component
TPIC6595N
Public Made by Adomby adom
Texas Instruments Shifting Register, PDIP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TPIC6595N
Texas Instruments · Shifting Register · PDIP-20
TPIC6595N from Texas Instruments, in a PDIP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | Power ground for the DMOS output drivers; internally connected to pins 10, 11, and 20 and must be externally connected to power system ground to minimize parasitic inductance. |
| 2 | VCC | power_in | Logic supply voltage, recommended 4.5 V to 5.5 V (absolute maximum 7 V with respect to LGND and PGND). |
| 3 | SER IN | input | Serial data input to the 8-bit shift register, clocked on the rising edge of SRCK with 10 ns minimum setup and hold times; logic-high input must be at least 0.85 VCC and logic-low at most 0.15 VCC. |
| 4 | DRAIN0 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 5 | DRAIN1 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 6 | DRAIN2 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 7 | DRAIN3 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 8 | SRCLR | input | Active-low shift-register clear: when low the input shift register is cleared, and when high the storage register transfers data to the output buffer. |
| 9 | G | input | Output enable: when held high all output buffer data is forced low and all drain outputs are off; when held low storage register data is transparent to the outputs. |
| 10 | PGND | power_in | Power ground; internally connected to pins 1, 11, and 20 and must be externally tied to power system ground. |
| 11 | PGND | power_in | Power ground; internally connected to pins 1, 10, and 20 and must be externally tied to power system ground. |
| 12 | RCK | input | Register clock; data transfers from the shift register to the 8-bit storage register on its rising edge. |
| 13 | SRCK | input | Shift-register clock; data transfers through the shift register on its rising edge, with 10 ns minimum setup and hold relative to SER IN and a 20 ns minimum pulse duration. |
| 14 | DRAIN4 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 15 | DRAIN5 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 16 | DRAIN6 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 17 | DRAIN7 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 18 | SER OUT | output | Serial data output from the shift register, provided to cascade data to additional devices. |
| 19 | LGND | power_in | Logic ground; must be connected in a single-point connection to power grounds pins 1, 10, 11, and 20 in a manner that reduces crosstalk between logic and load circuits. |
| 20 | PGND | power_in | Power ground; internally connected to pins 1, 10, and 11 and must be externally tied to power system ground. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | PDIP-20 |
| Category | Logic ICs |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Logic supply voltage | VCC | 4.5 | 5.5 | V | 4 | ||
| High-level input voltage | VIH | 0.85 | VCC | 4 | |||
| Low-level input voltage | VIL | 0.15 | VCC | 4 | |||
| Pulsed drain output current | -1.8 | 1.5 | A | TC = 25°C, VCC = 5 V (see Notes 3 and 5) | 4 | ||
| Setup time, SER IN high before SRCK↑ | tsu | 10 | ns | see Figure 2 | 4 | ||
| Hold time, SER IN high after SRCK↑ | th | 10 | ns | see Figure 2 | 4 | ||
| Pulse duration | tw | 20 | ns | see Figure 2 | 4 | ||
| Operating case temperature | TC | -40 | 125 | °C | 4 | ||
| Drain-source breakdown voltage | V(BR)DSX | 45 | V | ID = 1 mA | 4 | ||
| Source-drain diode forward voltage | VSD | 0.85 | 1 | V | IF = 250 mA, See Note 3 | 4 | |
| High-level output voltage | VOH | 4.4 | 4.49 | V | IOH = −20 mA, VCC = 4.5 V | 4 | |
| High-level output voltage, SER OUT | VOH | 4.1 | 4.3 | V | IOH = −4 mA, VCC = 4.5 V | 4 | |
| Low-level output voltage | VOL | 0.002 | 0.1 | V | IOH = 20 mA, VCC = 4.5 V | 4 | |
| Low-level output voltage, SER OUT | VOL | 0.2 | 0.4 | V | IOH = 4 mA, VCC = 4.5 V | 4 | |
| Input hysteresis | V(hys) | 1.3 | V | VDS = 15 V | 4 | ||
| High-level input current | IIH | 1 | µA | VCC = 5.5 V, VI = VCC | 4 | ||
| Low-level input current | IIL | -1 | µA | VCC = 5.5 V, VI = 0 | 4 | ||
| Logic supply current | ICCL | 15 | 100 | µA | IO = 0, All inputs low | 4 | |
| Logic supply current frequency | ICC(FRQ) | 0.6 | 5 | mA | fSRCK = 5 MHz, IO = 0, CL = 30 pF, See Figures 1, 2, and 6 | 4 | |
| Nominal current | IN | 250 | mA | VDS(on) = 0.5 V, IN = ID, TC = 85°C, See Notes 5, 6, and 7 | 4 | ||
| Off-state drain current | IDSX | 0.05 | 1 | µA | VDS = 40 V | 4 | |
| Off-state drain current | IDSX | 0.15 | 5 | µA | VDS = 40 V, TC = 125°C | 4 | |
| Static drain-source on-state resistance | rDS(on) | 1.3 | 2 | Ω | ID = 250 mA, VCC = 4.5 V | 4 | |
| Static drain-source on-state resistance | rDS(on) | 2 | 3.2 | Ω | ID = 250 mA, TC = 125°C, VCC = 4.5 V, See Notes 5 and 6 and Figures 9 and 10 | 4 | |
| Propagation delay time, low-to-high-level output from G | tPLH | 650 | ns | 4 | |||
| Propagation delay time, high-to-low-level output from G | tPHL | 150 | ns | CL = 30 pF, ID = 250 mA | 4 | ||
| Rise time, drain output | tr | 750 | ns | CL = 30 pF, ID = 250 mA, See Figures 1 and 2 | 4 | ||
| Fall time, drain output | tf | 425 | ns | See Figures 1 and 2 | 4 | ||
| Reverse-recovery-current rise time | ta | 100 | ns | IF = 250 mA, di/dt = 20 A/µs | 4 | ||
| Reverse-recovery time | trr | 300 | ns | IF = 250 mA, di/dt = 20 A/µs, See Notes 5 and 6 and Figure 3 | 4 | ||
| Logic supply voltage (absolute maximum) | VCC | 7 | V | See Note 1 | 3 | ||
| Logic input voltage range | VI | -0.3 | 7 | V | 3 | ||
| Power DMOS drain-to-source voltage | VDS | 45 | V | See Note 2 | 3 | ||
| Continuous source-drain diode anode current | 1 | A | 3 | ||||
| Pulsed source-drain diode anode current | 2 | A | 3 | ||||
| Pulsed drain current, each output, all outputs on | IDn | 750 | mA | TA = 25°C (see Note 3) | 3 | ||
| Continuous drain current, each output, all outputs on | IDn | 250 | mA | TA = 25°C | 3 | ||
| Peak drain current single output | IDM | 2 | A | TA = 25°C (see Note 3) | 3 | ||
| Single-pulse avalanche energy | EAS | 75 | mJ | see Note 4 | 3 | ||
| Avalanche current | IAS | 1 | A | see Note 4 | 3 | ||
| Operating virtual junction temperature range | TJ | -40 | 150 | °C | 3 | ||
| Storage temperature range | Tstg | -65 | 150 | °C | 3 | ||
| Lead temperature | 260 | °C | 1,6 mm (1/16 inch) from case for 10 seconds | 3 | |||
| Thermal resistance, junction-to-ambient (N package) | RθJA | 108 | °C/W | All 8 outputs with equal power | 5 | ||
| Power rating, N package | 1150 | mW | TA ≤ 25°C | 3 | |||
| Power rating, N package | 230 | mW | TA = 125°C | 3 |
CAD (KiCad official)
- Symbol:
TPIC6595N - Footprint:
Package_DIP:DIP-20_W7.62mm - 3D model: PDIP-20 (KiCad packages3D, STEP)
- 3D model files:
tpic6595n-etched.step/tpic6595n-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpic6595n.step/tpic6595n.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (19 pp, sha256
fa207d32fc5054c8, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TPIC6595N
**Texas Instruments** · Shifting Register · PDIP-20
TPIC6595N from Texas Instruments, in a PDIP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PGND | power_in | Power ground for the DMOS output drivers; internally connected to pins 10, 11, and 20 and must be externally connected to power system ground to minimize parasitic inductance. |
| 2 | VCC | power_in | Logic supply voltage, recommended 4.5 V to 5.5 V (absolute maximum 7 V with respect to LGND and PGND). |
| 3 | SER IN | input | Serial data input to the 8-bit shift register, clocked on the rising edge of SRCK with 10 ns minimum setup and hold times; logic-high input must be at least 0.85 VCC and logic-low at most 0.15 VCC. |
| 4 | DRAIN0 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 5 | DRAIN1 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 6 | DRAIN2 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 7 | DRAIN3 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 8 | SRCLR | input | Active-low shift-register clear: when low the input shift register is cleared, and when high the storage register transfers data to the output buffer. |
| 9 | G | input | Output enable: when held high all output buffer data is forced low and all drain outputs are off; when held low storage register data is transparent to the outputs. |
| 10 | PGND | power_in | Power ground; internally connected to pins 1, 11, and 20 and must be externally tied to power system ground. |
| 11 | PGND | power_in | Power ground; internally connected to pins 1, 10, and 20 and must be externally tied to power system ground. |
| 12 | RCK | input | Register clock; data transfers from the shift register to the 8-bit storage register on its rising edge. |
| 13 | SRCK | input | Shift-register clock; data transfers through the shift register on its rising edge, with 10 ns minimum setup and hold relative to SER IN and a 20 ns minimum pulse duration. |
| 14 | DRAIN4 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 15 | DRAIN5 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 16 | DRAIN6 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 17 | DRAIN7 | output | Open-drain power DMOS sink output rated 45 V drain-to-source with 250 mA continuous sink current per output. |
| 18 | SER OUT | output | Serial data output from the shift register, provided to cascade data to additional devices. |
| 19 | LGND | power_in | Logic ground; must be connected in a single-point connection to power grounds pins 1, 10, 11, and 20 in a manner that reduces crosstalk between logic and load circuits. |
| 20 | PGND | power_in | Power ground; internally connected to pins 1, 10, and 11 and must be externally tied to power system ground. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | PDIP-20 |
| Category | Logic ICs |
| Pins | 20 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Logic supply voltage | VCC | 4.5 | | 5.5 | V | | 4 |
| High-level input voltage | VIH | 0.85 | | | VCC | | 4 |
| Low-level input voltage | VIL | | | 0.15 | VCC | | 4 |
| Pulsed drain output current | | -1.8 | | 1.5 | A | TC = 25°C, VCC = 5 V (see Notes 3 and 5) | 4 |
| Setup time, SER IN high before SRCK↑ | tsu | 10 | | | ns | see Figure 2 | 4 |
| Hold time, SER IN high after SRCK↑ | th | 10 | | | ns | see Figure 2 | 4 |
| Pulse duration | tw | 20 | | | ns | see Figure 2 | 4 |
| Operating case temperature | TC | -40 | | 125 | °C | | 4 |
| Drain-source breakdown voltage | V(BR)DSX | 45 | | | V | ID = 1 mA | 4 |
| Source-drain diode forward voltage | VSD | | 0.85 | 1 | V | IF = 250 mA, See Note 3 | 4 |
| High-level output voltage | VOH | 4.4 | 4.49 | | V | IOH = −20 mA, VCC = 4.5 V | 4 |
| High-level output voltage, SER OUT | VOH | 4.1 | 4.3 | | V | IOH = −4 mA, VCC = 4.5 V | 4 |
| Low-level output voltage | VOL | | 0.002 | 0.1 | V | IOH = 20 mA, VCC = 4.5 V | 4 |
| Low-level output voltage, SER OUT | VOL | | 0.2 | 0.4 | V | IOH = 4 mA, VCC = 4.5 V | 4 |
| Input hysteresis | V(hys) | | 1.3 | | V | VDS = 15 V | 4 |
| High-level input current | IIH | | | 1 | µA | VCC = 5.5 V, VI = VCC | 4 |
| Low-level input current | IIL | -1 | | | µA | VCC = 5.5 V, VI = 0 | 4 |
| Logic supply current | ICCL | | 15 | 100 | µA | IO = 0, All inputs low | 4 |
| Logic supply current frequency | ICC(FRQ) | | 0.6 | 5 | mA | fSRCK = 5 MHz, IO = 0, CL = 30 pF, See Figures 1, 2, and 6 | 4 |
| Nominal current | IN | | 250 | | mA | VDS(on) = 0.5 V, IN = ID, TC = 85°C, See Notes 5, 6, and 7 | 4 |
| Off-state drain current | IDSX | | 0.05 | 1 | µA | VDS = 40 V | 4 |
| Off-state drain current | IDSX | | 0.15 | 5 | µA | VDS = 40 V, TC = 125°C | 4 |
| Static drain-source on-state resistance | rDS(on) | | 1.3 | 2 | Ω | ID = 250 mA, VCC = 4.5 V | 4 |
| Static drain-source on-state resistance | rDS(on) | | 2 | 3.2 | Ω | ID = 250 mA, TC = 125°C, VCC = 4.5 V, See Notes 5 and 6 and Figures 9 and 10 | 4 |
| Propagation delay time, low-to-high-level output from G | tPLH | | | 650 | ns | | 4 |
| Propagation delay time, high-to-low-level output from G | tPHL | | | 150 | ns | CL = 30 pF, ID = 250 mA | 4 |
| Rise time, drain output | tr | | | 750 | ns | CL = 30 pF, ID = 250 mA, See Figures 1 and 2 | 4 |
| Fall time, drain output | tf | | | 425 | ns | See Figures 1 and 2 | 4 |
| Reverse-recovery-current rise time | ta | | | 100 | ns | IF = 250 mA, di/dt = 20 A/µs | 4 |
| Reverse-recovery time | trr | | | 300 | ns | IF = 250 mA, di/dt = 20 A/µs, See Notes 5 and 6 and Figure 3 | 4 |
| Logic supply voltage (absolute maximum) | VCC | | | 7 | V | See Note 1 | 3 |
| Logic input voltage range | VI | -0.3 | | 7 | V | | 3 |
| Power DMOS drain-to-source voltage | VDS | | | 45 | V | See Note 2 | 3 |
| Continuous source-drain diode anode current | | | | 1 | A | | 3 |
| Pulsed source-drain diode anode current | | | | 2 | A | | 3 |
| Pulsed drain current, each output, all outputs on | IDn | | | 750 | mA | TA = 25°C (see Note 3) | 3 |
| Continuous drain current, each output, all outputs on | IDn | | | 250 | mA | TA = 25°C | 3 |
| Peak drain current single output | IDM | | | 2 | A | TA = 25°C (see Note 3) | 3 |
| Single-pulse avalanche energy | EAS | | | 75 | mJ | see Note 4 | 3 |
| Avalanche current | IAS | | | 1 | A | see Note 4 | 3 |
| Operating virtual junction temperature range | TJ | -40 | | 150 | °C | | 3 |
| Storage temperature range | Tstg | -65 | | 150 | °C | | 3 |
| Lead temperature | | | | 260 | °C | 1,6 mm (1/16 inch) from case for 10 seconds | 3 |
| Thermal resistance, junction-to-ambient (N package) | RθJA | | | 108 | °C/W | All 8 outputs with equal power | 5 |
| Power rating, N package | | | | 1150 | mW | TA ≤ 25°C | 3 |
| Power rating, N package | | | | 230 | mW | TA = 125°C | 3 |
## CAD (KiCad official)
- Symbol: `TPIC6595N`
- Footprint: `Package_DIP:DIP-20_W7.62mm`
- 3D model: PDIP-20 (KiCad packages3D, STEP)
- 3D model files: `tpic6595n-etched.step` / `tpic6595n-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpic6595n.step` / `tpic6595n.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/tpic6595n.pdf) (19 pp, sha256 `fa207d32fc5054c8`, retrieved 2026-10-31, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tpic6595n-datasheet.pdf)