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TPA2005D1DGNR

Public Made by Adom

by adom

Texas Instruments Audio Amplifiers, HVSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TPA2005D1DGNR

Texas Instruments · Audio Amplifiers · HVSSOP-8

TPA2005D1DGNR from Texas Instruments, in a HVSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SHUTDOWN input Active-low shutdown input; logic HIGH (≥2 V) enables normal operation, logic LOW (≤0.8 V) enables shutdown mode drawing 0.5-2 μA
2 NC unconnected No internal connection; NC terminal still requires a pad and trace on PCB
3 IN+ input Positive differential audio input; input voltage range -0.3 V to VDD+0.3 V with common-mode input voltage range 0.5 V to VDD-0.8 V
4 IN- input Negative differential audio input; input voltage range -0.3 V to VDD+0.3 V with common-mode input voltage range 0.5 V to VDD-0.8 V
5 VO+ output Positive BTL (bridge-tied load) output; maximum load resistance 3.2 Ω minimum at VDD 2.5-4.2 V, output impedance >1 kΩ in shutdown mode
6 VDD power_in Power supply input; operating voltage range 2.5 V to 5.5 V with quiescent current 2.2-4.5 mA at no load depending on supply voltage
7 GND power_in High-current ground connection; thermal pad must be electrically and thermally connected to ground plane for proper operation and thermal performance
8 VO- output Negative BTL (bridge-tied load) output; maximum load resistance 3.2 Ω minimum at VDD 2.5-4.2 V, output impedance >1 kΩ in shutdown mode
9 Thermal Pad passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package HVSSOP-8
Category Amplifiers/Comparators
Pins 9

CAD (KiCad official)

  • Symbol: TPA2005D1DGNR
  • Footprint: Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm
  • 3D model: HVSSOP-8, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: tpa2005d1dgnr-etched.step / tpa2005d1dgnr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tpa2005d1dgnr.step / tpa2005d1dgnr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (43 pp, sha256 f5d959414918bfe7, retrieved 2026-10-01, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF