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Ray Initial commit: component/tps2511qdgnrq1 fe68298 9d ago

TPS2511QDGNRQ1

Texas Instruments · Power Distribution Switches · MSOP-8-EP

TPS2511QDGNRQ1 from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground reference; all voltages referenced to this pin.
2 ILIM_SET passive Current-limit programming pin; an external resistor from this pin to GND sets the overcurrent threshold; recommended range 16.9 kΩ ≤ RILIM_SET ≤ 750 kΩ.
3 IN power_in Power-supply input to the high-side MOSFET switch; operating range 4.5 V to 5.5 V; decouple with ≥0.1-µF ceramic capacitor to GND as close to the pin as possible.
4 CS tri_state Active-low open-drain current-sense output; asserted when OUT current exceeds approximately half the ILIM_SET-programmed current limit; maximum sink current 10 mA.
5 EN input Logic-level enable input (TTL/CMOS compatible); high enables the power switch and DCP circuitry, low turns the power switch off and forces DP/DM to high impedance; falling threshold 0.9 V-1.65 V.
6 DP bidirectional USB D+ or D- data line; auto-detect logic drives 2.7 V, 2.0 V, or 1.2 V for DCP identification or shorts to DM for BC1.2 mode; high impedance when disabled.
7 DM bidirectional USB D- or D+ data line; auto-detect logic drives 2.0 V, 2.7 V, or 1.2 V for DCP identification or shorts to DP for BC1.2 mode; high impedance when disabled.
8 OUT power_out Power-switch output connected to USB VBUS; 80 mΩ typical RDS(on) at 2 A, 2.2 A continuous rated output current; includes 500 Ω discharge resistor to GND when disabled.
9 PAD power_in Exposed thermal PowerPAD; must be soldered to the GND plane with a via array for both electrical ground connection and thermal dissipation; θJCbot = 13.4 °C/W.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package MSOP-8-EP
Category Power Management (PMIC)
Pins 9

CAD (KiCad official)

  • Symbol: TPS2511QDGNRQ1
  • Footprint: Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm
  • 3D model: MSOP-8-EP (KiCad packages3D, STEP)
  • 3D model files: tps2511qdgnrq1-etched.step / tps2511qdgnrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tps2511qdgnrq1.step / tps2511qdgnrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (30 pp, sha256 a204181e0b97a899, retrieved 2026-09-26, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF