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Ray Publish 0.1.0 cc30edb 23d ago

T0603HI3500TM

AEM · Disposable Fuses · 0603

T0603HI3500TM from AEM, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer AEM
Package 0603
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating temperature -55 90 °C 1
Opening time at 100% of current rating 4 hours 25°C ambient, 100% of current rating 1
Opening time at 200% of current rating 1 60 seconds 25°C ambient, 200% of current rating 1
Opening time at 1000% of current rating 0.0002 0.02 second 25°C ambient, 1000% of current rating 1
Interrupting rating 35 A 35A@35V DC/AC 1
Voltage rating 35 VDC 1
Solderability, coverage 95 % One dip at 255℃ for 5 seconds, MIL-STD-202 Method 208 4
Bending, DCR change (>1A) 20 % 2mm, refer to AEM QIQ034; applies to >1A parts 4
Thermal shock, DCR change -10 10 % 100 cycles between -55°C and +125°C, MIL-STD-202 Method 107 4
Moisture resistance, DCR change -10 10 % 10 cycles, MIL-STD-202 Method 106 4
Salt spray, DCR change -10 10 % 5% salt solution, 48 hour exposure, MIL-STD-202 Method 101 4
Mechanical vibration, DCR change -10 10 % 0.4” D.A. or 30G between 5 and 3000 Hz, MIL-STD-202 Method 204 4
Mechanical shock, DCR change -10 10 % 1500G, 0.5 ms, half sine shocks, MIL-STD-202 Method 213 4
Life, change of voltage drop -10 10 % 75% rated current, 2000 hours, ambient temperature +20°C to 30°C 4
Preheat/soak temperature Tsmin, Tsmax 150 200 °C Pb-free assembly 5
Preheat/soak time (Tsmin to Tsmax) ts 60 120 seconds From Tsmin to Tsmax 5
Ramp-up rate (TL to Tp) 3 °C/second 5
Time tL maintained above TL tL 60 150 seconds Above liquidous temperature TL 5
Peak package body temperature Tp 260 °C Pb-free reflow profile 5
Ramp-down rate (Tp to TL) 6 °C/second 5
Time from 25°C to peak temperature 8 minutes 5
Soldering iron tip temperature 350 °C Manual correction with soldering iron 5
Soldering iron contact time 3 seconds Manual correction with soldering iron 5
Liquidous temperature TL 217 °C Pb-free reflow profile 5
Time tp within 5°C of classification temperature Tc tp 30 seconds Within 5°C of specified classification temperature Tc 5
Current rating 3.5 A T0603HI3500TM rated current 1
Nominal cold DCR 0.012 Ω Measured at ≤10% of rated current and 25˚C ambient 1
Nominal I2t 0.8 A2s Melting I2t at 0.001 sec 1

CAD (KiCad official)

  • Symbol: T0603HI3500TM
  • Footprint: Fuse:Fuse_0603_1608Metric
  • 3D model: 0603 (KiCad packages3D, STEP)
  • 3D model files: t0603hi3500tm-etched.step / t0603hi3500tm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); t0603hi3500tm.step / t0603hi3500tm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: AEM datasheet (6 pp, sha256 0bbf9d2391bc434d, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF