# TPS2062QDGNRQ1

**Texas Instruments** · Power Distribution Switches · MSOP-8-EP

TPS2062QDGNRQ1 from Texas Instruments, in a MSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference for the device; all device voltages are specified with respect to GND, and the exposed PowerPAD must be connected to this pin. |
| 2 | IN | power_in | Input voltage to the power switches, recommended 2.7 V to 5.5 V with an absolute maximum range of -0.3 V to 6 V. |
| 3 | EN1 | input | Enable input for the IN-OUT1 power switch; a logic low turns the switch on, with a recommended input range of 0 V to 5.5 V. |
| 4 | EN2 | input | Enable input for the IN-OUT2 power switch; a logic low turns the switch on, with a recommended input range of 0 V to 5.5 V. |
| 5 | OC2 | output | Open-drain overcurrent output for IN-OUT2, asserted active low after a 10-ms deglitch on overcurrent or overtemperature, with output low voltage of 0.4 V max at 5 mA. |
| 6 | OUT2 | output | Power-switch output for IN-OUT2, rated for a continuous output current of 0 to 1 A. |
| 7 | OUT1 | output | Power-switch output for IN-OUT1, rated for a continuous output current of 0 to 1 A. |
| 8 | OC1 | output | Open-drain overcurrent output for IN-OUT1, asserted active low after a 10-ms deglitch on overcurrent or overtemperature, with output low voltage of 0.4 V max at 5 mA. |
| 9 | PowerPAD | power_in | Exposed thermal pad internally connected to GND, used to heat-sink the part to the board; it should be connected to the GND pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | MSOP-8-EP |
| Category | Power Management (PMIC) |
| Pins | 9 |

## CAD (KiCad official)

- Symbol: `TPS2062QDGNRQ1`
- Footprint: `Package_SO:MSOP-8-1EP_3x3mm_P0.65mm_EP1.5x1.8mm`
- 3D model: MSOP-8-EP (KiCad packages3D, STEP)
- 3D model files: `tps2062qdgnrq1-etched.step` / `tps2062qdgnrq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tps2062qdgnrq1.step` / `tps2062qdgnrq1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tps2062-q1) (28 pp, sha256 `15b91d2401ea94b3`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tps2062qdgnrq1-datasheet.pdf)