# TPA6211TDGNRQ1

**Texas Instruments** · Audio Amplifiers · HVSSOP-8-EP

TPA6211TDGNRQ1 from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | Active-low shutdown pin, with VIH min 1.55 V and VIL max 0.5 V as given in the recommended operating conditions. |
| 2 | BYPASS | input | Mid-supply voltage node; adding a bypass capacitor improves PSRR. |
| 3 | IN+ | input | Positive differential input; the datasheet gives no additional voltage limit for this pin. |
| 4 | IN- | input | Negative differential input; the datasheet gives no additional voltage limit for this pin. |
| 5 | VO+ | output | Positive BTL (bridge-tied load) speaker output. |
| 6 | VDD | power_in | Power supply, rated 2.5 V to 5.5 V in recommended operating conditions with an absolute maximum of 6 V. |
| 7 | GND | power_in | High-current ground; the thermal pad must also be connected to ground. |
| 8 | VO- | output | Negative BTL (bridge-tied load) speaker output. |
| 9 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-8-EP |
| Category | Amplifiers/Comparators |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output offset voltage (differential) | VOS | -9 | 0.3 | 9 | mV | VI = 0-V differential, Gain = 1 V/V, VDD = 5.5 V | 5 |
| Power supply rejection ratio | PSRR |  | -85 | -60 | dB | VDD = 2.5 V to 5.5 V | 5 |
| Common mode input range (lower limit) | VIC | 0.5 |  |  | V | VDD = 2.5 V to 5.5 V | 5 |
| Common mode rejection ratio | CMRR |  | -63 | -40 | dB | VDD = 5.5 V, VIC = 0.5 V to 4.7 V | 5 |
| Low-output swing | VOL |  |  | 0.45 | V | RL = 4 Ω, VIN+ = VDD, VIN+ = 0 V, Gain = 1 V/V, VIN- = 0 V or VIN- = VDD, VDD = 5.5 V | 5 |
| Low-output swing | VOL |  |  | 0.37 | V | RL = 4 Ω, VIN+ = VDD, VIN+ = 0 V, Gain = 1 V/V, VIN- = 0 V or VIN- = VDD, VDD = 3.6 V | 5 |
| Low-output swing | VOL |  | 0.26 | 0.4 | V | RL = 4 Ω, VIN+ = VDD, VIN+ = 0 V, Gain = 1 V/V, VIN- = 0 V or VIN- = VDD, VDD = 2.5 V | 5 |
| High-output swing | VOH | 4.95 |  |  | V | RL = 4 Ω, VIN+ = VDD, VIN- = VDD, Gain = 1 V/V, VIN- = 0 V or VIN+ = 0 V, VDD = 5.5 V | 5 |
| High-output swing | VOH | 3.18 |  |  | V | RL = 4 Ω, VIN+ = VDD, VIN- = VDD, Gain = 1 V/V, VIN- = 0 V or VIN+ = 0 V, VDD = 3.6 V | 5 |
| High-output swing | VOH | 2 | 2.13 |  | V | RL = 4 Ω, VIN+ = VDD, VIN- = VDD, Gain = 1 V/V, VIN- = 0 V or VIN+ = 0 V, VDD = 2.5 V | 5 |
| High-level input current, shutdown | IIH |  | 58 | 100 | µA | VDD = 5.5 V, VI = 5.8 V | 5 |
| Low-level input current, shutdown | IIL |  | 3 | 100 | µA | VDD = 5.5 V, VI = -0.3 V | 5 |
| Quiescent current | IQ |  | 4 | 5 | mA | VDD = 2.5 V to 5.5 V, no load | 5 |
| Supply current in shutdown | I(SD) |  | 0.01 | 1 | µA | VSHUTDOWN ≤ 0.5 V, VDD = 2.5 V to 5.5 V, RL = 4 Ω | 5 |
| Gain (RI-set) | Gain | 38 | 40 | 42 | kΩ/RI | RL = 4 Ω | 5 |
| Input impedance | ZI | 38 | 40 | 44 | kΩ |  | 6 |
| Supply voltage | VDD | -0.3 |  | 6 | V |  | 4 |
| Input voltage | VI | -0.3 |  |  | V |  | 4 |
| Lead temperature |  |  |  | 260 | °C | 1.6 mm (1/16 Inch) from case for 10 s, DGN | 4 |
| Operating free-air temperature | TA | -40 |  | 105 | °C |  | 4 |
| Junction temperature | TJ | -40 |  | 150 | °C |  | 4 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 4 |
| Supply voltage | VDD | 2.5 |  | 5.5 | V |  | 4 |
| High-level input voltage, SHUTDOWN | VIH | 1.55 |  |  | V |  | 4 |
| Low-level input voltage, SHUTDOWN | VIL |  |  | 0.5 | V |  | 4 |
| Operating free-air temperature | TA | -40 |  | 105 | °C |  | 4 |
| Junction-to-ambient thermal resistance (DGN) | RθJA |  | 53.9 |  | °C/W |  | 4 |
| Junction-to-case (top) thermal resistance (DGN) | RθJC(top) |  | 72.7 |  | °C/W |  | 4 |
| Junction-to-board thermal resistance (DGN) | RθJB |  | 26.4 |  | °C/W |  | 4 |
| Junction-to-top characterization parameter (DGN) | ψJT |  | 3.5 |  | °C/W |  | 4 |
| Junction-to-board characterization parameter (DGN) | ψJB |  | 26.3 |  | °C/W |  | 4 |
| Junction-to-case (bottom) thermal resistance (DGN) | RθJC(bot) |  | 10.2 |  | °C/W |  | 4 |

## CAD (KiCad official)

- Symbol: `TPA6211TDGNRQ1`
- Footprint: `Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm`
- 3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `tpa6211tdgnrq1-etched.step` / `tpa6211tdgnrq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tpa6211tdgnrq1.step` / `tpa6211tdgnrq1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tpa6211t-q1) (34 pp, sha256 `3dea86de3571f290`, retrieved 2026-10-20, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tpa6211tdgnrq1-datasheet.pdf)