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TM4050GD

Tritech-MOS · MOSFETs · TO-252-4L

TM4050GD from Tritech-MOS, in a TO-252-4L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of the N-channel MOSFET (40V, 50A, RDS(ON) 4.2mΩ typ. at VGS=10V); marked as PIN1 in the package drawing.
2 G1 input Gate of the N-channel MOSFET, with VGS rated ±20V and threshold of 1V min to 2.5V max.
3 S2 passive Source of the P-channel MOSFET (-40V, -50A, RDS(ON) 11.5mΩ typ. at VGS=-10V).
4 G2 input Gate of the P-channel MOSFET, with VGS rated ±20V and threshold of -1V min to -2.5V max.
5 D1/D2 passive Common drain of both the N-channel and P-channel MOSFETs, connected to the exposed tab (drain tab).

Key specifications

Parameter Value
Manufacturer Tritech-MOS
Package TO-252-4L
Category Transistors/Thyristors
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage (N-CH) VDS 40 V 1
Drain-Source Voltage (P-CH) VDS -40 V 1
Gate-Source Voltage (N-CH) VGS -20 20 V 1
Gate-Source Voltage (P-CH) VGS -20 20 V 1
Continuous Drain Current (N-CH) ID 50 A TC=25℃ 1
Continuous Drain Current (P-CH) ID -50 A TC=25℃ 1
Continuous Drain Current (N-CH) ID 35 A TC=100℃ 1
Continuous Drain Current (P-CH) ID -20 A TC=100℃ 1
Pulsed Drain Current (N-CH) 250 A 1
Pulsed Drain Current (P-CH) -130 A 1
Power Dissipation (N-CH) PD 55 W TC=25℃ 1
Power Dissipation (P-CH) PD 55 W TC=25℃ 1
Operating and Storage Junction Temperature Range TJ, TSTG -55 150 ℃ 1
Thermal Resistance, Junction to Case RθJC 2.3 ℃/W 1
Thermal Resistance, Junction to Ambient RθJA 62 ℃/W 1
Drain-Source Breakdown Voltage (N-CH) BVDSS 40 V VGS=0V,ID=250μA 2
Zero Gate Voltage Drain Current (N-CH) IDSS 1 μA VGS=0V, VDS=-40V 2
Gate-Source Leakage Current (N-CH) IGSS -100 100 nA VGS=±20V, VDS=0A 2
Gate-Source Threshold Voltage (N-CH) VGS(th) 1 1.6 2.5 V VGS=VDS, ID=250μA 2
Drain-Source On Resistance (N-CH) RDS(ON) 4.2 5.5 mΩ VGS=10V,ID=20A 2
Drain-Source On Resistance (N-CH) RDS(ON) 5.3 7 mΩ VGS=4.5V,ID=10A 2
Input Capacitance (N-CH) Ciss 2380 3400 pF VDS=25V, VGS=0V, f=1MHz 2
Output Capacitance (N-CH) Coss 230 385 pF VDS=25V, VGS=0V, f=1MHz 2
Reverse Transfer Capacitance (N-CH) Crss 148 210 pF VDS=25V, VGS=0V, f=1MHz 2
Turn-On Delay Time (N-CH) td(on) 14.2 28 ns VDD=20V, ID=1A, RGEN=3.3Ω, VGS=10V 2
Rise Time (N-CH) tr 18.3 36 ns VDD=20V, ID=1A, RGEN=3.3Ω, VGS=10V 2
Turn-Off Delay Time (N-CH) td(off) 38.8 76 ns VDD=20V, ID=1A, RGEN=3.3Ω, VGS=10V 2
Fall Time (N-CH) tf 13.9 28 ns VDD=20V, ID=1A, RGEN=3.3Ω, VGS=10V 2
Total Gate Charge (N-CH) Qg 25 50 nC VGS=4.5V, VDS=32V, ID=10A 2
Gate-Source Charge (N-CH) Qgs 6.5 13 nC VGS=4.5V, VDS=32V, ID=10A 2
Gate-Drain Miller Charge (N-CH) Qgd 12.1 24 nC VGS=4.5V, VDS=32V, ID=10A 2
Drain Diode Forward Voltage (N-CH) VSD 1 V VGS=0V,IS=1A 2
Continuous Source Current (N-CH) LS 50 A VG=VD=0V , Force Current 2
Pulsed Source Current (N-CH) lsm 160 A 2
Drain-Source Breakdown Voltage (P-CH) BVDSS -40 V VGS=0V,ID=250μA 5
Zero Gate Voltage Drain Current (P-CH) IDSS -1 μA VGS=0V, VDS=-40V,TJ=25℃ 5
Gate-Source Leakage Current (P-CH) IGSS -100 100 nA VGS=±20V, VDS=0A 5
Gate-Source Threshold Voltage (P-CH) VGS(th) -1 -1.6 -2.5 V VGS=VDS, ID=250μA 5
Drain-Source On Resistance (P-CH) RDS(ON) 11.5 15 mΩ VGS=-10V,ID=-10A 5
Drain-Source On Resistance (P-CH) RDS(ON) 16 22 mΩ VGS=-4.5V,ID=-8A 5
Input Capacitance (P-CH) Ciss 2557 3800 pF VDS=-25V, VGS=0V, f=1MHz 5
Output Capacitance (P-CH) Coss 220 320 pF VDS=-25V, VGS=0V, f=1MHz 5
Reverse Transfer Capacitance (P-CH) Crss 127 180 pF VDS=-25V, VGS=0V, f=1MHz 5
Turn-On Delay Time (P-CH) td(on) 23 40 ns VDD=-20V, ID=-1A, RG=6Ω, VGS=-10V 5
Rise Time (P-CH) tr 10 20 ns VDD=-20V, ID=-1A, RG=6Ω, VGS=-10V 5
Turn-Off Delay Time (P-CH) td(off) 135 250 ns VDD=-20V, ID=-1A, RG=6Ω, VGS=-10V 5
Fall Time (P-CH) tf 46 90 ns VDD=-20V, ID=-1A, RG=6Ω, VGS=-10V 5
Total Gate Charge (P-CH) Qg 22.2 40 nC VGS=-4.5V, VDS=-32V, ID=-10A 5
Gate-Source Charge (P-CH) Qgs 8.2 16 nC 5
Gate-Drain Miller Charge (P-CH) Qgd 8.8 16 nC 5
Source Drain Diode Forward Voltage (P-CH) VSD -1 V VGS=0V,IS=-1A,TJ=25℃ 5

CAD (KiCad official)

  • Symbol: TM4050GD
  • Footprint: Package_TO_SOT_SMD:TO-252-4
  • 3D model: TO-252-4L (KiCad packages3D, STEP)
  • 3D model files: tm4050gd-etched.step / tm4050gd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tm4050gd.step / tm4050gd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Tritech-MOS datasheet (8 pp, sha256 33f845a4e41556c6, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF