component
TPA2005D1DGNR
Public Made by Adomby adom
Texas Instruments Audio Amplifiers, HVSSOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTPA2005D1DGNR
Texas Instruments · Audio Amplifiers · HVSSOP-8
TPA2005D1DGNR from Texas Instruments, in a HVSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | SHUTDOWN | input | Active-low shutdown input; logic HIGH (≥2 V) enables normal operation, logic LOW (≤0.8 V) enables shutdown mode drawing 0.5-2 μA |
| 2 | NC | unconnected | No internal connection; NC terminal still requires a pad and trace on PCB |
| 3 | IN+ | input | Positive differential audio input; input voltage range -0.3 V to VDD+0.3 V with common-mode input voltage range 0.5 V to VDD-0.8 V |
| 4 | IN- | input | Negative differential audio input; input voltage range -0.3 V to VDD+0.3 V with common-mode input voltage range 0.5 V to VDD-0.8 V |
| 5 | VO+ | output | Positive BTL (bridge-tied load) output; maximum load resistance 3.2 Ω minimum at VDD 2.5-4.2 V, output impedance >1 kΩ in shutdown mode |
| 6 | VDD | power_in | Power supply input; operating voltage range 2.5 V to 5.5 V with quiescent current 2.2-4.5 mA at no load depending on supply voltage |
| 7 | GND | power_in | High-current ground connection; thermal pad must be electrically and thermally connected to ground plane for proper operation and thermal performance |
| 8 | VO- | output | Negative BTL (bridge-tied load) output; maximum load resistance 3.2 Ω minimum at VDD 2.5-4.2 V, output impedance >1 kΩ in shutdown mode |
| 9 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSSOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 9 |
CAD (KiCad official)
- Symbol:
TPA2005D1DGNR - Footprint:
Package_SO:HVSSOP-8-1EP_3x3mm_P0.65mm_EP1.57x1.89mm - 3D model: HVSSOP-8, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.0 mm nominal HVSSOP height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
tpa2005d1dgnr-etched.step/tpa2005d1dgnr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tpa2005d1dgnr.step/tpa2005d1dgnr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (43 pp, sha256
f5d959414918bfe7, retrieved 2026-10-01, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.2, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).