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Generated by kicad-footprint-generator · KiCad file format 20260206

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TCAN1051VDRBTQ1

Texas Instruments · CAN Transceivers · HVSON-8-EP(3x3)

TCAN1051VDRBTQ1 from Texas Instruments, in a HVSON-8-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	TXD	input	CAN transmit data input; LOW for dominant and HIGH for recessive bus states.
2	GND	power_in	Ground connection; for the DRB (VSON) package the thermal pad may be connected to GND to optimize the package's thermal characteristics.
3	VCC	power_in	Transceiver 5-V supply voltage; the device is designed to operate from VCC between 4.5 V and 5.5 V.
4	RXD	output	CAN receive data output; LOW for dominant and HIGH for recessive bus states, with output current limited to ±8 mA (absolute maximum).
5	VIO	power_in	I/O level-shifting supply input (V-suffix devices only), designed for 3 V to 5.5 V and used to set the logic input thresholds and RXD output level.
6	CANL	bidirectional	Low-level CAN bus input/output line; bus I/O voltage range is -58 V to 58 V for devices without the H suffix.
7	CANH	bidirectional	High-level CAN bus input/output line; bus I/O voltage range is -58 V to 58 V for devices without the H suffix.
8	S	input	Silent Mode control input, active high.
9	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	HVSON-8-EP(3x3)
Category	Interface
Pins	9

CAD (KiCad official)

Symbol: TCAN1051VDRBTQ1
Footprint: Package_SON:HVSON-8-1EP_3x3mm_P0.65mm_EP1.6x2.4mm
3D model: HVSON-8-EP(3x3), generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal VQFN height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
3D model files: tcan1051vdrbtq1-etched.step / tcan1051vdrbtq1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); tcan1051vdrbtq1.step / tcan1051vdrbtq1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (51 pp, sha256 f32891816edd461b, retrieved 2026-10-08, tier: lcsc)
Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF