component
TLV75509PDRVR
Public Made by Adomby adom
Texas Instruments Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, WSON-6-EP(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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TLV75509PDRVR
Texas Instruments · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · WSON-6-EP(2x2)
TLV75509PDRVR from Texas Instruments, in a WSON-6-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | output | Regulated output voltage pin that requires a capacitor of 1µF or larger to ground, with nominal input and output capacitance greater than 0.47µF after 50% derating. |
| 2 | NC | unconnected | No internal connection. |
| 3 | GND | power_in | Ground pin, internally connected to the thermal pad. |
| 4 | EN | input | Enable pin: drive greater than VHI to turn on the regulator and less than VLO to place the LDO into shutdown mode. |
| 5 | NC | unconnected | No internal connection. |
| 6 | IN | power_in | Input pin that requires a capacitor of 1µF or larger to ground; the input voltage range is 1.45V to 5.5V. |
| 7 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-6-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage | VIN | 1.45 | 5.5 | V | 4 | ||
| Output voltage | VOUT | 0.6 | 5 | V | 4 | ||
| Enable voltage | VEN | 0 | 5.5 | V | 4 | ||
| Output current | IOUT | 0 | 500 | mA | 4 | ||
| Input capacitor | CIN | 1 | μF | 4 | |||
| Output capacitor | COUT | 1 | 200 | μF | 4 | ||
| Enable toggle frequency | fEN | 10 | kHz | 4 | |||
| Junction temperature | TJ | -40 | 125 | °C | 4 | ||
| Supply voltage | VIN | -0.3 | 6 | V | 4 | ||
| Enable voltage | VEN | -0.3 | 6 | V | 4 | ||
| Output voltage | VOUT | -0.3 | V | max VIN + 0.3 V or 6.0 V, whichever is smaller | 4 | ||
| Operating junction temperature | TJ | -40 | 150 | °C | 4 | ||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Junction-to-ambient thermal resistance (JEDEC, DRV) | RθJA | 100.2 | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 | ||
| Junction-to-case (top) thermal resistance (JEDEC, DRV) | RθJC(top) | 108.5 | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 | ||
| Junction-to-board thermal resistance (JEDEC, DRV) | RθJB | 64.3 | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 | ||
| Junction-to-top characterization parameter (JEDEC, DRV) | ψJT | 10.4 | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 | ||
| Junction-to-board characterization parameter (JEDEC, DRV) | ψJB | 64.8 | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 | ||
| Junction-to-case (bottom) thermal resistance (JEDEC, DRV) | RθJC(bot) | 34.7 | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 | ||
| Output accuracy | VOUT | -1 | 1 | % | −40°C ≤ TJ ≤ +85°C, DBV and DRV package | 5 | |
| Output accuracy | VOUT | -10 | 10 | mV | −40°C ≤ TJ ≤ +85°C; 0.6V ≤ VOUT < 1.0V | 5 | |
| Output accuracy | VOUT | -15 | 15 | mV | 0.6V ≤ VOUT < 1V | 5 | |
| Ground current | IGND | 14 | 25 | µA | TJ = 25°C, IOUT = 0mA | 5 | |
| Ground current | IGND | 33 | µA | −40°C ≤ TJ ≤ +85°C, IOUT = 0mA | 5 | ||
| Ground current | IGND | 40 | µA | −40°C ≤ TJ ≤ +125°C, IOUT = 0mA | 5 | ||
| Shutdown current | ISHDN | 0.1 | 1 | µA | VEN ≤ 0.4V, 1.4V ≤ VIN ≤ 5.5V, −40°C ≤ TJ ≤ +125°C | 5 | |
| Output current limit | ICL | 560 | 720 | 865 | mA | VIN = VOUT+ VDO(MAX) + 0.25V; VOUT = VOUT - 0.2V, VOUT ≤ 1.5V | 5 |
| Short-circuit current limit | ISC | 355 | mA | VOUT = 0V | 5 | ||
| Dropout voltage | VDO | 600 | 930 | mV | IOUT = 500mA, −40°C ≤ TJ ≤ +85°C, 0.8 V ≤ VOUT < 1.0V | 6 | |
| Dropout voltage | VDO | 985 | mV | IOUT = 500mA, −40°C ≤ TJ ≤ +125°C, 0.8V ≤ VOUT < 1.0V | 6 | ||
| Power-supply rejection ratio | PSRR | 52 | dB | f = 1kHz, VIN = VOUT + 1V, IOUT = 50mA | 6 | ||
| Power-supply rejection ratio | PSRR | 46 | dB | f = 100kHz, VIN = VOUT + 1V, IOUT = 50mA | 6 | ||
| Output noise voltage | VN | 71.5 | µVRMS | BW = 10Hz to 100kHz; VOUT = 1.2V, IOUT = 50 mA | 6 | ||
| Undervoltage lockout | VUVLO | 1.21 | 1.3 | 1.44 | V | VIN rising | 6 |
| Undervoltage lockout hysteresis | VUVLO,HYST | 40 | mV | VIN falling | 6 | ||
| Startup time | tSTR | 550 | µs | 6 | |||
| EN pin high voltage (enabled) | VHI | 1 | V | enabled | 6 | ||
| EN pin low voltage (enabled) | VLO | 0.3 | V | enabled | 6 | ||
| Enable pin current | IEN | 10 | nA | EN = 5.5V | 6 | ||
| Thermal shutdown | TSD | 165 | °C | Shutdown, temperature increasing | 6 | ||
| Thermal shutdown reset | TSD | 155 | °C | Reset, temperature decreasing | 6 | ||
| Pulldown resistance | RPULLDOWN | 120 | Ω | VIN = 5.5V | 6 |
CAD (KiCad official)
- Symbol:
TLV75509PDRVR - Footprint:
Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm - 3D model: WSON-6-EP(2x2) (KiCad packages3D, STEP)
- 3D model files:
tlv75509pdrvr-etched.step/tlv75509pdrvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tlv75509pdrvr.step/tlv75509pdrvr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (51 pp, sha256
c1153fc652d345a9, retrieved 2026-11-06, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# TLV75509PDRVR
**Texas Instruments** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · WSON-6-EP(2x2)
TLV75509PDRVR from Texas Instruments, in a WSON-6-EP(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | output | Regulated output voltage pin that requires a capacitor of 1µF or larger to ground, with nominal input and output capacitance greater than 0.47µF after 50% derating. |
| 2 | NC | unconnected | No internal connection. |
| 3 | GND | power_in | Ground pin, internally connected to the thermal pad. |
| 4 | EN | input | Enable pin: drive greater than VHI to turn on the regulator and less than VLO to place the LDO into shutdown mode. |
| 5 | NC | unconnected | No internal connection. |
| 6 | IN | power_in | Input pin that requires a capacitor of 1µF or larger to ground; the input voltage range is 1.45V to 5.5V. |
| 7 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | WSON-6-EP(2x2) |
| Category | Power Management (PMIC) |
| Pins | 7 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage | VIN | 1.45 | | 5.5 | V | | 4 |
| Output voltage | VOUT | 0.6 | | 5 | V | | 4 |
| Enable voltage | VEN | 0 | | 5.5 | V | | 4 |
| Output current | IOUT | 0 | | 500 | mA | | 4 |
| Input capacitor | CIN | 1 | | | μF | | 4 |
| Output capacitor | COUT | 1 | | 200 | μF | | 4 |
| Enable toggle frequency | fEN | | | 10 | kHz | | 4 |
| Junction temperature | TJ | -40 | | 125 | °C | | 4 |
| Supply voltage | VIN | -0.3 | | 6 | V | | 4 |
| Enable voltage | VEN | -0.3 | | 6 | V | | 4 |
| Output voltage | VOUT | -0.3 | | | V | max VIN + 0.3 V or 6.0 V, whichever is smaller | 4 |
| Operating junction temperature | TJ | -40 | | 150 | °C | | 4 |
| Storage temperature | Tstg | -65 | | 150 | °C | | 4 |
| Junction-to-ambient thermal resistance (JEDEC, DRV) | RθJA | | 100.2 | | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 |
| Junction-to-case (top) thermal resistance (JEDEC, DRV) | RθJC(top) | | 108.5 | | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 |
| Junction-to-board thermal resistance (JEDEC, DRV) | RθJB | | 64.3 | | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 |
| Junction-to-top characterization parameter (JEDEC, DRV) | ψJT | | 10.4 | | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 |
| Junction-to-board characterization parameter (JEDEC, DRV) | ψJB | | 64.8 | | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 |
| Junction-to-case (bottom) thermal resistance (JEDEC, DRV) | RθJC(bot) | | 34.7 | | °C/W | JEDEC PCB, DRV (WSON, 6 pins) | 5 |
| Output accuracy | VOUT | -1 | | 1 | % | −40°C ≤ TJ ≤ +85°C, DBV and DRV package | 5 |
| Output accuracy | VOUT | -10 | | 10 | mV | −40°C ≤ TJ ≤ +85°C; 0.6V ≤ VOUT < 1.0V | 5 |
| Output accuracy | VOUT | -15 | | 15 | mV | 0.6V ≤ VOUT < 1V | 5 |
| Ground current | IGND | | 14 | 25 | µA | TJ = 25°C, IOUT = 0mA | 5 |
| Ground current | IGND | | | 33 | µA | −40°C ≤ TJ ≤ +85°C, IOUT = 0mA | 5 |
| Ground current | IGND | | | 40 | µA | −40°C ≤ TJ ≤ +125°C, IOUT = 0mA | 5 |
| Shutdown current | ISHDN | | 0.1 | 1 | µA | VEN ≤ 0.4V, 1.4V ≤ VIN ≤ 5.5V, −40°C ≤ TJ ≤ +125°C | 5 |
| Output current limit | ICL | 560 | 720 | 865 | mA | VIN = VOUT+ VDO(MAX) + 0.25V; VOUT = VOUT - 0.2V, VOUT ≤ 1.5V | 5 |
| Short-circuit current limit | ISC | | 355 | | mA | VOUT = 0V | 5 |
| Dropout voltage | VDO | | 600 | 930 | mV | IOUT = 500mA, −40°C ≤ TJ ≤ +85°C, 0.8 V ≤ VOUT < 1.0V | 6 |
| Dropout voltage | VDO | | | 985 | mV | IOUT = 500mA, −40°C ≤ TJ ≤ +125°C, 0.8V ≤ VOUT < 1.0V | 6 |
| Power-supply rejection ratio | PSRR | | 52 | | dB | f = 1kHz, VIN = VOUT + 1V, IOUT = 50mA | 6 |
| Power-supply rejection ratio | PSRR | | 46 | | dB | f = 100kHz, VIN = VOUT + 1V, IOUT = 50mA | 6 |
| Output noise voltage | VN | | 71.5 | | µVRMS | BW = 10Hz to 100kHz; VOUT = 1.2V, IOUT = 50 mA | 6 |
| Undervoltage lockout | VUVLO | 1.21 | 1.3 | 1.44 | V | VIN rising | 6 |
| Undervoltage lockout hysteresis | VUVLO,HYST | | 40 | | mV | VIN falling | 6 |
| Startup time | tSTR | | 550 | | µs | | 6 |
| EN pin high voltage (enabled) | VHI | | 1 | | V | enabled | 6 |
| EN pin low voltage (enabled) | VLO | | 0.3 | | V | enabled | 6 |
| Enable pin current | IEN | | 10 | | nA | EN = 5.5V | 6 |
| Thermal shutdown | TSD | | 165 | | °C | Shutdown, temperature increasing | 6 |
| Thermal shutdown reset | TSD | | 155 | | °C | Reset, temperature decreasing | 6 |
| Pulldown resistance | RPULLDOWN | | 120 | | Ω | VIN = 5.5V | 6 |
## CAD (KiCad official)
- Symbol: `TLV75509PDRVR`
- Footprint: `Package_SON:WSON-6-1EP_2x2mm_P0.65mm_EP1x1.6mm`
- 3D model: WSON-6-EP(2x2) (KiCad packages3D, STEP)
- 3D model files: `tlv75509pdrvr-etched.step` / `tlv75509pdrvr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tlv75509pdrvr.step` / `tlv75509pdrvr.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tlv755p) (51 pp, sha256 `c1153fc652d345a9`, retrieved 2026-11-06, tier: manufacturer)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/tlv75509pdrvr-datasheet.pdf)