TLV9101IDBVR
Public Made by Adomby adom
Texas Instruments Operational Amplifier, SOT-23-5. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
TLV9101IDBVR
Texas Instruments · Operational Amplifier · SOT-23-5
TLV9101IDBVR from Texas Instruments, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | output | Amplifier output. Rail-to-rail output stage capable of sourcing/sinking ±80mA (typical) with 4.5V/µs slew rate. |
| 2 | V- | power_in | Negative (lowest) supply rail. Connect to ground for single-supply operation, or to the negative supply for split-supply operation. Total supply range 2.7V to 16V (±1.35V to ±8V). |
| 3 | IN+ | input | Non-inverting input. Rail-to-rail input range (extends to both supply rails). |
| 4 | IN- | input | Inverting input. Rail-to-rail input range (extends to both supply rails). |
| 5 | V+ | power_in | Positive (highest) supply rail. Total supply range 2.7V to 16V (±1.35V to ±8V). Quiescent current 120µA typical per amplifier. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23-5 |
| Category | Op-amp/Cmp |
| Pins | 5 |
Ordering variants
Same part, different packaging or reel option.
TLV9101IDBVRTLV9101IDBVRDCKTLV9101IDBVRDRLTLV9101IDBVRS-DBV
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input offset voltage (VCM = V–) | VOS | 0.3 | 1.5 | mV | VCM = V– | 12 | |
| Input offset voltage over temperature | VOS | 1.75 | mV | TA = –40°C 至 125°C | 12 | ||
| Input offset voltage vs power supply (PSRR) | PSRR | 0.1 | 0.7 | µV/V | VCM = V–, TA = –40°C 至 125°C | 12 | |
| Common-mode rejection ratio, VS = 16V | CMRR | 90 | 110 | dB | VS = 16V,(V–) – 0.1V < VCM < (V+) – 2V(主输入对),TA = –40°C 至 125°C | 12 | |
| Common-mode rejection ratio, VS = 4V | CMRR | 75 | 95 | dB | VS = 4V,(V–) – 0.1V < VCM < (V+) – 2V(主输入对) | 12 | |
| Common-mode voltage range (printed as (V–)−0.2 to (V+)+0.2) | VCM | -0.2 | 0.2 | V | min referenced to (V–), max referenced to (V+) | 12 | |
| Open-loop voltage gain, VS = 16V | AOL | 115 | 135 | dB | VS = 16V,VCM = V–,(V–) + 0.1V < VO < (V+) – 0.1V,TA = –40°C 至 125°C | 13 | |
| Open-loop voltage gain, VS = 4V | AOL | 104 | 125 | dB | VS = 4V,VCM = V–,(V–) + 0.1V < VO < (V+) – 0.1V | 13 | |
| Output voltage swing from supply rail, RL = 10kΩ | VO | 45 | 60 | mV | VS = 16V,RL = 10kΩ,正负电源轨裕度 | 13 | |
| Output voltage swing from supply rail, RL = 2kΩ | VO | 200 | 300 | mV | VS = 16V,RL = 2kΩ,正负电源轨裕度 | 13 | |
| Output voltage swing from supply rail, RL = 10kΩ | VO | 5 | 20 | mV | VS = 2.7V,RL = 10kΩ,正负电源轨裕度 | 13 | |
| Output voltage swing from supply rail, RL = 2kΩ | VO | 25 | 50 | mV | VS = 2.7V,RL = 2kΩ,正负电源轨裕度 | 13 | |
| Quiescent current per amplifier | IQ | 115 | 150 | µA | IO = 0A | 13 | |
| Quiescent current per amplifier over temperature | IQ | 160 | µA | IO = 0A,TA = –40°C 至 125°C | 13 | ||
| Quiescent current, all amplifiers disabled | IQSD | 20 | 30 | µA | VS = 2.7V 至 16V,所有放大器均为禁用状态,SHDN = V+ | 14 | |
| Supply voltage range | VS | 2.7 | 16 | V | VS = (V+) – (V–),single supply (±1.35V 至 ±8V) | 12 | |
| Operating temperature range | TA | -40 | 125 | °C | 额定工作温度范围 | 1 | |
| Junction-to-ambient thermal resistance (5-pin DBV) | RθJA | 192.2 | °C/W | DBV (SOT-23) 5-pin package, TLV9101 | 11 | ||
| Junction-to-case (top) thermal resistance (5-pin DBV) | RθJC(top) | 113.7 | °C/W | DBV (SOT-23) 5-pin package, TLV9101 | 11 | ||
| Junction-to-board thermal resistance (5-pin DBV) | RθJB | 60.6 | °C/W | DBV (SOT-23) 5-pin package, TLV9101 | 11 | ||
| Junction-to-top characterization parameter (5-pin DBV) | ψJT | 37.4 | °C/W | DBV (SOT-23) 5-pin package, TLV9101 | 11 | ||
| Junction-to-board characterization parameter (5-pin DBV) | ψJB | 60.4 | °C/W | DBV (SOT-23) 5-pin package, TLV9101 | 11 |
CAD (KiCad official)
- Symbol:
TLV9101IDBVR - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
tlv9101idbvr-etched.step/tlv9101idbvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv9101idbvr.step/tlv9101idbvr.glbare the bare package body.
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
tlv9101idbvr.step |
85 KB | You want the bare part, or you mark your own boards. |
tlv9101idbvr-etched.step |
1.8 MB | You want the part with TLV9101IDBVR already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 463 faces against 102 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (83 pp, sha256
af3c8f7642951119, retrieved 2026-08-17, tier: lcsc) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).