component
TPS2511QDGNRQ1
Public Made by Adomby adom
Texas Instruments Power Distribution Switches, MSOP-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPS2511QDGNRQ1
Texas Instruments · Power Distribution Switches · MSOP-8-EP
TPS2511QDGNRQ1 from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference; all voltages referenced to this pin. |
| 2 | ILIM_SET | passive | Current-limit programming pin; an external resistor from this pin to GND sets the overcurrent threshold; recommended range 16.9 kΩ ≤ RILIM_SET ≤ 750 kΩ. |
| 3 | IN | power_in | Power-supply input to the high-side MOSFET switch; operating range 4.5 V to 5.5 V; decouple with ≥0.1-µF ceramic capacitor to GND as close to the pin as possible. |
| 4 | CS | tri_state | Active-low open-drain current-sense output; asserted when OUT current exceeds approximately half the ILIM_SET-programmed current limit; maximum sink current 10 mA. |
| 5 | EN | input | Logic-level enable input (TTL/CMOS compatible); high enables the power switch and DCP circuitry, low turns the power switch off and forces DP/DM to high impedance; falling threshold 0.9 V-1.65 V. |
| 6 | DP | bidirectional | USB D+ or D- data line; auto-detect logic drives 2.7 V, 2.0 V, or 1.2 V for DCP identification or shorts to DM for BC1.2 mode; high impedance when disabled. |
| 7 | DM | bidirectional | USB D- or D+ data line; auto-detect logic drives 2.0 V, 2.7 V, or 1.2 V for DCP identification or shorts to DP for BC1.2 mode; high impedance when disabled. |
| 8 | OUT | power_out | Power-switch output connected to USB VBUS; 80 mΩ typical RDS(on) at 2 A, 2.2 A continuous rated output current; includes 500 Ω discharge resistor to GND when disabled. |
| 9 | PAD | power_in | Exposed thermal PowerPAD; must be soldered to the GND plane with a via array for both electrical ground connection and thermal dissipation; θJCbot = 13.4 °C/W. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | MSOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
TPS2511QDGNRQ1 - Footprint:
Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm - 3D model: MSOP-8-EP (KiCad packages3D, STEP)
- 3D model files:
tps2511qdgnrq1-etched.step/tps2511qdgnrq1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tps2511qdgnrq1.step/tps2511qdgnrq1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (30 pp, sha256
a204181e0b97a899, retrieved 2026-09-26, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-4-6(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).