component
TPS25750SRSMR
Public Made by Adomby adom
Texas Instruments Power Management - Specialized, VQFN-32(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TPS25750SRSMR
Texas Instruments · Power Management - Specialized · VQFN-32(4x4)
TPS25750SRSMR from Texas Instruments, in a VQFN-32(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | LDO_3V3 | power_out | Output of the supply switched from VIN_3V3 or the VBUS LDO; bypass with capacitance CLDO_3V3 to GND. |
| 2 | ADCIN1 | input | Configuration input connected to a resistor divider from LDO_3V3; absolute maximum range is -0.3 V to 4 V. |
| 3 | ADCIN2 | input | Configuration input connected to a resistor divider from LDO_3V3; absolute maximum range is -0.3 V to 4 V. |
| 4 | LDO_1V5 | power_out | Output of the CORE LDO; bypass with capacitance CLDO_1V5 to GND, and this pin cannot source current to external circuits. |
| 5 | GPIO0 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 6 | GPIO1 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 7 | GPIO2 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 8 | I2Cs_SDA | bidirectional | I2C slave serial data, open-drain input/output; tie to pull-up voltage through a resistor, or ground if unused. |
| 9 | I2Cs_SCL | input | I2C slave serial clock input; tie to pull-up voltage through a resistor, or ground if unused. |
| 10 | I2Cs_IRQ | output | I2C slave interrupt, active low; connect to an external voltage through a pull-up resistor, may be re-configured to GPIO10, and tie to ground when unused. |
| 11 | GND | power_in | Ground; connect to the ground plane. |
| 12 | GND | power_in | Ground; connect to the ground plane. |
| 13 | GPIO11 | output | General-purpose digital output; tie to ground when unused. |
| 14 | GND | power_in | Ground; connect to the ground plane. |
| 15 | I2Cm_SDA | bidirectional | I2C master serial data, open-drain input/output; tie to pull-up voltage through a resistor when used or unused. |
| 16 | I2Cm_SCL | output | I2C master serial clock, open-drain output; tie to pull-up voltage through a resistor when used or unused. |
| 17 | I2Cm_IRQ | input | I2C master interrupt, active low; connect to an external voltage through a pull-up resistor, tie to ground when unused, and may be re-configured to GPIO12. |
| 18 | GPIO3 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 19 | VSYS | power_in | High-voltage sinking node used to implement reverse-current protection (RCP) for the external sinking paths controlled by GATE_VSYS. |
| 20 | GATE_VSYS | output | Drives the gate of an N-channel MOSFET whose source is tied to VSYS; absolute maximum output voltage is 40 V. |
| 21 | GATE_VBUS | output | Drives the gate of an N-channel MOSFET whose source is tied to VBUS; absolute maximum output voltage is 40 V. |
| 22 | GPIO4 (USB_P) | bidirectional | General-purpose digital I/O that may be connected to D+ for BC1.2 support; tie to ground when unused. |
| 23 | GPIO5 (USB_N) | bidirectional | General-purpose digital I/O that may be connected to D- for BC1.2 support; tie to ground when unused. |
| 24 | CC1 | bidirectional | I/O for USB Type-C; filter noise with the recommended capacitor to GND (CCCy); absolute maximum range is -0.5 V to 26 V. |
| 25 | CC2 | bidirectional | I/O for USB Type-C; filter noise with the recommended capacitor to GND (CCCy); absolute maximum range is -0.5 V to 26 V. |
| 26 | VBUS | power_in | 5-V to 20-V input; bypass with capacitance CVBUS to GND. |
| 27 | VBUS | power_in | 5-V to 20-V input; bypass with capacitance CVBUS to GND. |
| 28 | PP5V | power_in | 5-V system supply to VBUS and supply for the CCy pins as VCONN; absolute maximum is 6 V. |
| 29 | PP5V | power_in | 5-V system supply to VBUS and supply for the CCy pins as VCONN; absolute maximum is 6 V. |
| 30 | GPIO7 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 31 | GPIO6 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 32 | VIN_3V3 | power_in | Supply for core circuitry and I/O; bypass with capacitance CVIN_3V3 to GND, with absolute maximum of 4 V. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-32(4x4) |
| Category | Power Management (PMIC) |
| Pins | 33 |
CAD (KiCad official)
- Symbol:
TPS25750SRSMR - Footprint:
Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm - 3D model: VQFN-32(4x4) (KiCad packages3D, STEP)
- 3D model files:
tps25750srsmr-etched.step/tps25750srsmr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps25750srsmr.step/tps25750srsmr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (79 pp, sha256
a67213f1bd1b7c0b, retrieved 2026-10-08, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPS25750SRSMR
**Texas Instruments** · Power Management - Specialized · VQFN-32(4x4)
TPS25750SRSMR from Texas Instruments, in a VQFN-32(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | LDO_3V3 | power_out | Output of the supply switched from VIN_3V3 or the VBUS LDO; bypass with capacitance CLDO_3V3 to GND. |
| 2 | ADCIN1 | input | Configuration input connected to a resistor divider from LDO_3V3; absolute maximum range is -0.3 V to 4 V. |
| 3 | ADCIN2 | input | Configuration input connected to a resistor divider from LDO_3V3; absolute maximum range is -0.3 V to 4 V. |
| 4 | LDO_1V5 | power_out | Output of the CORE LDO; bypass with capacitance CLDO_1V5 to GND, and this pin cannot source current to external circuits. |
| 5 | GPIO0 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 6 | GPIO1 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 7 | GPIO2 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 8 | I2Cs_SDA | bidirectional | I2C slave serial data, open-drain input/output; tie to pull-up voltage through a resistor, or ground if unused. |
| 9 | I2Cs_SCL | input | I2C slave serial clock input; tie to pull-up voltage through a resistor, or ground if unused. |
| 10 | I2Cs_IRQ | output | I2C slave interrupt, active low; connect to an external voltage through a pull-up resistor, may be re-configured to GPIO10, and tie to ground when unused. |
| 11 | GND | power_in | Ground; connect to the ground plane. |
| 12 | GND | power_in | Ground; connect to the ground plane. |
| 13 | GPIO11 | output | General-purpose digital output; tie to ground when unused. |
| 14 | GND | power_in | Ground; connect to the ground plane. |
| 15 | I2Cm_SDA | bidirectional | I2C master serial data, open-drain input/output; tie to pull-up voltage through a resistor when used or unused. |
| 16 | I2Cm_SCL | output | I2C master serial clock, open-drain output; tie to pull-up voltage through a resistor when used or unused. |
| 17 | I2Cm_IRQ | input | I2C master interrupt, active low; connect to an external voltage through a pull-up resistor, tie to ground when unused, and may be re-configured to GPIO12. |
| 18 | GPIO3 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 19 | VSYS | power_in | High-voltage sinking node used to implement reverse-current protection (RCP) for the external sinking paths controlled by GATE_VSYS. |
| 20 | GATE_VSYS | output | Drives the gate of an N-channel MOSFET whose source is tied to VSYS; absolute maximum output voltage is 40 V. |
| 21 | GATE_VBUS | output | Drives the gate of an N-channel MOSFET whose source is tied to VBUS; absolute maximum output voltage is 40 V. |
| 22 | GPIO4 (USB_P) | bidirectional | General-purpose digital I/O that may be connected to D+ for BC1.2 support; tie to ground when unused. |
| 23 | GPIO5 (USB_N) | bidirectional | General-purpose digital I/O that may be connected to D- for BC1.2 support; tie to ground when unused. |
| 24 | CC1 | bidirectional | I/O for USB Type-C; filter noise with the recommended capacitor to GND (CCCy); absolute maximum range is -0.5 V to 26 V. |
| 25 | CC2 | bidirectional | I/O for USB Type-C; filter noise with the recommended capacitor to GND (CCCy); absolute maximum range is -0.5 V to 26 V. |
| 26 | VBUS | power_in | 5-V to 20-V input; bypass with capacitance CVBUS to GND. |
| 27 | VBUS | power_in | 5-V to 20-V input; bypass with capacitance CVBUS to GND. |
| 28 | PP5V | power_in | 5-V system supply to VBUS and supply for the CCy pins as VCONN; absolute maximum is 6 V. |
| 29 | PP5V | power_in | 5-V system supply to VBUS and supply for the CCy pins as VCONN; absolute maximum is 6 V. |
| 30 | GPIO7 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 31 | GPIO6 | bidirectional | General-purpose digital I/O; tie to ground when unused. |
| 32 | VIN_3V3 | power_in | Supply for core circuitry and I/O; bypass with capacitance CVIN_3V3 to GND, with absolute maximum of 4 V. |
| 33 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-32(4x4) |
| Category | Power Management (PMIC) |
| Pins | 33 |
## CAD (KiCad official)
- Symbol: `TPS25750SRSMR`
- Footprint: `Package_DFN_QFN:QFN-32-1EP_4x4mm_P0.4mm_EP2.9x2.9mm`
- 3D model: VQFN-32(4x4) (KiCad packages3D, STEP)
- 3D model files: `tps25750srsmr-etched.step` / `tps25750srsmr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps25750srsmr.step` / `tps25750srsmr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tps25750) (79 pp, sha256 `a67213f1bd1b7c0b`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tps25750srsmr-datasheet.pdf)