximum dVdt pin voltage VdVdt 2.5 V dVdt 5
Maximum fault pin sink current IFLTB 10 mA FLT 5
Maximum lead temperature TLEAD 300 °C 5
Storage temperature TSTG -65 150 °C 5
ESD human-body model V(ESD) -2500 2500 V HBM, per ANSI/ESDA/JEDEC JS-001 5
ESD charged-device model V(ESD) -500 500 V CDM, per JEDEC specification JESD22-C101 5
Input voltage range VIN 2.7 18 V IN (TPS2595x0/1/3) 5
Output voltage (min; max is VIN + 0.3) VOUT 0 V OUT 5
Enable pin voltage VEN 0 6 V EN/UVLO or EN/OVLO 5
Fault pin voltage VFLTB 0 6 V FLT (TPS2595x0/1/3) 5
Continuous output current IMAX 4 A TJ = -40 to 125°C, IN to OUT 5
Continuous output current IMAX 5 A TJ = -40 to 105°C, IN to OUT (guaranteed by design) 5
ILM pin resistance RILM 487 5000 Ω Active Current Limiting Operation 5
dVdt capacitor value CdVdt 3300 pF dVdt 5
dVdt pin capacitor voltage rating VdVdt 4 V dVdt 5
Operating junction temperature TJ -40 125 °C 5
Junction-to-ambient thermal resistance RθJA 65.6 °C/W DSG (WSON) 8 pins 6
Junction-to-case (top) thermal resistance RθJC(top) 73.3 °C/W DSG (WSON) 8 pins 6
Junction-to-board thermal resistance RθJB 28.3 °C/W DSG (WSON) 8 pins 6
Junction-to-top characterization parameter ψJT 2 °C/W DSG (WSON) 8 pins 6
Junction-to-board characterization parameter ψJB 28.4 °C/W DSG (WSON) 8 pins 6
Junction-to-case (bottom) thermal resistance RθJC(bot) 9.8 °C/W DSG (WSON) 8 pins 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper • The GND terminal must be tied to the PCB ground plane at the terminal of the IC. The PCB ground must be a copper plane or island on the board. 34

CAD (KiCad official)

  • Symbol: TPS259573DSGT
  • Footprint: Package_SON:WSON-8-1EP_2x2mm_P0.5mm_EP0.9x1.6mm
  • 3D model: WSON-8-EP(2x2) (KiCad packages3D, STEP)
  • 3D model files: tps259573dsgt-etched.step / tps259573dsgt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps259573dsgt.step / tps259573dsgt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (49 pp, sha256 b698e7a77d527882, retrieved 2026-10-27, tier: manufacturer)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF