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TK3P80E

Public Made by Adom

by adom

TOSHIBA MOSFETs, DPAK. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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TK3P80E

TOSHIBA · MOSFETs · DPAK

TK3P80E from TOSHIBA, in a DPAK. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input MOSFET gate terminal; the gate-source voltage is rated at ±30 V (VGSS) absolute maximum.
2 Drain passive Drain terminal, also the heatsink tab; the drain-source voltage is rated at 800 V (VDSS) absolute maximum and DC drain current at 3 A.
3 Source passive Source terminal, the reference for the gate drive; reverse (body diode) DC current is rated at 3 A (IDR).

Key specifications

Parameter Value
Manufacturer TOSHIBA
Package DPAK
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate leakage current IGSS -1 1 µA VGS = ±30 V, VDS = 0 V 3
Drain cut-off current IDSS 10 µA VDS = 640 V, VGS = 0 V 3
Drain-source breakdown voltage V(BR)DSS 800 V ID = 10 mA, VGS = 0 V 3
Gate threshold voltage Vth 2.5 4 V VDS = 10 V, ID = 0.3 mA 3
Drain-source on-resistance RDS(ON) 3.9 4.9 Ω VGS = 10 V, ID = 1.5 A 3
MOSFET dv/dt ruggedness dv/dt 10 V/ns VDD = 0 to 400 V, ID = 3 A 3
Diode forward voltage VDSF -1.7 V IDR = 3 A, VGS = 0 V 3
Drain-source voltage VDSS 800 V 1
Gate-source voltage VGSS -30 30 V 1
Drain current (DC) ID 3 A Tc = 25 °C 1
Drain current (pulsed) IDP 9 A 1
Power dissipation PD 80 W Tc = 25 °C 1
Avalanche current IAR 3 A 1
Reverse drain current (DC) IDR 3 A 1
Reverse drain current (pulsed) IDRP 9 A 1
Channel temperature Tch 150 °C 1
Storage temperature Tstg -55 150 °C 1
Channel-to-case thermal resistance Rth(ch-c) 1.56 °C/W 2

CAD (KiCad official)

  • Symbol: TK3P80E
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: DPAK (KiCad packages3D, STEP)
  • 3D model files: tk3p80e-etched.step / tk3p80e-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tk3p80e.step / tk3p80e.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA datasheet (9 pp, sha256 e002c53ba759e535, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF