component
TMS320F28062UPZT
Public Made by Adomby adom
Texas Instruments Microcontrollers (MCU/MPU/SOC), QFP-100(14x14). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
TMS320F28062UPZT
Texas Instruments · Microcontrollers (MCU/MPU/SOC) · QFP-100(14x14)
TMS320F28062UPZT from Texas Instruments, in a QFP-100(14x14). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GPIO42 | bidirectional | General-purpose I/O 42 with mux options EPWM8A, TZ1 and COMP1OUT. |
| 2 | GPIO23 | bidirectional | General-purpose I/O 23 with mux options EQEP1I, MFSXA and SCIRXDB. |
| 3 | VDD | power_in | CPU and logic digital power pin; with internal VREG place one 1.2-µF capacitor between each VDD pin and ground. |
| 4 | VSS | power_in | Digital ground pin. |
| 5 | VDDIO | power_in | Digital I/O buffers power pin, single supply source when VREG is enabled; place a decoupling capacitor on each pin. |
| 6 | GPIO20 | bidirectional | General-purpose I/O 20 with mux options EQEP1A, MDXA and COMP1OUT. |
| 7 | GPIO21 | bidirectional | General-purpose I/O 21 with mux options EQEP1B, MDRA and COMP2OUT. |
| 8 | GPIO43 | bidirectional | General-purpose I/O 43 with mux options EPWM8B, TZ2 and COMP2OUT. |
| 9 | GPIO4 | bidirectional | General-purpose I/O 4 with mux option EPWM3A (HRPWM channel). |
| 10 | GPIO5 | bidirectional | General-purpose I/O 5 with mux options EPWM3B, SPISIMOA and ECAP1. |
| 11 | XRS | bidirectional | Device reset input and watchdog reset output (open-drain with internal pullup); use a 2.2 kΩ to 10 kΩ resistor to VDDIO and any filter capacitor of 100 nF or smaller to VSS. |
| 12 | TRST | input | JTAG test reset with internal pulldown; active-high, must be kept low during normal operation, external pulldown required (2.2 kΩ generally adequate). |
| 13 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 14 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 15 | VSS | power_in | Digital ground pin. |
| 16 | ADCINA7 | input | ADC Group A, channel 7 input. |
| 17 | ADCINA6 | input | ADC Group A channel 6 input, shared with COMP3A comparator input and AIO6 digital I/O. |
| 18 | ADCINA5 | input | ADC Group A, channel 5 input. |
| 19 | ADCINA4 | input | ADC Group A channel 4 input, shared with COMP2A comparator input and AIO4 digital I/O. |
| 20 | ADCINA3 | input | ADC Group A, channel 3 input. |
| 21 | ADCINA2 | input | ADC Group A channel 2 input, shared with COMP1A comparator input and AIO2 digital I/O. |
| 22 | ADCINA1 | input | ADC Group A, channel 1 input. |
| 23 | ADCINA0 | input | ADC Group A, channel 0 input. |
| 24 | VREFHI | input | ADC external reference high, only used in ADC external reference mode and must not exceed VDDA. |
| 25 | VDDA | power_in | Analog power pin; tie with a 2.2-µF capacitor (typical) close to the pin. |
| 26 | VSSA | power_in | Analog ground pin. |
| 27 | VREFLO | input | ADC external reference low. |
| 28 | ADCINB0 | input | ADC Group B, channel 0 input. |
| 29 | ADCINB1 | input | ADC Group B, channel 1 input. |
| 30 | ADCINB2 | input | ADC Group B channel 2 input, shared with COMP1B comparator input and AIO10 digital I/O. |
| 31 | ADCINB3 | input | ADC Group B, channel 3 input. |
| 32 | ADCINB4 | input | ADC Group B channel 4 input, shared with COMP2B comparator input and AIO12 digital I/O. |
| 33 | ADCINB5 | input | ADC Group B, channel 5 input. |
| 34 | ADCINB6 | input | ADC Group B channel 6 input, shared with COMP3B comparator input and AIO14 digital I/O. |
| 35 | ADCINB7 | input | ADC Group B, channel 7 input. |
| 36 | VSS | power_in | Digital ground pin. |
| 37 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 38 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 39 | GPIO25 | bidirectional | General-purpose I/O 25 with mux options ECAP2, EQEP2B and SPISOMIB. |
| 40 | GPIO31 | bidirectional | General-purpose I/O 31 with mux options CANTXA, EQEP2S and EPWM8A. |
| 41 | GPIO30 | bidirectional | General-purpose I/O 30 with mux options CANRXA, EQEP2I and EPWM7A. |
| 42 | GPIO50 | bidirectional | General-purpose I/O 50 with mux options EQEP1A, MDXA and TZ1. |
| 43 | GPIO29 | bidirectional | General-purpose I/O 29 with mux options SCITXDA, SCLA (I2C clock, open-drain) and TZ3. |
| 44 | GPIO12 | bidirectional | General-purpose I/O 12 with mux options TZ1, SCITXDA and SPISIMOB. |
| 45 | TEST2 | unconnected | Test pin reserved for TI; must be left unconnected. |
| 46 | VDD3VFL | power_in | 3.3-V Flash core power pin; must be connected to 3.3 V at all times. |
| 47 | VSS | power_in | Digital ground pin. |
| 48 | GPIO51 | bidirectional | General-purpose I/O 51 with mux options EQEP1B, MDRA and TZ2. |
| 49 | GPIO9 | bidirectional | General-purpose I/O 9 with mux options EPWM5B, SCITXDB and ECAP3. |
| 50 | GPIO28 | bidirectional | General-purpose I/O 28 with mux options SCIRXDA, SDAA (I2C data, open-drain) and TZ2. |
| 51 | GPIO18 | bidirectional | General-purpose I/O 18 with mux options SPICLKA, SCITXDB and XCLKOUT. |
| 52 | GPIO17 | bidirectional | General-purpose I/O 17 with mux options SPISOMIA and TZ3. |
| 53 | GPIO52 | bidirectional | General-purpose I/O 52 with mux options EQEP1S, MCLKXA and TZ3. |
| 54 | GPIO8 | bidirectional | General-purpose I/O 8 with mux options EPWM5A and ADCSOCAO. |
| 55 | GPIO16 | bidirectional | General-purpose I/O 16 with mux options SPISIMOA and TZ2. |
| 56 | GPIO44 | bidirectional | General-purpose I/O 44 with mux options MFSRA, SCIRXDB and EPWM7B. |
| 57 | GPIO7 | bidirectional | General-purpose I/O 7 with mux options EPWM4B, SCIRXDA and ECAP2. |
| 58 | GPIO6 | bidirectional | General-purpose I/O 6 with mux options EPWM4A, EPWMSYNCI and EPWMSYNCO. |
| 59 | X2 | output | On-chip crystal-oscillator output; connect crystal or resonator across X1 and X2, leave unconnected if unused. |
| 60 | X1 | input | On-chip 1.8-V crystal-oscillator input; connect crystal or resonator across X1 and X2, tie to GND if not used. |
| 61 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 62 | VSS | power_in | Digital ground pin. |
| 63 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 64 | GPIO19 | bidirectional | General-purpose I/O 19 with mux options XCLKIN, SPISTEA, SCIRXDB and ECAP1; may glitch during power up with on-chip VREG. |
| 65 | GPIO53 | bidirectional | General-purpose I/O 53 with mux options EQEP1I and MFSXA. |
| 66 | GPIO39 | bidirectional | General-purpose I/O 39; other mux functions are reserved. |
| 67 | GPIO38 | bidirectional | General-purpose I/O 38 with mux options XCLKIN and TCK (JTAG test clock, internal pullup). |
| 68 | GPIO34 | bidirectional | General-purpose I/O 34 with mux options COMP2OUT and COMP3OUT. |
| 69 | GPIO54 | bidirectional | General-purpose I/O 54 with mux options SPISIMOA, EQEP2A and HRCAP1. |
| 70 | GPIO37 | bidirectional | General-purpose I/O 37 with mux option TDO (JTAG scan out, 8-mA drive). |
| 71 | GPIO35 | bidirectional | General-purpose I/O 35 with mux option TDI (JTAG test data input, internal pullup). |
| 72 | GPIO36 | bidirectional | General-purpose I/O 36 with mux option TMS (JTAG test-mode select, internal pullup). |
| 73 | GPIO11 | bidirectional | General-purpose I/O 11 with mux options EPWM6B, SCIRXDB and ECAP1. |
| 74 | GPIO10 | bidirectional | General-purpose I/O 10 with mux options EPWM6A and ADCSOCBO. |
| 75 | GPIO55 | bidirectional | General-purpose I/O 55 with mux options SPISOMIA, EQEP2B and HRCAP2. |
| 76 | GPIO41 | bidirectional | General-purpose I/O 41 with mux options EPWM7B and SCIRXDB. |
| 77 | GPIO27 | bidirectional | General-purpose I/O 27 with mux options HRCAP2, EQEP2S, SPISTEB and USB0DM; may glitch during power up with on-chip VREG. |
| 78 | GPIO26 | bidirectional | General-purpose I/O 26 with mux options ECAP3, EQEP2I, SPICLKB and USB0DP; may glitch during power up with on-chip VREG. |
| 79 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 80 | VSS | power_in | Digital ground pin. |
| 81 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 82 | GPIO40 | bidirectional | General-purpose I/O 40 with mux options EPWM7A and SCITXDB. |
| 83 | GPIO3 | bidirectional | General-purpose I/O 3 with mux options EPWM2B, SPISOMIA and COMP2OUT. |
| 84 | GPIO2 | bidirectional | General-purpose I/O 2 with mux option EPWM2A (HRPWM channel). |
| 85 | GPIO56 | bidirectional | General-purpose I/O 56 with mux options SPICLKA, EQEP2I and HRCAP3. |
| 86 | GPIO1 | bidirectional | General-purpose I/O 1 with mux options EPWM1B and COMP1OUT. |
| 87 | GPIO0 | bidirectional | General-purpose I/O 0 with mux option EPWM1A (HRPWM channel). |
| 88 | GPIO15 | bidirectional | General-purpose I/O 15 with mux options ECAP2, SCIRXDB and SPISTEB. |
| 89 | GPIO57 | bidirectional | General-purpose I/O 57 with mux options SPISTEA, EQEP2S and HRCAP4. |
| 90 | VREGENZ | input | Internal VREG enable with internal pulldown; tie to VSS to enable the internal 1.8-V VREG, or to VDDIO to disable it and use an external 1.8-V supply. |
| 91 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 92 | VSS | power_in | Digital ground pin. |
| 93 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 94 | GPIO58 | bidirectional | General-purpose I/O 58 with mux options MCLKRA, SCITXDB and EPWM7A. |
| 95 | GPIO13 | bidirectional | General-purpose I/O 13 with mux options TZ2 and SPISOMIB. |
| 96 | GPIO14 | bidirectional | General-purpose I/O 14 with mux options TZ3, SCITXDB and SPICLKB. |
| 97 | GPIO24 | bidirectional | General-purpose I/O 24 with mux options ECAP1, EQEP2A and SPISIMOB. |
| 98 | GPIO22 | bidirectional | General-purpose I/O 22 with mux options EQEP1S, MCLKXA and SCITXDB. |
| 99 | GPIO32 | bidirectional | General-purpose I/O 32 with mux options SDAA (I2C data, open-drain), EPWMSYNCI and ADCSOCAO. |
| 100 | GPIO33 | bidirectional | General-purpose I/O 33 with mux options SCLA (I2C clock, open-drain), EPWMSYNCO and ADCSOCBO. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFP-100(14x14) |
| Category | Embedded Processors & Controllers |
| Pins | 100 |
CAD (KiCad official)
- Symbol:
TMS320F28062UPZT - Footprint:
Package_QFP:LQFP-100_14x14mm_P0.5mm - 3D model: QFP-100(14x14) (KiCad packages3D, STEP)
- 3D model files:
tms320f28062upzt-etched.step/tms320f28062upzt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tms320f28062upzt.step/tms320f28062upzt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (206 pp, sha256
3033efed856fc72a, retrieved 2026-10-07, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-4-5-20251001(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TMS320F28062UPZT
**Texas Instruments** · Microcontrollers (MCU/MPU/SOC) · QFP-100(14x14)
TMS320F28062UPZT from Texas Instruments, in a QFP-100(14x14). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GPIO42 | bidirectional | General-purpose I/O 42 with mux options EPWM8A, TZ1 and COMP1OUT. |
| 2 | GPIO23 | bidirectional | General-purpose I/O 23 with mux options EQEP1I, MFSXA and SCIRXDB. |
| 3 | VDD | power_in | CPU and logic digital power pin; with internal VREG place one 1.2-µF capacitor between each VDD pin and ground. |
| 4 | VSS | power_in | Digital ground pin. |
| 5 | VDDIO | power_in | Digital I/O buffers power pin, single supply source when VREG is enabled; place a decoupling capacitor on each pin. |
| 6 | GPIO20 | bidirectional | General-purpose I/O 20 with mux options EQEP1A, MDXA and COMP1OUT. |
| 7 | GPIO21 | bidirectional | General-purpose I/O 21 with mux options EQEP1B, MDRA and COMP2OUT. |
| 8 | GPIO43 | bidirectional | General-purpose I/O 43 with mux options EPWM8B, TZ2 and COMP2OUT. |
| 9 | GPIO4 | bidirectional | General-purpose I/O 4 with mux option EPWM3A (HRPWM channel). |
| 10 | GPIO5 | bidirectional | General-purpose I/O 5 with mux options EPWM3B, SPISIMOA and ECAP1. |
| 11 | XRS | bidirectional | Device reset input and watchdog reset output (open-drain with internal pullup); use a 2.2 kΩ to 10 kΩ resistor to VDDIO and any filter capacitor of 100 nF or smaller to VSS. |
| 12 | TRST | input | JTAG test reset with internal pulldown; active-high, must be kept low during normal operation, external pulldown required (2.2 kΩ generally adequate). |
| 13 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 14 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 15 | VSS | power_in | Digital ground pin. |
| 16 | ADCINA7 | input | ADC Group A, channel 7 input. |
| 17 | ADCINA6 | input | ADC Group A channel 6 input, shared with COMP3A comparator input and AIO6 digital I/O. |
| 18 | ADCINA5 | input | ADC Group A, channel 5 input. |
| 19 | ADCINA4 | input | ADC Group A channel 4 input, shared with COMP2A comparator input and AIO4 digital I/O. |
| 20 | ADCINA3 | input | ADC Group A, channel 3 input. |
| 21 | ADCINA2 | input | ADC Group A channel 2 input, shared with COMP1A comparator input and AIO2 digital I/O. |
| 22 | ADCINA1 | input | ADC Group A, channel 1 input. |
| 23 | ADCINA0 | input | ADC Group A, channel 0 input. |
| 24 | VREFHI | input | ADC external reference high, only used in ADC external reference mode and must not exceed VDDA. |
| 25 | VDDA | power_in | Analog power pin; tie with a 2.2-µF capacitor (typical) close to the pin. |
| 26 | VSSA | power_in | Analog ground pin. |
| 27 | VREFLO | input | ADC external reference low. |
| 28 | ADCINB0 | input | ADC Group B, channel 0 input. |
| 29 | ADCINB1 | input | ADC Group B, channel 1 input. |
| 30 | ADCINB2 | input | ADC Group B channel 2 input, shared with COMP1B comparator input and AIO10 digital I/O. |
| 31 | ADCINB3 | input | ADC Group B, channel 3 input. |
| 32 | ADCINB4 | input | ADC Group B channel 4 input, shared with COMP2B comparator input and AIO12 digital I/O. |
| 33 | ADCINB5 | input | ADC Group B, channel 5 input. |
| 34 | ADCINB6 | input | ADC Group B channel 6 input, shared with COMP3B comparator input and AIO14 digital I/O. |
| 35 | ADCINB7 | input | ADC Group B, channel 7 input. |
| 36 | VSS | power_in | Digital ground pin. |
| 37 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 38 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 39 | GPIO25 | bidirectional | General-purpose I/O 25 with mux options ECAP2, EQEP2B and SPISOMIB. |
| 40 | GPIO31 | bidirectional | General-purpose I/O 31 with mux options CANTXA, EQEP2S and EPWM8A. |
| 41 | GPIO30 | bidirectional | General-purpose I/O 30 with mux options CANRXA, EQEP2I and EPWM7A. |
| 42 | GPIO50 | bidirectional | General-purpose I/O 50 with mux options EQEP1A, MDXA and TZ1. |
| 43 | GPIO29 | bidirectional | General-purpose I/O 29 with mux options SCITXDA, SCLA (I2C clock, open-drain) and TZ3. |
| 44 | GPIO12 | bidirectional | General-purpose I/O 12 with mux options TZ1, SCITXDA and SPISIMOB. |
| 45 | TEST2 | unconnected | Test pin reserved for TI; must be left unconnected. |
| 46 | VDD3VFL | power_in | 3.3-V Flash core power pin; must be connected to 3.3 V at all times. |
| 47 | VSS | power_in | Digital ground pin. |
| 48 | GPIO51 | bidirectional | General-purpose I/O 51 with mux options EQEP1B, MDRA and TZ2. |
| 49 | GPIO9 | bidirectional | General-purpose I/O 9 with mux options EPWM5B, SCITXDB and ECAP3. |
| 50 | GPIO28 | bidirectional | General-purpose I/O 28 with mux options SCIRXDA, SDAA (I2C data, open-drain) and TZ2. |
| 51 | GPIO18 | bidirectional | General-purpose I/O 18 with mux options SPICLKA, SCITXDB and XCLKOUT. |
| 52 | GPIO17 | bidirectional | General-purpose I/O 17 with mux options SPISOMIA and TZ3. |
| 53 | GPIO52 | bidirectional | General-purpose I/O 52 with mux options EQEP1S, MCLKXA and TZ3. |
| 54 | GPIO8 | bidirectional | General-purpose I/O 8 with mux options EPWM5A and ADCSOCAO. |
| 55 | GPIO16 | bidirectional | General-purpose I/O 16 with mux options SPISIMOA and TZ2. |
| 56 | GPIO44 | bidirectional | General-purpose I/O 44 with mux options MFSRA, SCIRXDB and EPWM7B. |
| 57 | GPIO7 | bidirectional | General-purpose I/O 7 with mux options EPWM4B, SCIRXDA and ECAP2. |
| 58 | GPIO6 | bidirectional | General-purpose I/O 6 with mux options EPWM4A, EPWMSYNCI and EPWMSYNCO. |
| 59 | X2 | output | On-chip crystal-oscillator output; connect crystal or resonator across X1 and X2, leave unconnected if unused. |
| 60 | X1 | input | On-chip 1.8-V crystal-oscillator input; connect crystal or resonator across X1 and X2, tie to GND if not used. |
| 61 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 62 | VSS | power_in | Digital ground pin. |
| 63 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 64 | GPIO19 | bidirectional | General-purpose I/O 19 with mux options XCLKIN, SPISTEA, SCIRXDB and ECAP1; may glitch during power up with on-chip VREG. |
| 65 | GPIO53 | bidirectional | General-purpose I/O 53 with mux options EQEP1I and MFSXA. |
| 66 | GPIO39 | bidirectional | General-purpose I/O 39; other mux functions are reserved. |
| 67 | GPIO38 | bidirectional | General-purpose I/O 38 with mux options XCLKIN and TCK (JTAG test clock, internal pullup). |
| 68 | GPIO34 | bidirectional | General-purpose I/O 34 with mux options COMP2OUT and COMP3OUT. |
| 69 | GPIO54 | bidirectional | General-purpose I/O 54 with mux options SPISIMOA, EQEP2A and HRCAP1. |
| 70 | GPIO37 | bidirectional | General-purpose I/O 37 with mux option TDO (JTAG scan out, 8-mA drive). |
| 71 | GPIO35 | bidirectional | General-purpose I/O 35 with mux option TDI (JTAG test data input, internal pullup). |
| 72 | GPIO36 | bidirectional | General-purpose I/O 36 with mux option TMS (JTAG test-mode select, internal pullup). |
| 73 | GPIO11 | bidirectional | General-purpose I/O 11 with mux options EPWM6B, SCIRXDB and ECAP1. |
| 74 | GPIO10 | bidirectional | General-purpose I/O 10 with mux options EPWM6A and ADCSOCBO. |
| 75 | GPIO55 | bidirectional | General-purpose I/O 55 with mux options SPISOMIA, EQEP2B and HRCAP2. |
| 76 | GPIO41 | bidirectional | General-purpose I/O 41 with mux options EPWM7B and SCIRXDB. |
| 77 | GPIO27 | bidirectional | General-purpose I/O 27 with mux options HRCAP2, EQEP2S, SPISTEB and USB0DM; may glitch during power up with on-chip VREG. |
| 78 | GPIO26 | bidirectional | General-purpose I/O 26 with mux options ECAP3, EQEP2I, SPICLKB and USB0DP; may glitch during power up with on-chip VREG. |
| 79 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 80 | VSS | power_in | Digital ground pin. |
| 81 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 82 | GPIO40 | bidirectional | General-purpose I/O 40 with mux options EPWM7A and SCITXDB. |
| 83 | GPIO3 | bidirectional | General-purpose I/O 3 with mux options EPWM2B, SPISOMIA and COMP2OUT. |
| 84 | GPIO2 | bidirectional | General-purpose I/O 2 with mux option EPWM2A (HRPWM channel). |
| 85 | GPIO56 | bidirectional | General-purpose I/O 56 with mux options SPICLKA, EQEP2I and HRCAP3. |
| 86 | GPIO1 | bidirectional | General-purpose I/O 1 with mux options EPWM1B and COMP1OUT. |
| 87 | GPIO0 | bidirectional | General-purpose I/O 0 with mux option EPWM1A (HRPWM channel). |
| 88 | GPIO15 | bidirectional | General-purpose I/O 15 with mux options ECAP2, SCIRXDB and SPISTEB. |
| 89 | GPIO57 | bidirectional | General-purpose I/O 57 with mux options SPISTEA, EQEP2S and HRCAP4. |
| 90 | VREGENZ | input | Internal VREG enable with internal pulldown; tie to VSS to enable the internal 1.8-V VREG, or to VDDIO to disable it and use an external 1.8-V supply. |
| 91 | VDD | power_in | CPU and logic digital power pin; 1.2-µF capacitor to ground when using internal VREG. |
| 92 | VSS | power_in | Digital ground pin. |
| 93 | VDDIO | power_in | Digital I/O buffers power pin; place a decoupling capacitor on each pin. |
| 94 | GPIO58 | bidirectional | General-purpose I/O 58 with mux options MCLKRA, SCITXDB and EPWM7A. |
| 95 | GPIO13 | bidirectional | General-purpose I/O 13 with mux options TZ2 and SPISOMIB. |
| 96 | GPIO14 | bidirectional | General-purpose I/O 14 with mux options TZ3, SCITXDB and SPICLKB. |
| 97 | GPIO24 | bidirectional | General-purpose I/O 24 with mux options ECAP1, EQEP2A and SPISIMOB. |
| 98 | GPIO22 | bidirectional | General-purpose I/O 22 with mux options EQEP1S, MCLKXA and SCITXDB. |
| 99 | GPIO32 | bidirectional | General-purpose I/O 32 with mux options SDAA (I2C data, open-drain), EPWMSYNCI and ADCSOCAO. |
| 100 | GPIO33 | bidirectional | General-purpose I/O 33 with mux options SCLA (I2C clock, open-drain), EPWMSYNCO and ADCSOCBO. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | QFP-100(14x14) |
| Category | Embedded Processors & Controllers |
| Pins | 100 |
## CAD (KiCad official)
- Symbol: `TMS320F28062UPZT`
- Footprint: `Package_QFP:LQFP-100_14x14mm_P0.5mm`
- 3D model: QFP-100(14x14) (KiCad packages3D, STEP)
- 3D model files: `tms320f28062upzt-etched.step` / `tms320f28062upzt-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tms320f28062upzt.step` / `tms320f28062upzt.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tms320f28062f) (206 pp, sha256 `3033efed856fc72a`, retrieved 2026-10-07, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tms320f28062upzt-datasheet.pdf)