# TDZ4V3J

**Nexperia** · Zener Diodes · SOD-323F

TDZ4V3J from Nexperia, in a SOD-323F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | cathode | passive | Cathode, identified by the marking bar on the package; the datasheet gives the 500 mW total power dissipation at Tamb ≤ 25 °C for a device mounted with a 16 mm² mounting pad for the cathode. |
| 2 | anode | passive | Anode; the datasheet gives no anode-specific limit, so the device-level limiting values in Table 5 (such as IF = 250 mA maximum forward current) apply. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Nexperia |
| Package | SOD-323F |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working voltage (Zener voltage) for TDZ4V3J | VZ | 4.21 |  | 4.39 | V | IZ = 5 mA; Tj = 25 °C | 4 |
| Differential resistance | rdif |  |  | 600 | Ω | IZ = 5 mA | 4 |
| Differential resistance | rdif |  |  | 90 | Ω | IZ = 1 mA | 4 |
| Reverse current | IR |  |  | 3 | µA | VR = 1.0 V | 4 |
| Temperature coefficient (minimum column as printed) | SZ | 0 |  |  | mV/K | IZ = 5 mA | 4 |
| Temperature coefficient (maximum column as printed) | SZ |  |  | 3.5 | mV/K | IZ = 5 mA | 4 |
| Diode capacitance | Cd |  |  | 350 | pF | f = 1 MHz; VR = 0 V | 4 |
| Non-repetitive peak reverse current | IZSM |  |  | 15 | A | tp = 100 µs; square wave; Tj = 25 °C before surge | 4 |
| Non-repetitive peak reverse power dissipation (TDZ2V4J to TDZ5V6J range, includes TDZ4V3J) | PZSM |  |  | 180 | W | tp = 100 µs; square wave; Tj = 25 °C before surge | 3 |
| Forward current | IF |  |  | 250 | mA |  | 3 |
| Total power dissipation | Ptot |  |  | 500 | mW | Tamb ≤ 25 °C; device mounted on FR4 PCB, mounting pad for cathode 16 mm2 | 3 |
| Junction temperature | Tj |  |  | 150 | °C |  | 3 |
| Ambient temperature | Tamb | -55 |  | 150 | °C |  | 3 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 3 |
| Thermal resistance from junction to ambient | Rth(j-a) |  |  | 250 | K/W | in free air; device mounted on FR4 PCB, mounting pad for cathode 16 mm2 | 3 |
| Thermal resistance from junction to solder point | Rth(j-sp) |  |  | 25 | K/W | soldering point of cathode tab | 3 |
| Forward voltage | VF |  |  | 0.9 | V | IF = 10 mA; pulse test tp ≤ 300 µs | 3 |
| Forward voltage | VF |  |  | 1.1 | V | IF = 100 mA; pulse test tp ≤ 300 µs | 3 |

## CAD (KiCad official)

- Symbol: `TDZ4V3J`
- Footprint: `Diode_SMD:D_SOD-323F`
- 3D model: SOD-323F (KiCad packages3D, STEP)
- 3D model files: `tdz4v3j-etched.step` / `tdz4v3j-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tdz4v3j.step` / `tdz4v3j.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Nexperia datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588914924005568512) (12 pp, sha256 `4abbeb9e227df5d0`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tdz4v3j-datasheet.pdf)