component
TLV888DR
Public Made by Adomby adom
Texas Instruments , SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 21h ago |
| viewers | 21h ago |
| package.json | 21h ago |
| page.json | 21h ago |
| README.md | 21h ago |
| tlv888dr-etched.glb | 21h ago |
| tlv888dr-etched.step | 21h ago |
| tlv888dr-hero.glb | 21h ago |
| tlv888dr-hero.overlay.json | 21h ago |
| tlv888dr.glb | 21h ago |
| tlv888dr.kicad_mod | 21h ago |
| tlv888dr.kicad_sym | 21h ago |
| tlv888dr.lbr | 21h ago |
| tlv888dr.step | 21h ago |
TLV888DR
Texas Instruments · IC · SOIC-8
TLV888DR from Texas Instruments, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection; can be left floating. |
| 2 | -IN | input | Inverting input of the amplifier. |
| 3 | +IN | input | Noninverting input of the amplifier. |
| 4 | V- | power_in | Negative (lowest) power supply. |
| 5 | NC | unconnected | No connection; can be left floating. |
| 6 | OUT | output | Amplifier output. |
| 7 | V+ | power_in | Positive (highest) power supply; single-supply range is 4.5V to 36V total across V+ and V-. |
| 8 | NC | unconnected | No connection; can be left floating. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOIC-8 |
| Category | |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input offset voltage | VOS | -15 | 3 | 15 | µV | TA = 25°C, VS = 4.5V to 36V | 8 |
| Input offset voltage over temperature | VOS | -20 | 20 | µV | TA = -40°C to +125°C | 8 | |
| Input offset voltage drift | dVOS/dT | -0.05 | 0.01 | 0.05 | µV/°C | TA = -40°C to +125°C | 8 |
| Power-supply rejection ratio | PSRR | -0.5 | 0.03 | 0.5 | µV/V | TA = -40°C to +125°C | 8 |
| Input bias current | IB | -350 | 50 | 350 | pA | TA = 25°C | 8 |
| Input bias current over temperature | IB | -7 | 7 | nA | TA = -40°C to +125°C | 8 | |
| Input offset current | IOS | -600 | 100 | 600 | pA | TA = 25°C | 8 |
| Input offset current over temperature | IOS | -3 | 3 | nA | TA = -40°C to +125°C | 8 | |
| Common-mode rejection ratio | CMRR | 118 | 135 | dB | (V-), 0.1V ≤ VCM ≤ (V+), 1.7V, VS = ±2.25V | 8 | |
| Common-mode rejection ratio | CMRR | 140 | 150 | dB | (V-), 0.1V ≤ VCM ≤ (V+), 1.7V, VS = ±18V | 8 | |
| Common-mode rejection ratio over temperature | CMRR | 118 | 130 | dB | TA = -40°C to +125°C, VS = ±2.25V | 8 | |
| Common-mode rejection ratio over temperature | CMRR | 140 | 150 | dB | TA = -40°C to +125°C, VS = ±18V | 8 | |
| Open-loop voltage gain | AOL | 130 | 148 | dB | VS = ±15V, (V-) + 0.6V < VO < (V+), 0.6V, RLOAD = 10kΩ | 8 | |
| Open-loop voltage gain over temperature | AOL | 130 | dB | TA = -40°C to +125°C, RLOAD = 10kΩ | 8 | ||
| Open-loop voltage gain | AOL | 130 | 144 | dB | VS = ±15V, (V-) + 1.7V < VO < (V+), 1.7V, RLOAD = 2kΩ | 8 | |
| Output swing from positive rail, no load | VO | 26 | 40 | mV | Positive rail, VS = 30V, no load | 9 | |
| Output swing from positive rail | VO | 122 | 150 | mV | Positive rail, VS = 30V, RLOAD = 10kΩ | 9 | |
| Output swing from positive rail | VO | 500 | 575 | mV | Positive rail, VS = 30V, RLOAD = 2kΩ | 9 | |
| Output swing from negative rail, no load | VO | 26 | 40 | mV | Negative rail, VS = 30V, no load | 9 | |
| Output swing from negative rail | VO | 120 | 135 | mV | Negative rail, VS = 30V, RLOAD = 10kΩ | 9 | |
| Output swing from negative rail | VO | 515 | 575 | mV | Negative rail, VS = 30V, RLOAD = 2kΩ | 9 | |
| Output swing from rail over temperature | VO | 250 | mV | RLOAD = 10kΩ, TA = -40°C to +125°C, both rails | 9 | ||
| Quiescent current per amplifier | IQ | 1.5 | 1.8 | mA | VS = ±2.25V (VS = 4.5V), IO = 0A | 9 | |
| Quiescent current per amplifier over temperature | IQ | 1.5 | 1.9 | mA | VS = ±2.25V (VS = 4.5V), IO = 0A, TA = -40°C to +125°C | 9 | |
| Common-mode voltage range | VCM | -0.1 | -1.7 | V | Printed as (V-), 0.1 to (V+), 1.7; min is relative to V-, max relative to V+ | 8 | |
| Supply voltage, single supply | VS | 4.5 | 36 | V | (V+), (V-) | 6 | |
| Supply voltage, dual supply | VS | -2.25 | 18 | V | Printed ±2.25 to ±18 | 6 | |
| Operating temperature | TA | -40 | 125 | °C | 6 | ||
| Supply voltage | VS | 40 | V | 6 | |||
| Signal input pin current | -10 | 10 | mA | Signal input pins | 6 | ||
| Operating temperature | TA | -55 | 150 | °C | 6 | ||
| Junction temperature | TJ | 150 | °C | 6 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| ESD HBM | V(ESD) | -4000 | 4000 | V | Human-body model, ANSI/ESDA/JEDEC JS-001 | 6 | |
| ESD CDM | V(ESD) | -250 | 250 | V | Charged-device model, JS-002, TLV888D | 6 | |
| Junction-to-ambient thermal resistance | RθJA | 144.1 | °C/W | D (SOIC), 8 pins | 7 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 81.9 | °C/W | D (SOIC), 8 pins | 7 | ||
| Junction-to-board thermal resistance | RθJB | 88.9 | °C/W | D (SOIC), 8 pins | 7 | ||
| Junction-to-top characterization parameter | ΨJT | 26.2 | °C/W | D (SOIC), 8 pins | 7 | ||
| Junction-to-board characterization parameter | ΨJB | 88.3 | °C/W | D (SOIC), 8 pins | 7 | ||
| Input voltage noise | En | 0.18 | µVPP | f = 0.1Hz to 10Hz | 8 | ||
| Input voltage noise density | en | 7.5 | nV/√Hz | f = 1kHz | 8 | ||
| Input current noise density | in | 175 | fA/√Hz | f = 1kHz | 8 | ||
| Gain-bandwidth product | GBW | 14 | MHz | 9 | |||
| Slew rate | SR | 40 | V/µs | Gain = 1, 10V step | 9 | ||
| Short-circuit current | ISC | 42 | mA | Printed ±42 | 9 | ||
| Open-loop output impedance | ZO | 220 | Ω | f = 1MHz | 9 |
CAD (KiCad official)
- Symbol:
TLV888DR - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
tlv888dr-etched.step/tlv888dr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv888dr.step/tlv888dr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (55 pp, sha256
cfad4277ce2e96a3, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).