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Generated by kicad-footprint-generator · KiCad file format 20260206

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TPA6211TDGNRQ1

Texas Instruments · Audio Amplifiers · HVSSOP-8-EP

TPA6211TDGNRQ1 from Texas Instruments, in a HVSSOP-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	SHUTDOWN	input	Active-low shutdown pin, with VIH min 1.55 V and VIL max 0.5 V as given in the recommended operating conditions.
2	BYPASS	input	Mid-supply voltage node; adding a bypass capacitor improves PSRR.
3	IN+	input	Positive differential input; the datasheet gives no additional voltage limit for this pin.
4	IN-	input	Negative differential input; the datasheet gives no additional voltage limit for this pin.
5	VO+	output	Positive BTL (bridge-tied load) speaker output.
6	VDD	power_in	Power supply, rated 2.5 V to 5.5 V in recommended operating conditions with an absolute maximum of 6 V.
7	GND	power_in	High-current ground; the thermal pad must also be connected to ground.
8	VO-	output	Negative BTL (bridge-tied load) speaker output.
9	Thermal Pad	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	HVSSOP-8-EP
Category	Amplifiers/Comparators
Pins	9

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Output offset voltage (differential)	VOS	-9	0.3	9	mV	VI = 0-V differential, Gain = 1 V/V, VDD = 5.5 V	5
Power supply rejection ratio	PSRR		-85	-60	dB	VDD = 2.5 V to 5.5 V	5
Common mode input range (lower limit)	VIC	0.5			V	VDD = 2.5 V to 5.5 V	5
Common mode rejection ratio	CMRR		-63	-40	dB	VDD = 5.5 V, VIC = 0.5 V to 4.7 V	5
Low-output swing	VOL			0.45	V	RL = 4 Ω, VIN+ = VDD, VIN+ = 0 V, Gain = 1 V/V, VIN- = 0 V or VIN- = VDD, VDD = 5.5 V	5
Low-output swing	VOL			0.37	V	RL = 4 Ω, VIN+ = VDD, VIN+ = 0 V, Gain = 1 V/V, VIN- = 0 V or VIN- = VDD, VDD = 3.6 V	5
Low-output swing	VOL		0.26	0.4	V	RL = 4 Ω, VIN+ = VDD, VIN+ = 0 V, Gain = 1 V/V, VIN- = 0 V or VIN- = VDD, VDD = 2.5 V	5
High-output swing	VOH	4.95			V	RL = 4 Ω, VIN+ = VDD, VIN- = VDD, Gain = 1 V/V, VIN- = 0 V or VIN+ = 0 V, VDD = 5.5 V	5
High-output swing	VOH	3.18			V	RL = 4 Ω, VIN+ = VDD, VIN- = VDD, Gain = 1 V/V, VIN- = 0 V or VIN+ = 0 V, VDD = 3.6 V	5
High-output swing	VOH	2	2.13		V	RL = 4 Ω, VIN+ = VDD, VIN- = VDD, Gain = 1 V/V, VIN- = 0 V or VIN+ = 0 V, VDD = 2.5 V	5
High-level input current, shutdown	IIH		58	100	µA	VDD = 5.5 V, VI = 5.8 V	5
Low-level input current, shutdown	IIL		3	100	µA	VDD = 5.5 V, VI = -0.3 V	5
Quiescent current	IQ		4	5	mA	VDD = 2.5 V to 5.5 V, no load	5
Supply current in shutdown	I(SD)		0.01	1	µA	VSHUTDOWN ≤ 0.5 V, VDD = 2.5 V to 5.5 V, RL = 4 Ω	5
Gain (RI-set)	Gain	38	40	42	kΩ/RI	RL = 4 Ω	5
Input impedance	ZI	38	40	44	kΩ		6
Supply voltage	VDD	-0.3		6	V		4
Input voltage	VI	-0.3			V		4
Lead temperature				260	°C	1.6 mm (1/16 Inch) from case for 10 s, DGN	4
Operating free-air temperature	TA	-40		105	°C		4
Junction temperature	TJ	-40		150	°C		4
Storage temperature	Tstg	-65		150	°C		4
Supply voltage	VDD	2.5		5.5	V		4
High-level input voltage, SHUTDOWN	VIH	1.55			V		4
Low-level input voltage, SHUTDOWN	VIL			0.5	V		4
Operating free-air temperature	TA	-40		105	°C		4
Junction-to-ambient thermal resistance (DGN)	RθJA		53.9		°C/W		4
Junction-to-case (top) thermal resistance (DGN)	RθJC(top)		72.7		°C/W		4
Junction-to-board thermal resistance (DGN)	RθJB		26.4		°C/W		4
Junction-to-top characterization parameter (DGN)	ψJT		3.5		°C/W		4
Junction-to-board characterization parameter (DGN)	ψJB		26.3		°C/W		4
Junction-to-case (bottom) thermal resistance (DGN)	RθJC(bot)		10.2		°C/W		4

CAD (KiCad official)

Symbol: TPA6211TDGNRQ1
Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
3D model: HVSSOP-8-EP, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
3D model files: tpa6211tdgnrq1-etched.step / tpa6211tdgnrq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa6211tdgnrq1.step / tpa6211tdgnrq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (34 pp, sha256 3dea86de3571f290, retrieved 2026-10-20, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF