# TEA2025BM

**HGSEMI** · Audio Amplifiers · SOP-16

TEA2025BM from HGSEMI, in a SOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AUXBTL | passive | BTL auxiliary pin used for bridge-tied-load operation; the datasheet gives no electrical limit for this pin. |
| 2 | 2OUT | output | Channel 2 power output, with peak output current limited to 1.5 A (absolute maximum rating). |
| 3 | 2BS | passive | Channel 2 bootstrap pin; the datasheet gives no electrical limit for this pin. |
| 4 | 2GNDp | power_in | Channel 2 power amplifier ground. |
| 5 | 2GNDp | power_in | Channel 2 power amplifier ground. |
| 6 | 2FB | passive | Channel 2 feedback pin, used with external resistors to set the closed-loop voltage gain (maximum 45 dB in dual-channel mode, adjustable externally). |
| 7 | 2IN | input | Channel 2 signal input; the typical input impedance is 30 kΩ. |
| 8 | FIL | passive | Filter pin for the internal reference; the datasheet gives no electrical limit for this pin. |
| 9 | GND | power_in | Ground pin for the signal circuitry. |
| 10 | 1IN | input | Channel 1 signal input; the typical input impedance is 30 kΩ. |
| 11 | 1FB | passive | Channel 1 feedback pin, used with external resistors to set the closed-loop voltage gain (maximum 45 dB in dual-channel mode, adjustable externally). |
| 12 | 1GNDp | power_in | Channel 1 power amplifier ground. |
| 13 | 1GNDp | power_in | Channel 1 power amplifier ground. |
| 14 | 1BS | passive | Channel 1 bootstrap pin; the datasheet gives no electrical limit for this pin. |
| 15 | 1OUT | output | Channel 1 power output, with peak output current limited to 1.5 A (absolute maximum rating). |
| 16 | Vcc | power_in | Supply voltage: operating range 3 V to 9 V, absolute maximum 12 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-16 |
| Category | Amplifiers/Comparators |
| Pins | 16 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (Vcc) | Vcc | 3 |  | 9 | V |  | 3 |
| Quiescent current | Icco |  | 40 | 50 | mW |  | 3 |
| Static output voltage | VO(DC) | 4 | 4.5 | 5 | V |  | 3 |
| Closed-loop voltage gain, dual-channel mode | AVF | 43 | 45 | 47 | dB | 双通道模式 | 3 |
| Closed-loop voltage gain, BTL mode | AVF | 49 | 51 | 53 | dB | BTL 模式 | 3 |
| Channel balance | CB | -1 |  | 1 | dB |  | 3 |
| Total harmonic distortion, dual-channel | THD |  | 0.3 | 1.5 | % | RL=4Ω, Po=250mW, Vcc=9V, f=1kHz, 双通道 | 3 |
| Channel separation | CSR | 40 | 55 |  | dB | Rg=10kΩ, f=1kHz, RL=4Ω, Po=1W | 3 |
| Ripple rejection ratio | Srip | 40 | 46 |  | dB | Rg=0, frip=100Hz, Vrip=150Mv, Av=45dB | 3 |
| Input noise voltage | VNI |  | 1.5 | 3 | μV | BW:20Hz~20KHz, Av=200, Rg=0 | 3 |
| Input noise voltage | VNI |  | 3 | 6 | μV | BW:20Hz~20KHz, Av=200, Rg=10kΩ | 3 |
| Input noise voltage, Vcc=9V, RL=4Ω | VNI |  | 1.7 | 2.3 | μV | BW:20Hz~20KHz, Av=200, Vcc=9V, RL=4Ω | 3 |
| Input noise voltage, Vcc=6V, RL=4Ω | VNI |  | 0.7 | 1 | μV | BW:20Hz~20KHz, Av=200, Vcc=6V, RL=4Ω | 3 |
| Supply voltage (absolute maximum) | Vcc |  |  | 12 | V |  | 3 |
| Output peak current | Iop |  |  | 1.5 | A |  | 3 |
| Junction temperature | Tj |  |  | 150 | ℃ |  | 3 |
| Storage temperature | Ts | -40 |  | 150 | ℃ |  | 3 |
| Lead temperature (soldering) | TLEAD |  |  | 245 | ℃ | 焊接 10s | 3 |
| Thermal resistance, junction-to-case | Rth（j-c） |  | 15 |  | ℃/W |  | 3 |
| Thermal resistance, junction-to-ambient | Rth（j-a） |  | 60 |  | ℃/W | 10×5×0.15cm 玻璃环氧印制板, 5cm2 面积, 35µm 铜膜 | 3 |

## CAD (KiCad official)

- Symbol: `TEA2025BM`
- Footprint: `Package_SO:SOIC-16_3.9x9.9mm_P1.27mm`
- 3D model: SOP-16 (KiCad packages3D, STEP)
- 3D model files: `tea2025bm-etched.step` / `tea2025bm-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tea2025bm.step` / `tea2025bm.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HGSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603187156760477696) (8 pp, sha256 `278dc31584507fcf`, retrieved 2026-10-19, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tea2025bm-datasheet.pdf)