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TCA9555RGER
Public Made by Adomby adom
Texas Instruments I/O Expanders, VQFN-24-EP(4x4). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownTCA9555RGER
Texas Instruments · I/O Expanders · VQFN-24-EP(4x4)
TCA9555RGER from Texas Instruments, in a VQFN-24-EP(4x4). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | P00 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 2 | P01 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 3 | P02 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 4 | P03 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 5 | P04 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 6 | P05 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 7 | P06 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 8 | P07 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 9 | GND | power_in | Ground. The exposed thermal pad, if used, must be connected as a secondary ground or left electrically open. |
| 10 | P10 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 11 | P11 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 12 | P12 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 13 | P13 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 14 | P14 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 15 | P15 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 16 | P16 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 17 | P17 | bidirectional | P-port I/O with push-pull design structure, configured as an input at power on. |
| 18 | A0 | input | Address input 0. Connect directly to VCC or ground. |
| 19 | SCL | input | Serial clock bus. Connect to VCC through a pull-up resistor. |
| 20 | SDA | bidirectional | Serial data bus. Connect to VCC through a pull-up resistor. |
| 21 | VCC | power_in | Supply voltage. Recommended operating range is 1.65 V to 5.5 V. |
| 22 | INT | output | Interrupt output. Connect to VCC through a pull-up resistor. |
| 23 | A1 | input | Address input 1. Connect directly to VCC or ground. |
| 24 | A2 | input | Address input 2. Connect directly to VCC or ground. |
| 25 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-24-EP(4x4) |
| Category | Interface |
| Pins | 25 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | 1.65 | 5.5 | V | 5 | ||
| High-level input voltage | VIH | 0.7 | x VCC | SCL, SDA; printed maximum is VCC | 5 | ||
| Low-level input voltage | VIL | 0.3 | x VCC | SCL, SDA | 5 | ||
| High-level input voltage | VIH | 5.5 | V | A2-A0, P07-P00, P17-P10 | 5 | ||
| High-level output current | IOH | -10 | mA | P07-P00, P17-P10 | 5 | ||
| Low-level output current | IOL | 25 | mA | P07-P00, P17-P10; Tj ≤ 65°C | 5 | ||
| Low-level output current | IOL | 18 | mA | P07-P00, P17-P10; Tj ≤ 85°C | 5 | ||
| Low-level output current | IOL | 11 | mA | P07-P00, P17-P10; Tj ≤ 100°C | 5 | ||
| Low-level output current | IOL | 6 | mA | INT, SDA; Tj ≤ 85°C | 5 | ||
| Low-level output current | IOL | 3.5 | mA | INT, SDA; Tj ≤ 100°C | 5 | ||
| Operating free-air temperature | TA | -40 | 85 | °C | 5 | ||
| Supply voltage | VCC | -0.5 | 6 | V | 5 | ||
| Input voltage | VI | -0.5 | 6 | V | 5 | ||
| Output voltage | VO | -0.5 | 6 | V | 5 | ||
| Input clamp current | IIK | -20 | mA | VI < 0 | 5 | ||
| Output clamp current | IOK | -20 | mA | VO < 0 | 5 | ||
| Input-output clamp current | IIOK | -20 | 20 | mA | VO < 0 or VO > VCC | 5 | |
| Continuous output low current | IOL | 50 | mA | VO = 0 to VCC | 5 | ||
| Continuous output high current | IOH | -50 | mA | VO = 0 to VCC | 5 | ||
| Continuous current through GND | ICC | -250 | mA | Continuous current through GND | 5 | ||
| Continuous current through VCC | ICC | 160 | mA | Continuous current through VCC | 5 | ||
| Maximum junction temperature | Tj(MAX) | 100 | °C | 5 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 5 | ||
| Input diode clamp voltage | VIK | -1.2 | V | II = -18 mA, VCC 1.65 V to 5.5 V | 6 | ||
| Power-on reset voltage, VCC rising | VPORR | 1.2 | 1.5 | V | VI = VCC or GND, IO = 0; VCC 1.65 V to 5.5 V | 6 | |
| Power-on reset voltage, VCC falling | VPORF | 0.75 | 1 | V | VI = VCC or GND, IO = 0; VCC 1.65 V to 5.5 V | 6 | |
| P-port high-level output voltage | VOH | 1.2 | V | IOH = -8 mA, VCC = 1.65 V | 6 | ||
| P-port high-level output voltage | VOH | 1.8 | V | IOH = -8 mA, VCC = 2.3 V | 6 | ||
| P-port high-level output voltage | VOH | 2.6 | V | IOH = -8 mA, VCC = 3 V | 6 | ||
| P-port high-level output voltage | VOH | 4.1 | V | IOH = -8 mA, VCC = 4.75 V | 6 | ||
| P-port high-level output voltage | VOH | 1 | V | IOH = -10 mA, VCC = 1.65 V | 6 | ||
| P-port high-level output voltage | VOH | 1.7 | V | IOH = -10 mA, VCC = 2.3 V | 6 | ||
| P-port high-level output voltage | VOH | 2.5 | V | IOH = -10 mA, VCC = 3 V | 6 | ||
| P-port high-level output voltage | VOH | 4 | V | IOH = -10 mA, VCC = 4.75 V | 6 | ||
| Low-level output current SDA | IOL | 3 | mA | SDA, VOL = 0.4 V; VCC 1.65 V to 5.5 V | 6 | ||
| Low-level output current P port | IOL | 8 | mA | P port, VOL = 0.5 V; VCC 1.65 V to 5.5 V | 6 | ||
| Low-level output current P port | IOL | 10 | mA | P port, VOL = 0.7 V; VCC 1.65 V to 5.5 V | 6 | ||
| Low-level output current INT | IOL | 3 | mA | INT, VOL = 0.4 V; VCC 1.65 V to 5.5 V | 6 | ||
| Input leakage current SCL, SDA | II | -1 | 1 | µA | SCL, SDA; VI = VCC or GND | 6 | |
| Input leakage current A2-A0 | II | -1 | 1 | µA | A2-A0; VI = VCC or GND | 6 | |
| Input high leakage current | IIH | 1 | µA | P port; VI = VCC | 6 | ||
| Input low leakage current | IIL | -100 | µA | P port; VI = GND | 6 | ||
| Input capacitance | CI | 3 | 8 | pF | SCL; VI = VCC or GND | 6 | |
| Input-output pin capacitance | Cio | 3 | 9.5 | pF | SDA; VIO = VCC or GND | 6 | |
| Input-output pin capacitance | Cio | 3.7 | 9.5 | pF | P port; VIO = VCC or GND | 7 | |
| Quiescent current operating mode | ICC | 22 | 40 | µA | Operating mode, IO = 0, I/O = inputs, fSCL = 400 kHz, tr = 3 ns, No load; VCC = 5.5 V | 7 | |
| Quiescent current operating mode | ICC | 5 | 11 | µA | Operating mode, IO = 0, I/O = inputs, fSCL = 400 kHz, tr = 3 ns, No load; VCC = 1.95 V | 7 | |
| Quiescent current standby mode low inputs | ICC | 1.1 | 1.5 | mA | Standby mode, VI = GND, IO = 0, I/O = inputs, fSCL = 0 kHz, No load; VCC = 5.5 V | 7 | |
| Quiescent current standby mode low inputs | ICC | 0.3 | 0.9 | mA | Standby mode, VI = GND, IO = 0, I/O = inputs, fSCL = 0 kHz, No load; VCC = 1.95 V | 7 | |
| Quiescent current standby mode high inputs | ICC | 2.5 | 3.5 | µA | Standby mode, VI = VCC, IO = 0, I/O = inputs, fSCL = 0 kHz, No load; VCC = 5.5 V | 7 | |
| Quiescent current standby mode high inputs | ICC | 0.5 | 1 | µA | Standby mode, VI = VCC, IO = 0, I/O = inputs, fSCL = 0 kHz, No load; VCC = 1.95 V | 7 | |
| I2C clock frequency standard mode | fscl | 0 | 100 | kHz | I2C bus standard mode | 7 | |
| I2C clock frequency fast mode | fscl | 0 | 400 | kHz | I2C bus fast mode | 7 | |
| Interrupt valid time | tiv | 4 | µs | P port to INT | 8 | ||
| Output data valid | tpv | 200 | ns | SCL to P port; VCC = 2.3 V-5.5 V | 8 | ||
| Junction-to-ambient thermal resistance | RθJA | 48.4 | °C/W | RGE (VQFN) 24-pin package | 6 | ||
| Junction-to-case (top) thermal resistance | RθJC(top) | 58.1 | °C/W | RGE (VQFN) 24-pin package | 6 | ||
| Junction-to-board thermal resistance | RθJB | 27.1 | °C/W | RGE (VQFN) 24-pin package | 6 |
CAD (KiCad official)
- Symbol:
TCA9555RGER - Footprint:
Package_DFN_QFN:QFN-24-1EP_4x4mm_P0.5mm_EP2.6x2.6mm - 3D model: VQFN-24-EP(4x4) (KiCad packages3D, STEP)
- 3D model files:
tca9555rger-etched.step/tca9555rger-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);tca9555rger.step/tca9555rger.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (49 pp, sha256
9706a3ccbf0bc915, retrieved 2026-11-06, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).