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Contents

README

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TDZ4V3J

Nexperia · Zener Diodes · SOD-323F

TDZ4V3J from Nexperia, in a SOD-323F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 cathode passive Cathode, identified by the marking bar on the package; the datasheet gives the 500 mW total power dissipation at Tamb ≤ 25 °C for a device mounted with a 16 mm² mounting pad for the cathode.
2 anode passive Anode; the datasheet gives no anode-specific limit, so the device-level limiting values in Table 5 (such as IF = 250 mA maximum forward current) apply.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-323F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (Zener voltage) for TDZ4V3J VZ 4.21 4.39 V IZ = 5 mA; Tj = 25 °C 4
Differential resistance rdif 600 Ω IZ = 5 mA 4
Differential resistance rdif 90 Ω IZ = 1 mA 4
Reverse current IR 3 µA VR = 1.0 V 4
Temperature coefficient (minimum column as printed) SZ 0 mV/K IZ = 5 mA 4
Temperature coefficient (maximum column as printed) SZ 3.5 mV/K IZ = 5 mA 4
Diode capacitance Cd 350 pF f = 1 MHz; VR = 0 V 4
Non-repetitive peak reverse current IZSM 15 A tp = 100 µs; square wave; Tj = 25 °C before surge 4
Non-repetitive peak reverse power dissipation (TDZ2V4J to TDZ5V6J range, includes TDZ4V3J) PZSM 180 W tp = 100 µs; square wave; Tj = 25 °C before surge 3
Forward current IF 250 mA 3
Total power dissipation Ptot 500 mW Tamb ≤ 25 °C; device mounted on FR4 PCB, mounting pad for cathode 16 mm2 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance from junction to ambient Rth(j-a) 250 K/W in free air; device mounted on FR4 PCB, mounting pad for cathode 16 mm2 3
Thermal resistance from junction to solder point Rth(j-sp) 25 K/W soldering point of cathode tab 3
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 µs 3
Forward voltage VF 1.1 V IF = 100 mA; pulse test tp ≤ 300 µs 3

CAD (KiCad official)

  • Symbol: TDZ4V3J
  • Footprint: Diode_SMD:D_SOD-323F
  • 3D model: SOD-323F (KiCad packages3D, STEP)
  • 3D model files: tdz4v3j-etched.step / tdz4v3j-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tdz4v3j.step / tdz4v3j.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (12 pp, sha256 4abbeb9e227df5d0, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF