# TNM3K60FEX

**Shenzhen JingYang** · MOSFETs · SOT-523

TNM3K60FEX from Shenzhen JingYang, in a SOT-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; controls the channel, with VGSS limited to ±20 V and a gate threshold voltage of 1.1 V to 2.1 V at VDS=VGS, IDS=250uA. |
| 2 | S | passive | Source; connects to the load return or ground in an N-channel low-side switch, with continuous drain current rated at 0.3 A. |
| 3 | D | passive | Drain; sits on the single-lead side of the package, with VDSS rated at 60 V and continuous drain current of 0.3 A (1.2 A pulsed). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JingYang |
| Package | SOT-523 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS |  |  | 60 | V |  | 2 |
| Gate Source Voltage | VGSS | -20 |  | 20 | V |  | 2 |
| Drain Current (Continuous) | ID |  |  | 0.3 | A |  | 2 |
| Drain Current (Pulse) | IDM |  |  | 1.2 | A |  | 2 |
| Power Dissipation | PD |  |  | 0.15 | W |  | 2 |
| Operating Temperature / Storage Temperature | TJ/TSTG | -55 |  | 150 | °C |  | 2 |
| Drain-Source Breakdown Voltage | V(BR)DSS | 60 |  |  | V | VGS=0V, ID=250uA | 2 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | uA | VDS=48V, VGS=0V | 2 |
| Gate Threshold Voltage | VGS(TH) | 1.1 |  | 2.1 | V | VDS=VGS, IDS=250uA | 2 |
| Gate Leakage Current | IGSS | -10 |  | 10 | uA | VGS=±20V, VDS=0V | 2 |
| Drain-Source On-state Resistance | RDS(on) |  |  | 2 | Ω | VGS=10V, ID=0.25A | 2 |
| Drain-Source On-state Resistance | RDS(on) |  |  | 2.8 | Ω | VGS=4.5V, ID=0.25A | 2 |
| Thermal Resistance, Junction-to-Ambient | RθJA |  | 833 |  | °C/W | Device on 1in2 FR-4 board, 2oz Cu, still air, TA=25°C (footnote A) | 2 |

## CAD (KiCad official)

- Symbol: `TNM3K60FEX`
- Footprint: `Package_TO_SOT_SMD:SOT-523`
- 3D model: SOT-523, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.8 mm nominal SOT-523 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `tnm3k60fex-etched.step` / `tnm3k60fex-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tnm3k60fex.step` / `tnm3k60fex.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shenzhen JingYang datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590411690996506624) (6 pp, sha256 `552c9ff85f610d63`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tnm3k60fex-datasheet.pdf)