component
TEA2025BM
Public Made by Adomby adom
HGSEMI Audio Amplifiers, SOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 8d ago |
| viewers | 8d ago |
| package.json | 8d ago |
| page.json | 8d ago |
| README.md | 8d ago |
| tea2025bm-etched.glb | 8d ago |
| tea2025bm-etched.step | 8d ago |
| tea2025bm-hero.glb | 8d ago |
| tea2025bm-hero.overlay.json | 8d ago |
| tea2025bm.glb | 8d ago |
| tea2025bm.kicad_mod | 8d ago |
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| tea2025bm.lbr | 8d ago |
| tea2025bm.step | 8d ago |
TEA2025BM
HGSEMI · Audio Amplifiers · SOP-16
TEA2025BM from HGSEMI, in a SOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | AUXBTL | passive | BTL auxiliary pin used for bridge-tied-load operation; the datasheet gives no electrical limit for this pin. |
| 2 | 2OUT | output | Channel 2 power output, with peak output current limited to 1.5 A (absolute maximum rating). |
| 3 | 2BS | passive | Channel 2 bootstrap pin; the datasheet gives no electrical limit for this pin. |
| 4 | 2GNDp | power_in | Channel 2 power amplifier ground. |
| 5 | 2GNDp | power_in | Channel 2 power amplifier ground. |
| 6 | 2FB | passive | Channel 2 feedback pin, used with external resistors to set the closed-loop voltage gain (maximum 45 dB in dual-channel mode, adjustable externally). |
| 7 | 2IN | input | Channel 2 signal input; the typical input impedance is 30 kΩ. |
| 8 | FIL | passive | Filter pin for the internal reference; the datasheet gives no electrical limit for this pin. |
| 9 | GND | power_in | Ground pin for the signal circuitry. |
| 10 | 1IN | input | Channel 1 signal input; the typical input impedance is 30 kΩ. |
| 11 | 1FB | passive | Channel 1 feedback pin, used with external resistors to set the closed-loop voltage gain (maximum 45 dB in dual-channel mode, adjustable externally). |
| 12 | 1GNDp | power_in | Channel 1 power amplifier ground. |
| 13 | 1GNDp | power_in | Channel 1 power amplifier ground. |
| 14 | 1BS | passive | Channel 1 bootstrap pin; the datasheet gives no electrical limit for this pin. |
| 15 | 1OUT | output | Channel 1 power output, with peak output current limited to 1.5 A (absolute maximum rating). |
| 16 | Vcc | power_in | Supply voltage: operating range 3 V to 9 V, absolute maximum 12 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HGSEMI |
| Package | SOP-16 |
| Category | Amplifiers/Comparators |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (Vcc) | Vcc | 3 | 9 | V | 3 | ||
| Quiescent current | Icco | 40 | 50 | mW | 3 | ||
| Static output voltage | VO(DC) | 4 | 4.5 | 5 | V | 3 | |
| Closed-loop voltage gain, dual-channel mode | AVF | 43 | 45 | 47 | dB | 双通道模式 | 3 |
| Closed-loop voltage gain, BTL mode | AVF | 49 | 51 | 53 | dB | BTL 模式 | 3 |
| Channel balance | CB | -1 | 1 | dB | 3 | ||
| Total harmonic distortion, dual-channel | THD | 0.3 | 1.5 | % | RL=4Ω, Po=250mW, Vcc=9V, f=1kHz, 双通道 | 3 | |
| Channel separation | CSR | 40 | 55 | dB | Rg=10kΩ, f=1kHz, RL=4Ω, Po=1W | 3 | |
| Ripple rejection ratio | Srip | 40 | 46 | dB | Rg=0, frip=100Hz, Vrip=150Mv, Av=45dB | 3 | |
| Input noise voltage | VNI | 1.5 | 3 | μV | BW:20Hz~20KHz, Av=200, Rg=0 | 3 | |
| Input noise voltage | VNI | 3 | 6 | μV | BW:20Hz~20KHz, Av=200, Rg=10kΩ | 3 | |
| Input noise voltage, Vcc=9V, RL=4Ω | VNI | 1.7 | 2.3 | μV | BW:20Hz~20KHz, Av=200, Vcc=9V, RL=4Ω | 3 | |
| Input noise voltage, Vcc=6V, RL=4Ω | VNI | 0.7 | 1 | μV | BW:20Hz~20KHz, Av=200, Vcc=6V, RL=4Ω | 3 | |
| Supply voltage (absolute maximum) | Vcc | 12 | V | 3 | |||
| Output peak current | Iop | 1.5 | A | 3 | |||
| Junction temperature | Tj | 150 | ℃ | 3 | |||
| Storage temperature | Ts | -40 | 150 | ℃ | 3 | ||
| Lead temperature (soldering) | TLEAD | 245 | ℃ | 焊接 10s | 3 | ||
| Thermal resistance, junction-to-case | Rth（j-c） | 15 | ℃/W | 3 | |||
| Thermal resistance, junction-to-ambient | Rth（j-a） | 60 | ℃/W | 10×5×0.15cm 玻璃环氧印制板, 5cm2 面积, 35µm 铜膜 | 3 |
CAD (KiCad official)
- Symbol:
TEA2025BM - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOP-16 (KiCad packages3D, STEP)
- 3D model files:
tea2025bm-etched.step/tea2025bm-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tea2025bm.step/tea2025bm.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HGSEMI datasheet (8 pp, sha256
278dc31584507fcf, retrieved 2026-10-19, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).