# TCAN1051VDRBTQ1

**Texas Instruments** · CAN Transceivers · HVSON-8-EP(3x3)

TCAN1051VDRBTQ1 from Texas Instruments, in a HVSON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TXD | input | CAN transmit data input; LOW for dominant and HIGH for recessive bus states. |
| 2 | GND | power_in | Ground connection; for the DRB (VSON) package the thermal pad may be connected to GND to optimize the package's thermal characteristics. |
| 3 | VCC | power_in | Transceiver 5-V supply voltage; the device is designed to operate from VCC between 4.5 V and 5.5 V. |
| 4 | RXD | output | CAN receive data output; LOW for dominant and HIGH for recessive bus states, with output current limited to ±8 mA (absolute maximum). |
| 5 | VIO | power_in | I/O level-shifting supply input (V-suffix devices only), designed for 3 V to 5.5 V and used to set the logic input thresholds and RXD output level. |
| 6 | CANL | bidirectional | Low-level CAN bus input/output line; bus I/O voltage range is -58 V to 58 V for devices without the H suffix. |
| 7 | CANH | bidirectional | High-level CAN bus input/output line; bus I/O voltage range is -58 V to 58 V for devices without the H suffix. |
| 8 | S | input | Silent Mode control input, active high. |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | HVSON-8-EP(3x3) |
| Category | Interface |
| Pins | 9 |

## CAD (KiCad official)

- Symbol: `TCAN1051VDRBTQ1`
- Footprint: `Package_SON:HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm`
- 3D model: HVSON-8-EP(3x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal VQFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files: `tcan1051vdrbtq1-etched.step` / `tcan1051vdrbtq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `tcan1051vdrbtq1.step` / `tcan1051vdrbtq1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/tcan1051-q1) (51 pp, sha256 `f32891816edd461b`, retrieved 2026-10-08, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/tcan1051vdrbtq1-datasheet.pdf)